SWRS215D April   2019  – May 2021 CC3235S , CC3235SF

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Functional Block Diagrams
  5. Revision History
  6. Device Comparison
    1. 6.1 Related Products
  7. Terminal Configuration and Functions
    1. 7.1 Pin Diagram
    2. 7.2 Pin Attributes
      1.     
    3. 7.3 Signal Descriptions
      1.     
    4. 7.4 Pin Multiplexing
    5. 7.5 Drive Strength and Reset States for Analog and Digital Multiplexed Pins
    6. 7.6 Pad State After Application of Power to Device, Before Reset Release
    7. 7.7 Connections for Unused Pins
  8. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Power-On Hours (POH)
    4. 8.4  Recommended Operating Conditions
    5. 8.5  Current Consumption Summary (CC3235S)
      1.     
      2.     
    6. 8.6  Current Consumption Summary (CC3235SF)
      1.     
      2.     
    7. 8.7  TX Power Control for 2.4 GHz Band
    8. 8.8  TX Power Control for 5 GHz
    9. 8.9  Brownout and Blackout Conditions
    10. 8.10 Electrical Characteristics for GPIO Pins
      1.     
      2.     
    11. 8.11 Electrical Characteristics for Pin Internal Pullup and Pulldown
    12. 8.12 WLAN Receiver Characteristics
      1.     
      2.     
    13. 8.13 WLAN Transmitter Characteristics
      1.     
      2.     
    14. 8.14 WLAN Transmitter Out-of-Band Emissions
      1.     
      2.     
    15. 8.15 BLE/2.4 GHz Radio Coexistence and WLAN Coexistence Requirements
    16. 8.16 Thermal Resistance Characteristics for RGK Package
    17. 8.17 Timing and Switching Characteristics
      1. 8.17.1 Power Supply Sequencing
      2. 8.17.2 Device Reset
      3. 8.17.3 Reset Timing
        1. 8.17.3.1 nRESET (32-kHz Crystal)
        2.      
        3.      
        4. 8.17.3.2 nRESET (External 32-kHz Clock)
          1.       
      4. 8.17.4 Wakeup From HIBERNATE Mode
      5. 8.17.5 Clock Specifications
        1. 8.17.5.1 Slow Clock Using Internal Oscillator
        2. 8.17.5.2 Slow Clock Using an External Clock
          1.       
        3. 8.17.5.3 Fast Clock (Fref) Using an External Crystal
          1.       
        4. 8.17.5.4 Fast Clock (Fref) Using an External Oscillator
          1.       
      6. 8.17.6 Peripherals Timing
        1. 8.17.6.1  SPI
          1. 8.17.6.1.1 SPI Master
            1.        
          2. 8.17.6.1.2 SPI Slave
            1.        
        2. 8.17.6.2  I2S
          1. 8.17.6.2.1 I2S Transmit Mode
            1.        
          2. 8.17.6.2.2 I2S Receive Mode
            1.        
        3. 8.17.6.3  GPIOs
          1. 8.17.6.3.1 GPIO Output Transition Time Parameters (Vsupply = 3.3 V)
            1.        
          2. 8.17.6.3.2 GPIO Input Transition Time Parameters
            1.        
        4. 8.17.6.4  I2C
          1.       
        5. 8.17.6.5  IEEE 1149.1 JTAG
          1.       
        6. 8.17.6.6  ADC
          1.       
        7. 8.17.6.7  Camera Parallel Port
          1.       
