SNLS603C December   2020  – November 2022 DP83TG720R-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
    2. 6.1 Pin States
    3. 6.2 Pin Power Domain
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Timing Diagrams
    8. 7.8 LED Drive Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Diagnostic Tool Kit
        1. 8.3.1.1 Signal Quality Indicator
        2. 8.3.1.2 Time Domain Reflectometry
        3. 8.3.1.3 Built-In Self-Test For Datapath
          1. 8.3.1.3.1 Loopback Modes
          2. 8.3.1.3.2 Data Generator
          3. 8.3.1.3.3 Programming Datapath BIST
        4. 8.3.1.4 Temperature and Voltage Sensing
        5. 8.3.1.5 Electrostatic Discharge Sensing
      2. 8.3.2 Compliance Test Modes
        1. 8.3.2.1 Test Mode 1
        2. 8.3.2.2 Test Mode 2
        3. 8.3.2.3 Test Mode 4
        4. 8.3.2.4 Test Mode 5
        5. 8.3.2.5 Test Mode 6
        6. 8.3.2.6 Test Mode 7
    4. 8.4 Device Functional Modes
      1. 8.4.1  Power Down
      2. 8.4.2  Reset
      3. 8.4.3  Standby
      4. 8.4.4  Normal
      5. 8.4.5  Sleep
      6. 8.4.6  State Transitions
        1. 8.4.6.1 State Transition #1 - Standby to Normal
        2. 8.4.6.2 State Transition #2 - Normal to Standby
        3. 8.4.6.3 State Transition #3 - Normal to Sleep
        4. 8.4.6.4 State Transition #4 - Sleep to Normal
      7. 8.4.7  Media Dependent Interface
        1. 8.4.7.1 MDI Master and MDI Slave Configuration
        2. 8.4.7.2 Auto-Polarity Detection and Correction
      8. 8.4.8  MAC Interfaces
        1. 8.4.8.1 Reduced Gigabit Media Independent Interface
      9. 8.4.9  Serial Management Interface
      10. 8.4.10 Direct Register Access
      11. 8.4.11 Extended Register Space Access
      12. 8.4.12 Write Address Operation
        1. 8.4.12.1 Example - Write Address Operation
      13. 8.4.13 Read Address Operation
        1. 8.4.13.1 Example - Read Address Operation
      14. 8.4.14 Write Operation (No Post Increment)
        1. 8.4.14.1 Example - Write Operation (No Post Increment)
      15. 8.4.15 Read Operation (No Post Increment)
        1. 8.4.15.1 Example - Read Operation (No Post Increment)
      16. 8.4.16 Write Operation (Post Increment)
        1. 8.4.16.1 Example - Write Operation (Post Increment)
      17. 8.4.17 Read Operation (Post Increment)
        1. 8.4.17.1 Example - Read Operation (Post Increment)
    5. 8.5 Programming
      1. 8.5.1 Strap Configuration
      2. 8.5.2 LED Configuration
      3. 8.5.3 PHY Address Configuration
    6. 8.6 Register Maps
      1. 8.6.1 Register Access Summary
      2. 8.6.2 DP83TG720 Registers
        1. 8.6.2.1 Base Registers
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
  10. 10Power Supply Recommendations
  11. 11Compatibility with TI's 100BT1 PHY
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Signal Traces
      2. 12.1.2 Return Path
      3. 12.1.3 Physical Medium Attachment
      4. 12.1.4 Metal Pour
      5. 12.1.5 PCB Layer Stacking
  13. 13Device and Documentation Support
    1. 13.1 Receiving Notification of Documentation Updates
    2. 13.2 Support Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 Package Option Addendum
      1. 14.1.1 Packaging Information
      2. 14.1.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4.8.1 Reduced Gigabit Media Independent Interface

The DP83TG720R-Q1 also supports Reduced Gigabit Media Independent Interface (RGMII) as specified by RGMII version 2.0. RGMII is designed to reduce the number of pins required to connect MAC and PHY. To accomplish this goal, the control signals are multiplexed. Both rising and falling edges of the clock are used to sample the control signal pin on transmit and receive paths. For 1-Gbps operation, RX_CLK and TX_CLK operate at 125 MHz.

