SLVSIN3 May   2025 ADS9117 , ADS9118 , ADS9119

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Thermal Information
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements
    7. 6.7  Switching Characteristics
    8. 6.8  Timing Diagrams
    9. 6.9  Typical Characteristics: All Devices
    10. 6.10 Typical Characteristics: ADS9119
    11. 6.11 Typical Characteristics: ADS9118
    12. 6.12 Typical Characteristics: ADS9117
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Inputs
      2. 7.3.2 Analog Input Bandwidth
      3. 7.3.3 ADC Transfer Function
      4. 7.3.4 Reference Voltage
      5. 7.3.5 Temperature Sensor
      6. 7.3.6 Data Averaging
      7. 7.3.7 Digital Down Converter
      8. 7.3.8 Data Interface
        1. 7.3.8.1 Data Frame Width
        2. 7.3.8.2 ADC Output Data Randomizer
        3. 7.3.8.3 Synchronizing Multiple ADCs
        4. 7.3.8.4 Test Patterns for Data Interface
          1. 7.3.8.4.1 Fixed Pattern
          2. 7.3.8.4.2 Alternating Test Pattern
          3. 7.3.8.4.3 Digital Ramp
      9. 7.3.9 ADC Sampling Clock Input
    4. 7.4 Device Functional Modes
      1. 7.4.1 Reset
      2. 7.4.2 Power-Down Options
      3. 7.4.3 Normal Operation
      4. 7.4.4 Initialization Sequence
    5. 7.5 Programming
      1. 7.5.1 Register Write
      2. 7.5.2 Register Read
      3. 7.5.3 Multiple Devices: Daisy-Chain Topology for SPI Configuration
        1. 7.5.3.1 Register Write With Daisy-Chain
        2. 7.5.3.2 Register Read With Daisy-Chain
  9. 8 Register Map
    1. 8.1 Register Bank 0
    2. 8.2 Register Bank 1
    3. 8.3 Register Bank 2
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Data Acquisition (DAQ) Circuit for a ≤20kHz Input Signal Bandwidth
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Data Acquisition (DAQ) Circuit for a ≤100kHz Input Signal Bandwidth
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Application Curves
      3. 9.2.3 Data Acquisition (DAQ) Circuit for a ≤1MHz Input Signal Bandwidth
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Mechanical Data

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, analog input pins AINP and AINM(1) ±2000 V
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all other pins(1) ±1000
Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002, all pins(2) ±500
(1) JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.