SNLS603C December   2020  – November 2022 DP83TG720R-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
    2. 6.1 Pin States
    3. 6.2 Pin Power Domain
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Timing Diagrams
    8. 7.8 LED Drive Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Diagnostic Tool Kit
        1. 8.3.1.1 Signal Quality Indicator
        2. 8.3.1.2 Time Domain Reflectometry
        3. 8.3.1.3 Built-In Self-Test For Datapath
          1. 8.3.1.3.1 Loopback Modes
          2. 8.3.1.3.2 Data Generator
          3. 8.3.1.3.3 Programming Datapath BIST
        4. 8.3.1.4 Temperature and Voltage Sensing
        5. 8.3.1.5 Electrostatic Discharge Sensing
      2. 8.3.2 Compliance Test Modes
        1. 8.3.2.1 Test Mode 1
        2. 8.3.2.2 Test Mode 2
        3. 8.3.2.3 Test Mode 4
        4. 8.3.2.4 Test Mode 5
        5. 8.3.2.5 Test Mode 6
        6. 8.3.2.6 Test Mode 7
    4. 8.4 Device Functional Modes
      1. 8.4.1  Power Down
      2. 8.4.2  Reset
      3. 8.4.3  Standby
      4. 8.4.4  Normal
      5. 8.4.5  Sleep
      6. 8.4.6  State Transitions
        1. 8.4.6.1 State Transition #1 - Standby to Normal
        2. 8.4.6.2 State Transition #2 - Normal to Standby
        3. 8.4.6.3 State Transition #3 - Normal to Sleep
        4. 8.4.6.4 State Transition #4 - Sleep to Normal
      7. 8.4.7  Media Dependent Interface
        1. 8.4.7.1 MDI Master and MDI Slave Configuration
        2. 8.4.7.2 Auto-Polarity Detection and Correction
      8. 8.4.8  MAC Interfaces
        1. 8.4.8.1 Reduced Gigabit Media Independent Interface
      9. 8.4.9  Serial Management Interface
      10. 8.4.10 Direct Register Access
      11. 8.4.11 Extended Register Space Access
      12. 8.4.12 Write Address Operation
        1. 8.4.12.1 Example - Write Address Operation
      13. 8.4.13 Read Address Operation
        1. 8.4.13.1 Example - Read Address Operation
      14. 8.4.14 Write Operation (No Post Increment)
        1. 8.4.14.1 Example - Write Operation (No Post Increment)
      15. 8.4.15 Read Operation (No Post Increment)
        1. 8.4.15.1 Example - Read Operation (No Post Increment)
      16. 8.4.16 Write Operation (Post Increment)
        1. 8.4.16.1 Example - Write Operation (Post Increment)
      17. 8.4.17 Read Operation (Post Increment)
        1. 8.4.17.1 Example - Read Operation (Post Increment)
    5. 8.5 Programming
      1. 8.5.1 Strap Configuration
      2. 8.5.2 LED Configuration
      3. 8.5.3 PHY Address Configuration
    6. 8.6 Register Maps
      1. 8.6.1 Register Access Summary
      2. 8.6.2 DP83TG720 Registers
        1. 8.6.2.1 Base Registers
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
  10. 10Power Supply Recommendations
  11. 11Compatibility with TI's 100BT1 PHY
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Signal Traces
      2. 12.1.2 Return Path
      3. 12.1.3 Physical Medium Attachment
      4. 12.1.4 Metal Pour
      5. 12.1.5 PCB Layer Stacking
  13. 13Device and Documentation Support
    1. 13.1 Receiving Notification of Documentation Updates
    2. 13.2 Support Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 Package Option Addendum
      1. 14.1.1 Packaging Information
      2. 14.1.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.5 Electrical Characteristics