        8. 8.17.6.8  UART
        9. 8.17.6.9  SD Host
        10. 8.17.6.10 Timers
  9. Detailed Description
    1. 9.1  Overview
    2. 9.2  Arm® Cortex®-M4 Processor Core Subsystem
    3. 9.3  Wi-Fi® Network Processor Subsystem
      1. 9.3.1 WLAN
      2. 9.3.2 Network Stack
    4. 9.4  Security
    5. 9.5  FIPS 140-2 Level 1 Certification
    6. 9.6  Power-Management Subsystem
    7. 9.7  Low-Power Operating Mode
    8. 9.8  Memory
      1. 9.8.1 External Memory Requirements
      2. 9.8.2 Internal Memory
        1. 9.8.2.1 SRAM
        2. 9.8.2.2 ROM
        3. 9.8.2.3 Flash Memory
        4. 9.8.2.4 Memory Map
    9. 9.9  Restoring Factory Default Configuration
    10. 9.10 Boot Modes
      1. 9.10.1 Boot Mode List
    11. 9.11 Hostless Mode
  10. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
      1. 10.1.1 BLE/2.4 GHz Radio Coexistence
      2. 10.1.2 Antenna Selection
      3. 10.1.3 Typical Application
    2. 10.2 PCB Layout Guidelines
      1. 10.2.1 General PCB Guidelines
      2. 10.2.2 Power Layout and Routing
        1. 10.2.2.1 Design Considerations
      3. 10.2.3 Clock Interface Guidelines
      4. 10.2.4 Digital Input and Output Guidelines
      5. 10.2.5 RF Interface Guidelines
  11. 11Device and Documentation Support
    1. 11.1  Third-Party Products Disclaimer
    2. 11.2  Tools and Software
    3. 11.3  Firmware Updates
    4. 11.4  Device Nomenclature
    5. 11.5  Documentation Support
    6. 11.6  Related Links
    7. 11.7  Support Resources
    8. 11.8  Trademarks
    9. 11.9  Electrostatic Discharge Caution
    10. 11.10 Export Control Notice
    11. 11.11 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information
      1. 12.1.1 Package Option Addendum
        1. 12.1.1.1 Packaging Information
        2. 12.1.1.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • Multiple-core architecture, system-on-chip (SoC)
  • 802.11 a/b/g/n: 2.4 GHz and 5 GHz
  • FIPS 140-2 Level 1 Certification
  • Multilayered security features, help developers protect identities, data, and software IP
  • Low-Power Modes for battery powered application
  • Coexistence with 2.4 GHz Radios
  • Industrial temperature: –40°C to +85°C
  • Wi-Fi CERTIFIED® by the Wi-Fi Alliance®
  • Application microcontroller subsystem:
    • Arm®Cortex®-M4 core at 80 MHz
    • User-dedicated memory
      • 256KB RAM
      • Optional 1MB executable Flash
    • Rich set of peripherals and timers
    • 27 I/O pins with flexible multiplexing options
      • UART, I2S, I2C, SPI, SD, ADC,
        8-bit parallel interface
      • Timers and PWM
  • Wi-Fi network processor subsystem:
    • Wi-Fi® core:
      • 802.11 a/b/g/n 2.4 GHz and 5 GHz
      • Modes:
        • Access Point (AP)
        • Station (STA)
        • Wi-Fi Direct® (only supported on 2.4 GHz)
      • Security:
        • WEP
        • WPA™/ WPA2™ PSK
        • WPA2 Enterprise
        • WPA3™ Personal
        • WPA3™ Enterprise
    • Internet and application protocols:
      • HTTPs server, mDNS, DNS-SD, DHCP
      • IPv4 and IPv6 TCP/IP stack
      • 16 BSD sockets (fully secured TLS v1.2 and SSL 3.0)
    • Built-in power management subsystem:
      • Configurable low-power profiles (always, intermittent, tag)
      • Advanced low-power modes
      • Integrated DC/DC regulators
  • Multilayered security features:
    • Separate execution environments
    • Networking security
    • Device identity and key
    • Hardware accelerator cryptographic engines (AES, DES, SHA/MD5, CRC)
    • Application-level security (encryption, authentication, access control)
    • Initial secure programming
    • Software tamper detection
    • Secure boot
    • Certificate signing request (CSR)
    • Unique per device key pair
  • Application throughput:
    • UDP: 16 Mbps, TCP: 13 Mbps
    • Peak: 72 Mbps
  • Power-Management Subsystem:
    • Integrated DC/DC converters support a wide range of supply voltage:
      • VBAT wide-voltage mode: 2.1 V to 3.6 V
      • VIO is always tied with VBAT
    • Advanced low-power modes:
      • Shutdown: 1 µA, hibernate: 4.5 µA
      • Low-power deep sleep (LPDS): 120 µA
      • Idle connected (MCU in LPDS): 710 µA
      • RX traffic (MCU active): 59 mA
      • TX traffic (MCU active): 223 mA
  • Wi-Fi TX power:
    • 2.4 GHz: 18.0 dBm at 1 DSSS
    • 5 GHz: 18.1 dBm at 6 OFDM
  • Wi-Fi RX sensitivity:
    • 2.4 GHz: –96 dBm at 1 DSSS
    • 5 GHz: –92 dBm at 6 OFDM
  • Clock source:
    • 40.0-MHz crystal with internal oscillator
    • 32.768-kHz crystal or external RTC
  • RGK package
    • 64-Pin, 9-mm × 9-mm very thin quad flat nonleaded (VQFN) package, 0.5-mm pitch
  • Device supports SimpleLink™ MCU Platform Developer's Ecosystem