SNAS843C December   2024  – July 2025 CDC6C

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Environmental Compliance
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Device Output Configurations
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Bulk Acoustic Wave (BAW)
      2. 8.3.2 Device Block-Level Description
      3. 8.3.3 Function Pin
      4. 8.3.4 Clock Output Interfacing and Termination
      5. 8.3.5 Temperature Stability
      6. 8.3.6 Mechanical Robustness
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Driving Multiple Loads With a Single CDC6Cx
      2. 9.1.2 CDC6Cx CISPR25 Radiated Emission Performance
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Providing Thermal Reliability
        2. 9.4.1.2 Recommended Solder Reflow Profile
      2. 9.4.2 Layout Examples
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information
    2. 12.2 Orderable Part Number Decoder

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DLX|4
  • DLF|4
  • DLE|4
  • DLY|4
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

Texas Instruments' high-precision Bulk-Acoustic Wave (BAW) micro-resonator technology is integrated directly into a package allowing for low jitter clock circuitry. BAW is fully designed and manufactured at TI factories like other silicon-based fabrication processes.

The CDC6Cx device is a low jitter, low power, fixed-frequency oscillator which incorporates the BAW as the resonator source. The device is factory-programmed per specific frequency and function pin. With a frequency control logic and output frequency divider, the CDC6Cx is capable of producing any frequency within the specified range providing a single device family for all frequency needs.

The high-performance clocking, mechanical stability, lower power consumption, and small package options for this device are designed for reference clock and core clocks in Industrial, Telecom, Data and Enterprise Network and Personal Electronics end equipments.

Packaging Information
PART NUMBER OUTPUT TYPE PACKAGE(1) FREQUENCY STABILITY(2) PACKAGE SIZE3
CDC6Cx LVCMOS

VSON (DLE-4)

 ±25ppm 3.20mm × 2.50mm
VSON (DLF-4) ±25ppm 2.50mm × 2.00mm

VSON (DLX-4)

 ±25ppm 2.00mm × 1.60mm
VSON (DLY-4) ±50ppm
±25ppm(4)		 1.60mm × 1.20mm
(1) For more information, see Section 12.
(2) Inclusive of all factors and 10 years aging at 25°C, for more information see Section 6.6.
(3) The package size (length × width) is a nominal value and includes pins, where applicable.
(4) Preview, contact TI for this frequency stability option.
CDC6C CDC6Cx Simplified Block DiagramCDC6Cx Simplified Block Diagram