SLVSHC7B December   2023  – September 2025 DRV8334

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1. 4.1 Pin Functions 48-Pin DRV8334
  6. 5 Specification
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings DRV8334
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 SPI Timing Diagrams
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Three BLDC Gate Drivers
        1. 6.3.1.1 PWM Control Modes
          1. 6.3.1.1.1 6x PWM Mode
          2. 6.3.1.1.2 3x PWM Mode with INLx enable control
          3. 6.3.1.1.3 3x PWM Mode with SPI enable control
          4. 6.3.1.1.4 1x PWM Mode
          5. 6.3.1.1.5 SPI Gate Drive Mode
        2. 6.3.1.2 Gate Drive Architecture
          1. 6.3.1.2.1 Bootstrap diode
          2. 6.3.1.2.2 GVDD Charge pump/LDO
          3. 6.3.1.2.3 VCP Trickle Charge pump
          4. 6.3.1.2.4 Gate Driver Output
          5. 6.3.1.2.5 Passive and Semi-active pull-down resistor
          6. 6.3.1.2.6 TDRIVE Gate Drive Timing Control
          7. 6.3.1.2.7 Propagation Delay
          8. 6.3.1.2.8 Deadtime and Cross-Conduction Prevention
      2. 6.3.2 Low-Side Current Sense Amplifiers
        1. 6.3.2.1 Unidirectional Current Sense Operation
        2. 6.3.2.2 Bidirectional Current Sense Operation
      3. 6.3.3 Gate Driver Shutdown
        1. 6.3.3.1 DRVOFF Gate Driver Shutdown
        2. 6.3.3.2 Gate Driver Shutdown Timing Sequence
      4. 6.3.4 Gate Driver Protective Circuits
        1. 6.3.4.1  PVDD Supply Undervoltage Warning (PVDD_UVW)
        2. 6.3.4.2  PVDD Supply Undervoltage Lockout (PVDD_UV)
        3. 6.3.4.3  PVDD Supply Overvoltage Fault (PVDD_OV)
        4. 6.3.4.4  GVDD Undervoltage Lockout (GVDD_UV)
        5. 6.3.4.5  GVDD Overvoltage Fault (GVDD_OV)
        6. 6.3.4.6  BST Undervoltage Lockout (BST_UV)
        7. 6.3.4.7  BST Overvoltage Fault (BST_OV)
        8. 6.3.4.8  VCP Undervoltage Fault (CP_OV)
        9. 6.3.4.9  VCP Overvoltage Fault (CP_OV)
        10. 6.3.4.10 VDRAIN Undervoltage Fault (VDRAIN_UV)
        11. 6.3.4.11 VDRAIN Overvoltage Fault (VDRAIN_OV)
        12. 6.3.4.12 MOSFET VGS Monitoring Protection
        13. 6.3.4.13 MOSFET VDS Overcurrent Protection (VDS_OCP)
        14. 6.3.4.14 VSENSE Overcurrent Protection (SEN_OCP)
        15. 6.3.4.15 Phase Comparators
        16. 6.3.4.16 Thermal Shutdown (OTSD)
        17. 6.3.4.17 Thermal Warning (OTW)
        18. 6.3.4.18 OTP CRC
        19. 6.3.4.19 SPI Watchdog Timer
        20. 6.3.4.20 Phase Diagnostic
    4. 6.4 Device Functional Modes
      1. 6.4.1 Gate Driver Functional Modes
        1. 6.4.1.1 Sleep Mode
        2. 6.4.1.2 Operating Mode
      2. 6.4.2 Device Power Up Sequence
    5. 6.5 Programming
      1. 6.5.1 SPI
      2. 6.5.2 SPI Format
      3. 6.5.3 SPI Format Diagrams
  8. 7 Register Maps
    1. 7.1 STATUS Registers
    2. 7.2 CONTROL Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Typical Application with 48-pin package
        1. 8.2.1.1 External Components
      2. 8.2.2 Application Curves
    3. 8.3 Layout
      1. 8.3.1 Layout Guidelines
      2. 8.3.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Community Resources
    4. 9.4 Trademarks
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Package Option Addendum
    2. 11.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.1 Package Option Addendum

Packaging Information

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan Lead/Ball Finish(5) MSL Peak Temp(2) Op Temp (°C) Device Marking(3)(4)
DRV8334RGZR ACTIVE VQFN RGZ 48 1000 RoHS & Green NiPdAu Level-3-260C-168 HR -40 to 125 DRV8334
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(3) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(4) Multiple Device markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
(5) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.
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