SWRS215D April   2019  – May 2021 CC3235S , CC3235SF

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Functional Block Diagrams
  5. Revision History
  6. Device Comparison
    1. 6.1 Related Products
  7. Terminal Configuration and Functions
    1. 7.1 Pin Diagram
    2. 7.2 Pin Attributes
      1.     
    3. 7.3 Signal Descriptions
      1.     
    4. 7.4 Pin Multiplexing
    5. 7.5 Drive Strength and Reset States for Analog and Digital Multiplexed Pins
    6. 7.6 Pad State After Application of Power to Device, Before Reset Release
    7. 7.7 Connections for Unused Pins
  8. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Power-On Hours (POH)
    4. 8.4  Recommended Operating Conditions
    5. 8.5  Current Consumption Summary (CC3235S)
      1.     
      2.     
    6. 8.6  Current Consumption Summary (CC3235SF)
      1.     
      2.     
    7. 8.7  TX Power Control for 2.4 GHz Band
    8. 8.8  TX Power Control for 5 GHz
    9. 8.9  Brownout and Blackout Conditions
    10. 8.10 Electrical Characteristics for GPIO Pins
      1.     
      2.     
    11. 8.11 Electrical Characteristics for Pin Internal Pullup and Pulldown
    12. 8.12 WLAN Receiver Characteristics
      1.     
      2.     
    13. 8.13 WLAN Transmitter Characteristics
      1.     
      2.     
    14. 8.14 WLAN Transmitter Out-of-Band Emissions
      1.     
      2.     
    15. 8.15 BLE/2.4 GHz Radio Coexistence and WLAN Coexistence Requirements
    16. 8.16 Thermal Resistance Characteristics for RGK Package
    17. 8.17 Timing and Switching Characteristics
      1. 8.17.1 Power Supply Sequencing
      2. 8.17.2 Device Reset
      3. 8.17.3 Reset Timing
        1. 8.17.3.1 nRESET (32-kHz Crystal)
        2.      
        3.      
        4. 8.17.3.2 nRESET (External 32-kHz Clock)
          1.       
      4. 8.17.4 Wakeup From HIBERNATE Mode
      5. 8.17.5 Clock Specifications
        1. 8.17.5.1 Slow Clock Using Internal Oscillator
        2. 8.17.5.2 Slow Clock Using an External Clock
          1.       
        3. 8.17.5.3 Fast Clock (Fref) Using an External Crystal
          1.       
        4. 8.17.5.4 Fast Clock (Fref) Using an External Oscillator
          1.       
      6. 8.17.6 Peripherals Timing
        1. 8.17.6.1  SPI
          1. 8.17.6.1.1 SPI Master
            1.        
          2. 8.17.6.1.2 SPI Slave
            1.        
        2. 8.17.6.2  I2S
          1. 8.17.6.2.1 I2S Transmit Mode
            1.        
          2. 8.17.6.2.2 I2S Receive Mode
            1.        
        3. 8.17.6.3  GPIOs
          1. 8.17.6.3.1 GPIO Output Transition Time Parameters (Vsupply = 3.3 V)
            1.        
          2. 8.17.6.3.2 GPIO Input Transition Time Parameters
            1.        
        4. 8.17.6.4  I2C
          1.       
        5. 8.17.6.5  IEEE 1149.1 JTAG
          1.       
        6. 8.17.6.6  ADC
          1.       
        7. 8.17.6.7  Camera Parallel Port
          1.       
        8. 8.17.6.8  UART
        9. 8.17.6.9  SD Host
        10. 8.17.6.10 Timers
  9. Detailed Description
    1. 9.1  Overview
    2. 9.2  Arm® Cortex®-M4 Processor Core Subsystem
    3. 9.3  Wi-Fi® Network Processor Subsystem
      1. 9.3.1 WLAN
      2. 9.3.2 Network Stack
    4. 9.4  Security
    5. 9.5  FIPS 140-2 Level 1 Certification
    6. 9.6  Power-Management Subsystem
    7. 9.7  Low-Power Operating Mode
    8. 9.8  Memory
      1. 9.8.1 External Memory Requirements
      2. 9.8.2 Internal Memory
        1. 9.8.2.1 SRAM
        2. 9.8.2.2 ROM
        3. 9.8.2.3 Flash Memory
        4. 9.8.2.4 Memory Map
    9. 9.9  Restoring Factory Default Configuration
    10. 9.10 Boot Modes
      1. 9.10.1 Boot Mode List
    11. 9.11 Hostless Mode
  10. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
      1. 10.1.1 BLE/2.4 GHz Radio Coexistence
      2. 10.1.2 Antenna Selection
      3. 10.1.3 Typical Application
    2. 10.2 PCB Layout Guidelines
      1. 10.2.1 General PCB Guidelines
      2. 10.2.2 Power Layout and Routing
        1. 10.2.2.1 Design Considerations
      3. 10.2.3 Clock Interface Guidelines
      4. 10.2.4 Digital Input and Output Guidelines
      5. 10.2.5 RF Interface Guidelines
  11. 11Device and Documentation Support
    1. 11.1  Third-Party Products Disclaimer
    2. 11.2  Tools and Software
    3. 11.3  Firmware Updates
    4. 11.4  Device Nomenclature
    5. 11.5  Documentation Support
    6. 11.6  Related Links
    7. 11.7  Support Resources
    8. 11.8  Trademarks
    9. 11.9  Electrostatic Discharge Caution
    10. 11.10 Export Control Notice
    11. 11.11 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information
      1. 12.1.1 Package Option Addendum
        1. 12.1.1.1 Packaging Information
        2. 12.1.1.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Clock Interface Guidelines

The following guidelines are for the slow clock:

  • The 32.768-kHz crystal must be placed close to the VQFN package.
  • Ensure that the load capacitance is tuned according to the board parasitics to the frequency tolerance within ±150 ppm.
  • The ground plane on layer two is solid below the trace lanes, and there is ground around these traces on the top layer.

The following guidelines are for the fast clock:

  • The 40-MHz crystal must be placed close to the VQFN package.
  • Ensure that the load capacitance is tuned according to the board parasitics to the frequency tolerance within ±10 ppm at room temperature. The total frequency across parts, temperature, and with aging must be ±20 ppm to meet the WLAN specification.
  • To avoid noise degradation, ensure that no high-frequency lines are routed close to the routing of the crystal pins.
  • Ensure that crystal tuning capacitors are close to the crystal pads.
  • Both traces (XTAL_N and XTAL_P) should be as close as possible to parallel and approximately the same length.
  • The ground plane on layer two is solid below the trace lines, and there should be ground around these traces on the top layer.
  • For frequency tuning, see CC31xx & CC32xx Frequency Tuning.