SLUSFQ0C November   2024  – September 2025 BQ27Z758

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configurations and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
      1. 5.5.1 Supply Current
      2. 5.5.2 Common Analog (LDO, LFO, HFO, REF1, REF2, I-WAKE)
      3. 5.5.3 Battery Protection (CHG, DSG)
      4. 5.5.4 Cell Sensing Output (BAT_SP, BAT_SN)
      5. 5.5.5 Gauge Measurements (ADC, CC, Temperature)
      6. 5.5.6 Flash Memory
    6. 5.6 Digital I/O: DC Characteristics
    7. 5.7 Digital I/O: Timing Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  BQ27Z758 Processor
      2. 6.3.2  Battery Parameter Measurements
        1. 6.3.2.1 Coulomb Counter (CC) and Digital Filter
        2. 6.3.2.2 ADC Multiplexer
        3. 6.3.2.3 Analog-to-Digital Converter (ADC)
        4. 6.3.2.4 Internal Temperature Sensor
        5. 6.3.2.5 External Temperature Sensor Support
      3. 6.3.3  Power Supply Control
      4. 6.3.4  ENAB Pin
      5. 6.3.5  Bus Communication Interface
      6. 6.3.6  Low Frequency Oscillator
      7. 6.3.7  High Frequency Oscillator
      8. 6.3.8  1.8V Low Dropout Regulator
      9. 6.3.9  Internal Voltage References
      10. 6.3.10 Overcurrent in Discharge Protection
      11. 6.3.11 Overcurrent in Charge Protection
      12. 6.3.12 Short-Circuit Current in Discharge Protection
      13. 6.3.13 Primary Protection Features
      14. 6.3.14 Battery Sensing
      15. 6.3.15 Gas Gauging
      16. 6.3.16 Zero Volt Charging (ZVCHG)
      17. 6.3.17 Charge Control Features
      18. 6.3.18 Authentication
    4. 6.4 Device Functional Modes
      1. 6.4.1 Lifetime Logging Features
      2. 6.4.2 Configuration
        1. 6.4.2.1 Coulomb Counting
        2. 6.4.2.2 Cell Voltage Measurements
        3. 6.4.2.3 Auto Calibration
        4. 6.4.2.4 Temperature Measurements
  8. 7 Applications and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Design Requirements (Default)
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Changing Design Parameters
      3. 7.2.3 Calibration Process
      4. 7.2.4 Gauging Data Updates
        1. 7.2.4.1 Application Curve
      5. 7.2.5 ESD Mitigation
    3. 7.3 Power Supply Requirements
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Third-Party Products Disclaimer
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Orderable, and Packaging Information
    1.     PACKAGE OPTION ADDENDUM
    2. 10.1 Tape and Reel Information
    3. 10.2 Mechanical Data

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YAH|15
Thermal pad, mechanical data (Package|Pins)

5.4 Thermal Information

Over-operating free-air temperature range (unless otherwise noted)
THERMAL METRIC(1)YAH (DSBGA)UNIT
(15 PINS)
RθJAJunction-to-ambient thermal resistance70°C/W
RθJC(top)Junction-to-case (top) thermal resistance17
RθJBJunction-to-board thermal resistance20
ψJTJunction-to-top characterization parameter1
ψJBJunction-to-board characterization parameter18
RθJC(bot)Junction-to-case (bottom) thermal resistanceNA
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.