Over operating free-air temperature range (unless otherwise noted)(1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DC CHARACTERISTICS
XI
VIH High-level Input Voltage 1.3 V
VIL Low-level Input Voltage 0.5 V
WAKE pin WAKE pin WAKE pin WAKE pin WAKE pin WAKE pin WAKE pin
VIH High-level Input Voltage VSLEEP = 3.3V ± 10% 2 V
VIL Low-level Input Voltage VSLEEP = 3.3V ± 10% 0.8 V
INH pin INH pin INH pin INH pin INH pin INH pin INH pin
VOH High-level Output Voltage IOH = -2mA, VSLEEP = 3.3V ± 10% 2.4 V
3.3V VDDIO (2)
VOH High-level Output Voltage IOH = -2mA, VDDIO = 3.3V ± 10% 2.4 V
VOL Low-level Output Voltage IOL = 2mA, VDDIO = 3.3V ± 10% 0.4 V
VIH High-level Input Voltage VDDIO = 3.3V ± 10% 2 V
VIL Low-level Input Voltage VDDIO = 3.3V ± 10% 0.8 V
2.5V VDDIO (2)
VOH High-level Output Voltage IOH = -2mA, VDDIO = 2.5V ± 10% 2 V
VOL Low-level Output Voltage IOL = 2mA, VDDIO = 2.5V ± 10% 0.4 V
VIH High-level Input Voltage VDDIO = 2.5V ± 10% 1.7 V
VIL Low-level Input Voltage VDDIO = 2.5V ± 10% 0.7 V
1.8V VDDIO (2)
VOH High-level Output Voltage IOH = -2mA, VDDIO = 1.8V ± 10% VDDIO – 0.45 V
VOL Low-level Output Voltage IOL = 2mA, VDDIO = 1.8V ± 10% 0.45 V
VIH High-level Input Voltage VDDIO = 1.8V ± 10% 0.7 * VDDIO V
VIL Low-level Input Voltage VDDIO = 1.8V ± 10% 0.3 * VDDIO V
IIH Input High Current (MDIO) VIN = VCC, -40°C to 125°C -5 5 µA
IIH Input High Current (RGMII Input pin,MDC) VIN = VCC, -40°C to 125°C -20 20 µA
IOZ Input High Current (MDIO) VIN swept from 0V till VCC, -40°C to 125°C -40 40 µA
IIL Input Low Current (RGMII Input pin, MDC, MDIO) VIN = GND, -40°C to 125°C -40 5 µA
IOZL INH 6 µA
IOZ Tri-state Output Current (5) VIN swept from 0V till VCC, -40°C to 125°C -40 10 µA
IOZ Tri-state Output Current (6) VIN swept from 0V till VCC, -40°C to 125°C -60 60 µA
CIN Input Capacitance LVCMOS/LVTTL pins (3) 2 pF
CIN Input Capacitance LVCMOS/LVTTL pins (4) 4 pF
XI 1 pF
COUT Output Capacitance LVCMOS/LVTTL pins (3) 2 pF
COUT Output Capacitance LVCMOS/LVTTL pins (4) 4 pF
XO 1 pF
Rpull-up Integrated Pull-Up Resistance INT, RESET 6.5 9 12.5 kΩ
Rpull-down Integrated Pull-Down Resistance STRP_1, RX_CTRL 4.725 6.3 7.875 kΩ
Rpull-down Integrated Pull-Down Resistance LED_1, RX_D[3:0], RX_CLK, LED_0 7.3 9 13 kΩ
WAKE 35 50 62.5 kΩ
Rpull-down Integrated Pull-Up Resistance when Active INH 106 Ω
Rseries Integrated MAC Series Termination Resistor ( Default) RX_D[3:0], RX_CTRL, and RX_CLK 24 42 52 Ω
Rseries Integrated MAC Series Terminatin Resistor (with register<0x0456> = 0x0148) RX_D[3:0], RX_CTRL, and RX_CLK 30 52 65 Ω
Rseries Integrated MAC Series Terminatin Resistor (with register<0x0456> = 0x0168) RX_D[3:0], RX_CTRL, and RX_CLK 40 70 84 Ω
CURRENT CONSUMPTION, SLEEP MODE
ISLEEP Sleep Supply Current VSLEEP 485 840 µA
CURRENT CONSUMPTION, RESET ASSERTED
IDDIO IO Supply Current, VDDIO = 1.8V VDDIO 4 9 mA
IDDIO IO Supply Current, VDDIO = 2.5V VDDIO 5 12 mA
IDDIO IO Supply Current, VDDIO = 3.3V VDDIO 6.5 15 mA
IDDA3P3 Core Supply Current, 3.3V VDDA3P3 5 8 mA
IDD1P0 Core Supply Current, 1.0V VDD1P0 30 110 mA
CURRENT CONSUMPTION, STANDBY
IDDIO IO Supply Current, VDDIO = 1.8V VDDIO 4 11 mA
IDDIO IO Supply Current, VDDIO = 2.5V VDDIO 6 13 mA
IDDIO IO Supply Current, VDDIO = 3.3V VDDIO 8 15 mA
IDDA3P3 Core Supply Current, 3.3V VDDA3P3 16 18 mA
IDD1P0 Core Supply Current, 1.0V VDD1P0 33 112 mA
