SLOSE54C June 2020 – July 2022 DRV8428
PRODUCTION DATA
For an ambient temperature of TA and total power dissipation (PTOT), the junction temperature (TJ) is calculated as TJ = TA + (PTOT x RθJA)
Considering a JEDEC standard 4-layer PCB, the junction-to-ambient thermal resistance (RθJA) is 46.4 °C/W for the HTSSOP package and 47 °C/W for the WQFN package.
Assuming 25°C ambient temperature, the junction temperature for the HTSSOP package is calculated as shown below -
The junction temperature for the WQFN package is calculated as shown below -
Therefore, the HTSSOP and the WQFN packages result in almost identical junction temperature.