SWRS272C april   2023  – june 2023 CC2340R5

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Revision History
  7. 6 Device Comparison
  8. 7 Pin Configuration and Functions
    1. 7.1 Pin Diagram – RKP Package (Top View)
    2. 7.2 Signal Descriptions – RKP Package
    3. 7.3 Connections for Unused Pins and Modules – RKP Package
    4. 7.4 Pin Diagram – RGE Package (Top View)
    5. 7.5 Signal Descriptions – RGE Package
    6. 7.6 Connections for Unused Pins and Modules – RGE Package
    7. 7.7 RKP and RGE Peripheral Pin Mapping
    8. 7.8 RKP and RGE Peripheral Signal Descriptions
  9. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  DCDC
    5. 8.5  Global LDO (GLDO)
    6. 8.6  Power Supply and Modules
    7. 8.7  Battery Monitor
    8. 8.8  Temperature Sensor
    9. 8.9  Power Consumption - Power Modes
    10. 8.10 Power Consumption - Radio Modes
    11. 8.11 Nonvolatile (Flash) Memory Characteristics
    12. 8.12 Thermal Resistance Characteristics
    13. 8.13 RF Frequency Bands
    14. 8.14 Bluetooth Low Energy - Receive (RX)
    15. 8.15 Bluetooth Low Energy - Transmit (TX)
    16. 8.16 Proprietary Radio Modes
    17. 8.17 2.4 GHz RX/TX CW
    18. 8.18 Timing and Switching Characteristics
      1. 8.18.1 Reset Timing
      2. 8.18.2 Wakeup Timing
      3. 8.18.3 Clock Specifications
        1. 8.18.3.1 48 MHz Crystal Oscillator (HFXT)
        2. 8.18.3.2 48 MHz RC Oscillator (HFOSC)
        3. 8.18.3.3 32 kHz Crystal Oscillator (LFXT)
        4. 8.18.3.4 32 kHz RC Oscillator (LFOSC)
    19. 8.19 Peripheral Characteristics
      1. 8.19.1 UART
        1. 8.19.1.1 UART Characteristics
      2. 8.19.2 SPI
        1. 8.19.2.1 SPI Characteristics
        2. 8.19.2.2 SPI Controller Mode
        3. 8.19.2.3 SPI Timing Diagrams - Controller Mode
        4. 8.19.2.4 SPI Peripheral Mode
        5. 8.19.2.5 SPI Timing Diagrams - Peripheral Mode
      3. 8.19.3 I2C
        1. 8.19.3.1 I2C
        2. 8.19.3.2 I2C Timing Diagram
      4. 8.19.4 GPIO
        1. 8.19.4.1 GPIO DC Characteristics
      5. 8.19.5 ADC
        1. 8.19.5.1 Analog-to-Digital Converter (ADC) Characteristics
      6. 8.19.6 Comparators
        1. 8.19.6.1 Ultra-low power comparator
  10. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  System CPU
    3. 9.3  Radio (RF Core)
      1. 9.3.1 Bluetooth 5.3 Low Energy
      2. 9.3.2 802.15.4 (Thread and Zigbee)
    4. 9.4  Memory
    5. 9.5  Cryptography
    6. 9.6  Timers
    7. 9.7  Serial Peripherals and I/O
    8. 9.8  Battery and Temperature Monitor
    9. 9.9  µDMA
    10. 9.10 Debug
    11. 9.11 Power Management
    12. 9.12 Clock Systems
    13. 9.13 Network Processor
  11. 10Application, Implementation, and Layout
    1. 10.1 Reference Designs
    2. 10.2 Junction Temperature Calculation
  12. 11Device and Documentation Support
    1. 11.1 Device Nomenclature
    2. 11.2 Tools and Software
      1. 11.2.1 SimpleLink™ Microcontroller Platform
    3. 11.3 Documentation Support
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.2 Signal Descriptions – RKP Package

Table 7-1 Signal Descriptions – RKP Package
PIN I/O TYPE DESCRIPTION
NAME NO.
EGP — — GND Ground – exposed ground pad(1)
VDDR 1 — Power Internal supply, must be powered from the internal DC/DC converter or the internal LDO(2)(3)(4)
DIO8 2 I/O Digital GPIO
DIO9 3 I/O Digital GPIO
DIO10 4 I/O Digital GPIO
DIO11 5 I/O Digital GPIO
DIO12 6 I/O Digital GPIO, high-drive capability
DIO13 7 I/O Digital GPIO
VDDS 8 — Power 1.71-V to 3.8-V DIO supply(5)
DIO14 9 I/O Digital GPIO
DIO15 10 I/O Digital GPIO
DIO16_SWDIO 11 I/O Digital GPIO, SWD interface: mode select or SWDIO, high-drive capability
DIO17_SWDCK 12 I/O Digital GPIO, SWD interface: clock, high-drive capability
DIO18 13 I/O Digital GPIO, high-drive capability
DIO19 14 I/O Digital GPIO, high-drive capability
DIO20_A11 15 I/O Digital or Analog GPIO, analog capability
DIO21_A10 16 I/O Digital or Analog GPIO, analog capability
VDDS 17 — Power 1.71-V to 3.8-V DIO supply(5)
DIO22_A9 18 I/O Digital or Analog GPIO, analog capability
DIO23_A8 19 I/O Digital or Analog GPIO, analog capability
DIO24_A7 20 I/O Digital or Analog GPIO, Analog capability, high-drive capability
DIO25_A6 21 I/O Digital or Analog GPIO, analog capability
DIO0_A5 22 I/O Digital or Analog GPIO, analog capability
DIO1_A4 23 I/O Digital or Analog GPIO, analog capability
DIO2_A3 24 I/O Digital or Analog GPIO, analog capability
RSTN 25 I Digital Reset, active low. No internal pullup resistor
DIO3_X32P 26 I/O Digital or Analog GPIO, 32-kHz crystal oscillator pin 1, Optional TCXO input
DIO4_X32N 27 I/O Digital or Analog GPIO, 32-kHz crystal oscillator pin 2
VDDD 28 — Power For decoupling of internal 1.28-V regulated core-supply. Connect an external 1 μF decoupling capacitor.(2)
DIO5_A2 29 I/O Digital or Analog GPIO, analog capability
DCDC 30 — Power Switching node of internal DC/DC converter(5)
VDDS 31 — Power 1.71-V to 3.8-V analog supply(5)
DIO6_A1 32 I/O Digital or Analog GPIO, analog capability
DIO7_A0 33 I/O Digital or Analog GPIO, analog capability
VDDR 34 — Power Internal supply, must be powered from the internal DC/DC converter or the internal LDO. Connect an external 10 μF decoupling capacitor.(2)(3)(4)
X48P 35 — Analog 48-MHz crystal oscillator pin 1
X48N 36 — Analog 48-MHz crystal oscillator pin 2
NC 37 — — No Connect
VDDS 38 — Power 1.71-V to 3.8-V analog supply(5)
ANT 39 I/O RF 2.4 GHz TX, RX
RFGND 40 — RFGND RF Ground
(1) EGP is the only non-RF ground connection for the device. Good electrical connection to PCB ground plane is required for proper device operation.
(2) Do not supply external circuitry from this pin.
(3) VDDR pins 1 and 34 must be tied together on the PCB.
(4) Output from internal DC/DC and LDO is trimmed to 1.5 V.
(5) For more details, see the technical reference manual listed in Section 11.3.