CURRENT CONSUMPTION, ACTIVE MODE,  Voltage: +/- 10%, Traffic : 100%,Packet Size: 1518, Content : Random
IDDIO IO Supply Current, VDDIO = 1.8V RGMII 20 25 mA
IDDIO IO Supply Current, VDDIO = 2.5V RGMII 26 30 mA
IDDIO IO Supply Current, VDDIO = 3.3V RGMII 33 40 mA
IDDA3P3 Core Supply Current, 3.3V RGMII  85 89 mA
IDD1P0 Core Supply Current, 1.0V RGMII  177 250 mA
ISLEEP Sleep Supply Current VSLEEP = 3.3V +/- 10%  1000 1500 µA
MDI CHARACTERISTICS
VOD-MDI Output Differential Voltage RL(diff) = 100 Ω 1.3 V
RMDI-DIFF Integrated Differential MDI Termination (Active State) TRD_P, TRD_M 100 Ω
RMDI-DIFF Integrated Differential MDI Termination (Sleep State) TRD_P, TRD_M 100 Ω
BOOTSTRAP DC CHARACTERISTICS
2 level straps
Vbsl_1v8 Bootstrap Threshold Mode 1, VDDIO = 1.8V ± 10%, 2-level  0 0.35*VDDIO V
Vbsh_1v8 Bootstrap Threshold Mode 2, VDDIO = 1.8V ± 10%, 2-level  1.175 VDDIO V
Vbsl_2v5 Bootstrap Threshold Mode 1, VDDIO = 2.5V ± 10%, 2-level 0 0.7 V
Vbsh_2v5 Bootstrap Threshold Mode 2, VDDIO = 2.5V ± 10%, 2-level 1.175 VDDIO V
Vbsl_3v3 Bootstrap Threshold Mode 1, VDDIO = 3.3V ± 10%, 2-level 0 0.7 V
Vbsh_3v3 Bootstrap Threshold Mode 2, VDDIO = 3.3V ± 10%, 2-level 1.175 VDDIO V
3 level straps
Vbs1_1V8 Bootstrap Threshold Mode 1, VDDIO = 1.8V ± 10%, 3-level 0 0.35 * VDDIO V
Vbs2_1V8 Bootstrap Threshold Mode 2, VDDIO = 1.8V ± 10%, 3-level 0.40 * VDDIO 0.75 * VDDIO V
Vbs3_1V8 Bootstrap Threshold Mode 3, VDDIO = 1.8V ± 10%, 3-level 0.84 * VDDIO VDDIO V
Vbs1_2V5 Bootstrap Threshold Mode 1, VDDIO = 2.5V ± 10%, 3-level 0 0.19 * VDDIO V
Vbs2_2V5 Bootstrap Threshold Mode 2, VDDIO = 2.5V ± 10%, 3-level 0.27 * VDDIO 0.41 * VDDIO V
Vbs3_2V5 Bootstrap Threshold Mode 3, VDDIO = 2.5V ± 10%, 3-level 0.58 * VDDIO VDDIO V
Vbs1_3V3 Bootstrap Threshold Mode 1, VDDIO = 3.3V ± 10%, 3-level 0 0.18 * VDDIO V
Vbs2_3V3 Bootstrap Threshold Mode 2, VDDIO = 3.3V ± 10%, 3-level 0.22 * VDDIO 0.42 * VDDIO V
Vbs3_3V3 Bootstrap Threshold Mode 3, VDDIO = 3.3V ± 10%, 3-level 0.46 * VDDIO VDDIO V
Temperature Sensor
Temperature Sensor Resolution (LSB) -40℃ to 125℃ 1.5 ℃
Temperature Sensor Accuracy ( Voltage and Temperature Variation on single part) -40℃ to 125℃ -7.5 7.5 ℃
Temperature Sensor Accuracy ( Voltage, Temperature and Part-to-Part variation)  -40℃ to 125℃ -21.5 20 ℃
Temperature Sensor Range -40 140 ℃
Voltage Sensor
VDDA3P3 Sensor Range 2.66 3.3 3.96 V
VDDA3P3 Sensor Resolution (LSB) -40℃ to 125℃ 8.6 mV
VDDA3P3 Sensor Accuracy ( Voltage and Temperature Variation) -40℃ to 125℃ 8.6 mV
VDDA3P3 Sensor Accuracy Part-to-Part -40℃ to 125℃ -68.8 68.8 mV
VDD1P0 Sensor Range 0.8 1.2 V
VDD1P0 Sensor Resolution (LSB) -40℃ to 125℃ 2.8 mV
VDD1P0 Sensor Accuracy ( Voltage and Temperature Variation) -40℃ to 125℃ 2.8 mV
VDD1P0 Sensor Accuracy Part-to-Part -40℃ to 125℃ -22.4 22.4 mV
VDDIO Sensor Range 1.44 3.8 V
VDDIO Sensor Resolution (LSB) -40℃ to 125℃ 15.4 mV
VDDIO Sensor Accuracy ( Voltage and Temperature Variation) -40℃ to 125℃ 15.4 mV
VDDIO Sensor Accuracy Part-to-Part -40℃ to 125℃ -78 78 mV
(1) Ensured by production test, characterization or design
(2) For pins:  LED_1, STRP_1, RX_CTRL, CLKOUT, RX_D[3:0], RX_CLK, LED_0
(3) For pins: MDC, INT, RESET, LED_1, STRP_1, RX_CTRL, CLKOUT, RX_D0, RX_D1, RX_CLK, TX_CLK, TX_CTRL, TX_D2, TX_D3, LED_0, and MDIO
(4) For pins: TX_D0, TX_D1, RX_D2, and RX_D3
(5) For pins : LED_1, RX_D[3:0], RX_CLK, LED_0
(6) For pins : STRP_1 and RX_CTRL