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TPS65951

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Integrierter Power-Management-IC (PMIC)-Audiocodec – Silicon

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TPS65951

AKTIV
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Produktdetails

Regulated outputs (#) 14 Configurability Factory programmable Vin (min) (V) 2.7 Vin (max) (V) 5.5 Vout (min) (V) 0.6 Vout (max) (V) 3.15 Iout (max) (A) 1.4 Features Comm control, Power sequencing TI functional safety category Functional Safety-Capable Step-up DC/DC converter 0 Step-down DC/DC converter 3 Step-down DC/DC controller 0 Step-up DC/DC controller 0 LDO 11 Iq (typ) (mA) 0.03 Rating Catalog Operating temperature range (°C) -40 to 85 Processor supplier Texas Instruments Processor name OMAP Switching frequency (typ) (kHz) 3200 Product type Processor and FPGA
Regulated outputs (#) 14 Configurability Factory programmable Vin (min) (V) 2.7 Vin (max) (V) 5.5 Vout (min) (V) 0.6 Vout (max) (V) 3.15 Iout (max) (A) 1.4 Features Comm control, Power sequencing TI functional safety category Functional Safety-Capable Step-up DC/DC converter 0 Step-down DC/DC converter 3 Step-down DC/DC controller 0 Step-up DC/DC controller 0 LDO 11 Iq (typ) (mA) 0.03 Rating Catalog Operating temperature range (°C) -40 to 85 Processor supplier Texas Instruments Processor name OMAP Switching frequency (typ) (kHz) 3200 Product type Processor and FPGA
NFBGA (ZWS) 169 144 mm² 12 x 12
  • Power:
    • Three Efficient Step-down Converters
    • 10 External Linear LDOs for Clocks and Peripherals
    • SmartReflex Dynamic Voltage Management
  • Audio:
    • Voice Codec
    • 15-Bit Linear Codec (8 and 16 kHz)
    • Differential Input Main and Submicrophones
    • Differential Headset Microphone Input
    • Auxiliary/FM Input (Mono or Stereo)
    • Differential 32-Ω Speaker and 16-Ω Headset Drivers (External Predrivers for Class D)
    • 8-Ω Stereo Class-D Drivers
    • Pulse Code Modulation (PCM) and TDM Interfaces
    • Interface
    • Automatic Level Control (ALC)
    • Digital and Analog Mixing
    • 16-Bit Linear Audio Stereo DAC (96, 48, 44.1, and 32 kHz, and Derivatives)
    • 16-Bit Linear Audio Stereo ADC (48, 44.1, and 32 kHz, and Derivatives)
    • Carkit
  • Charger:
    • Li-ion, Li-on Polymer, and Cobalt-Nickel-Manganese Charger
    • Backup Battery Charger
  • USB:
    • USB 2.0 OTG-Compliant HS Transceivers
    • 12-Bit ULPI
    • USB Power Supply (5-V CP for VBUS)
    • CEA-2011: OTG Transceiver Interface Specification
    • CEA-936A: Mini-USB Analog Carkit Interface Specification
  • Additional Features:
    • LED Driver Circuit for Two External LEDs
    • RTC and Retention Modules
    • HS Inter-Integrated Circuit (I2C) Serial Control
    • Thermal Shutdown and Hot-Die Detection
    • External Vibrator (Vibrator) Control
    • 19 GPIO Devices
    • 0.8-mm Pitch, 169-Pin, 12-mm × 12-mm Package
  • Power:
    • Three Efficient Step-down Converters
    • 10 External Linear LDOs for Clocks and Peripherals
    • SmartReflex Dynamic Voltage Management
  • Audio:
    • Voice Codec
    • 15-Bit Linear Codec (8 and 16 kHz)
    • Differential Input Main and Submicrophones
    • Differential Headset Microphone Input
    • Auxiliary/FM Input (Mono or Stereo)
    • Differential 32-Ω Speaker and 16-Ω Headset Drivers (External Predrivers for Class D)
    • 8-Ω Stereo Class-D Drivers
    • Pulse Code Modulation (PCM) and TDM Interfaces
    • Interface
    • Automatic Level Control (ALC)
    • Digital and Analog Mixing
    • 16-Bit Linear Audio Stereo DAC (96, 48, 44.1, and 32 kHz, and Derivatives)
    • 16-Bit Linear Audio Stereo ADC (48, 44.1, and 32 kHz, and Derivatives)
    • Carkit
  • Charger:
    • Li-ion, Li-on Polymer, and Cobalt-Nickel-Manganese Charger
    • Backup Battery Charger
  • USB:
    • USB 2.0 OTG-Compliant HS Transceivers
    • 12-Bit ULPI
    • USB Power Supply (5-V CP for VBUS)
    • CEA-2011: OTG Transceiver Interface Specification
    • CEA-936A: Mini-USB Analog Carkit Interface Specification
  • Additional Features:
    • LED Driver Circuit for Two External LEDs
    • RTC and Retention Modules
    • HS Inter-Integrated Circuit (I2C) Serial Control
    • Thermal Shutdown and Hot-Die Detection
    • External Vibrator (Vibrator) Control
    • 19 GPIO Devices
    • 0.8-mm Pitch, 169-Pin, 12-mm × 12-mm Package

The TPS65951 device is a power-management IC for mobile cellular handsets powered by a Li-ion, Li-ion polymer, or cobalt-nickel-manganese cell battery. The device can be connected to an application processor and/or a modem. This optimized power-management IC is designed to support the specific power requirements of the OMAP processor devices. The TPS65951 contains several buck converters, low dropout (LDO) regulators, a battery charger interface, and a host of other features and functions. The audio portion of the TPS65951 is an entire audio module with audio codecs, digital filters, input preamplifiers and amplifiers, and class-D output amplifiers.

This TPS65951 Data Manual presents the electrical and mechanical specifications for the TPS65951 device.

The TPS65951 device is a power-management IC for mobile cellular handsets powered by a Li-ion, Li-ion polymer, or cobalt-nickel-manganese cell battery. The device can be connected to an application processor and/or a modem. This optimized power-management IC is designed to support the specific power requirements of the OMAP processor devices. The TPS65951 contains several buck converters, low dropout (LDO) regulators, a battery charger interface, and a host of other features and functions. The audio portion of the TPS65951 is an entire audio module with audio codecs, digital filters, input preamplifiers and amplifiers, and class-D output amplifiers.

This TPS65951 Data Manual presents the electrical and mechanical specifications for the TPS65951 device.
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Technische Dokumentation

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Alle anzeigen 5
Typ Titel Datum
* Data sheet TPS65951 Integrated Power Management/Audio Codec Silicon Revision 1.0 DM datasheet (Rev. G) 29 Sep 2014
* Errata TPS65951 Silicon Errata 20 Sep 2010
User guide IPM MicroStar BGA Discontinued and Redesigned 03 Nov 2020
Selection guide Power Management Guide 2018 (Rev. R) 25 Jun 2018
Application note Feature Differences between TPS65950 and TPS65951 01 Sep 2010

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Simulationsmodell

TPS65951 BSDL Models

SWCC011.ZIP (3 KB) - BSDL Model
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NFBGA (ZWS) 169 Optionen anzeigen
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Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

Support und Schulungen

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