The RGMII signals are summarized in Table 8-9:

Table 8-9 RGMII Signals
FUNCTIONPINS
Data SignalsTX_D[3:0]
RX_D[3:0]
Control SignalsTX_CTRL
RX_CTRL
Clock SignalsTX_CLK
RX_CLK
GUID-BCC07449-F89E-4BC6-95AC-24CFCCE4DCFE-low.gifFigure 8-13 RGMII Connections
Table 8-10 RGMII Transmit Encoding
TX_CTRL
(POSITIVE EDGE)		TX_CTRL
(NEGATIVE EDGE)		TX_D[3:0]DESCRIPTION
000000 through 1111Normal Inter-Frame
010000 through 1111Reserved
100000 through 1111Normal Data Transmission
110000 through 1111Transmit Error Propagation
Table 8-11 RGMII Receive Encoding
RX_CTRL
(POSITIVE EDGE)		RX_CTRL
(NEGATIVE EDGE)		RX_D[3:0]DESCRIPTION
000000 through 1111Normal Inter-Frame
010000 through 1101Reserved
011110False Carrier Indication
011111Reserved
100000 through 1111Normal Data Reception
110000 through 1111Data Reception with Errors

The DP83TG720R-Q1 supports in-band status indication to help simplify link status detection. Inter-frame signals on RX_D[3:0] pins as specified in Table 8-12.

Table 8-12 RGMII In-Band Status
RX_CTRLRX_D3RX_D[2:1]RX_D0
0

Note:

In-band status is only valid when RX_CTRL is low		Duplex Status:

0 = Half-Duplex

1 = Full-Duplex

RX_CLK Clock Speed:

00 = 2.5 MHz

01 = 25 MHz

10 = 125 MHz

11 = Reserved

Link Status:

0 = Link not established

1 = Valid link established

RGMII MAC Interface for Gigabit Ethernet has stringent timing requirements to meet system level performance. To meet these timing requirements and to operate with different MACs over RGMII, it is advised to take the following requirements into consideration when designing PCB. It is also recommended to check board level signal integrity by using the DP83TG720 IBIS model.

RGMII-TX Requirements

  • RGMII TX signals should be routed on board with control impedance of 50Ohm +/-15%.
  • Max routing length should be limited to 5inch for better signal integrity performance.
  • Figure 8-14 shows a RGMII interface requirements for TX* signals. MAC RGMII driver output impedance should be 50Ohm+/-20%.
  • Skew for all RGMII TX signals at TP2, in Figure 8-14, should be <±500ps.
  • Signal Integrity at TP1 and TP2, in Figure 8-14, should be verified with IBIS model simulation and ensured conformance to following requirements:
    • At TP2, signal should meet rise/fall time of 1ns (20-80%) of signal amplitude.
    • Rise/fall time should be monotonic between VIH/VIL level at TP2.
GUID-E1B33FEA-CA83-47E3-8AF8-179CE074F114-low.gifFigure 8-14 RGMII TX Requirements

RGMII-RX Requirements

  • RGMII RX signals should be routed on board with control impedance of 50Ohm +/-15%.
  • Max routing length should be limited to 5inch for better signal integrity performance.
  • No damping resistors should be added at TP3/TP4, in Figure 8-15, as that will impact signal integrity of RX signals.
  • Figure 8-15 shows a RGMII interface requirements for RX* signals. MAC RGMII driver output impedance should be 50Ohm+/-20%.
  • Signal Integrity at TP3 and TP4, in Figure 8-15, should be verified with IBIS model simulation and ensured conformance to following requirements:
    • At TP4, signal should meet rise/fall time of 1ns (20-80%) of signal amplitude.
    • Rise/fall time should be monotonic between VIH/VIL level at TP4.
GUID-A8390198-86F9-45E5-AFB8-03E5F287745D-low.gifFigure 8-15 RGMII RX Requirements
Note:
  1. We recommend routing RGMII on buried traces to minimize EMC emissions.
  2. Buried traces should be connected with via placement as close as possible to the PHY and MAC.