Startseite Energiemanagement Gate-Treiber Low-Side-Treiber

UC2706M

AKTIV

Zweikanal-Gate-Treiber für Militärqualität 1,5 A/1,5 A mit 40 V VDD und Dual-Eingang

Produktdetails

Number of channels 2 Power switch IGBT, MOSFET Peak output current (A) 1.5 Input supply voltage (min) (V) 5 Input supply voltage (max) (V) 40 Features Analog Shutdown with Latch, Inhibit Circuit, Thermal shutdown Operating temperature range (°C) -40 to 85 Rise time (ns) 40 Fall time (ns) 40 Propagation delay time (µs) 0.1 Input threshold TTL Channel input logic Inverting, Non-Inverting Input negative voltage (V) 0 Rating Military Driver configuration Dual
Number of channels 2 Power switch IGBT, MOSFET Peak output current (A) 1.5 Input supply voltage (min) (V) 5 Input supply voltage (max) (V) 40 Features Analog Shutdown with Latch, Inhibit Circuit, Thermal shutdown Operating temperature range (°C) -40 to 85 Rise time (ns) 40 Fall time (ns) 40 Propagation delay time (µs) 0.1 Input threshold TTL Channel input logic Inverting, Non-Inverting Input negative voltage (V) 0 Rating Military Driver configuration Dual
CDIP (J) 16 135.3552 mm² 19.56 x 6.92
  • Dual, 1.5A Totem Pole Outputs
  • 40nsec Rise and Fall into 1000pF
  • Parallel or Push-Pull Operation
  • Single-Ended to Push-Pull Conversion
  • High-Speed, Power MOSFET Compatible
  • Low Cross-Conduction Current Spike
  • Analog, Latched Shutdown
  • Internal Deadband Inhibit Circuit
  • Low Quiescent Current
  • 5 to 40V Operation
  • Thermal Shutdown Protection
  • 16-Pin Dual-In-Line Package
  • 20-Pin Surface Mount Package
  • Dual, 1.5A Totem Pole Outputs
  • 40nsec Rise and Fall into 1000pF
  • Parallel or Push-Pull Operation
  • Single-Ended to Push-Pull Conversion
  • High-Speed, Power MOSFET Compatible
  • Low Cross-Conduction Current Spike
  • Analog, Latched Shutdown
  • Internal Deadband Inhibit Circuit
  • Low Quiescent Current
  • 5 to 40V Operation
  • Thermal Shutdown Protection
  • 16-Pin Dual-In-Line Package
  • 20-Pin Surface Mount Package

The UC1706 family of output drivers are made with a high-speed Schottky process to interface between low-level control functions and high-power switching devices - particularly power MOSFET's. These devices implement three generalized functions as outlined below.

First: They accept a single-ended, low-current digital input of either polarity and process it to activate a pair of high-current, totem pole outputs which can source or sink up to 1.5A each.

Second: They provide an optional single-ended to push-pull conversion through the use of an internal flip-flop driven by double-pulse-suppression logic. With the flip-flop disabled, the outputs work in parallel for 3.0A capability.

Third: Protection functions are also included for pulse-by-pulse current limiting, automatic deadband control, and thermal shutdown.

These devices are available in a two-watt plastic "bat-wing" DIP for operation over a 0°C to 70°C temperature range and, with reduced power, in a hermetically sealed cerdip for -55°C to +125°C operation. Also available in surface mount Q and L packages.

The UC1706 family of output drivers are made with a high-speed Schottky process to interface between low-level control functions and high-power switching devices - particularly power MOSFET's. These devices implement three generalized functions as outlined below.

First: They accept a single-ended, low-current digital input of either polarity and process it to activate a pair of high-current, totem pole outputs which can source or sink up to 1.5A each.

Second: They provide an optional single-ended to push-pull conversion through the use of an internal flip-flop driven by double-pulse-suppression logic. With the flip-flop disabled, the outputs work in parallel for 3.0A capability.

Third: Protection functions are also included for pulse-by-pulse current limiting, automatic deadband control, and thermal shutdown.

These devices are available in a two-watt plastic "bat-wing" DIP for operation over a 0°C to 70°C temperature range and, with reduced power, in a hermetically sealed cerdip for -55°C to +125°C operation. Also available in surface mount Q and L packages.

Herunterladen Video mit Transkript ansehen Video

Technische Dokumentation

star =Von TI ausgewählte Top-Empfehlungen für dieses Produkt
Keine Ergebnisse gefunden. Bitte geben Sie einen anderen Begriff ein und versuchen Sie es erneut.
Alle anzeigen 6
Typ Titel Datum
* Data sheet Dual Output Driver datasheet (Rev. A) 02 Mai 2001
Application brief External Gate Resistor Selection Guide (Rev. A) 28 Feb 2020
Application brief Understanding Peak IOH and IOL Currents (Rev. A) 28 Feb 2020
More literature Fundamentals of MOSFET and IGBT Gate Driver Circuits (Replaces SLUP169) (Rev. A) 29 Okt 2018
Application note U-118 New Driver ICs Optimize High-Speed Power MOSFET Switching Characteristics 05 Sep 1999
Application note U-137 Practical Considerations in High Performance MOSFET, IGBT and MCT Gate 05 Sep 1999

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Simulationstool

PSPICE-FOR-TI — PSpice® für TI Design-und Simulationstool

PSpice® für TI ist eine Design- und Simulationsumgebung, welche Sie dabei unterstützt, die Funktionalität analoger Schaltungen zu evaluieren. Diese voll ausgestattete Design- und Simulationssuite verwendet eine analoge Analyse-Engine von Cadence®. PSpice für TI ist kostenlos erhältlich und (...)
Gehäuse Pins Herunterladen
CDIP (J) 16 Optionen anzeigen

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

Support und Schulungen

TI E2E™-Foren mit technischem Support von TI-Ingenieuren

Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.

Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support. ​​​​​​​​​​​​​​

Videos