SLOSE54C June   2020  – July 2022 DRV8428

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1. 5.1 Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Indexer Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Stepper Motor Driver Current Ratings
        1. 7.3.1.1 Peak Current Rating
        2. 7.3.1.2 RMS Current Rating
        3. 7.3.1.3 Full-Scale Current Rating
      2. 7.3.2 PWM Motor Drivers
      3. 7.3.3 Microstepping Indexer
      4. 7.3.4 Controlling VREF with an MCU DAC
      5. 7.3.5 Current Regulation, Off-time and Decay Modes
        1. 7.3.5.1 Mixed Decay
        2. 7.3.5.2 Smart tune Dynamic Decay
        3. 7.3.5.3 Smart tune Ripple Control
        4. 7.3.5.4 Blanking time
      6. 7.3.6 Linear Voltage Regulators
      7. 7.3.7 Logic Level, tri-level, quad-level and seven-level Pin Diagrams
        1. 7.3.7.1 EN/nFAULT Pin
      8. 7.3.8 Protection Circuits
        1. 7.3.8.1 VM Undervoltage Lockout (UVLO)
        2. 7.3.8.2 Overcurrent Protection (OCP)
        3. 7.3.8.3 Thermal Shutdown (OTSD)
        4. 7.3.8.4 Fault Condition Summary
    4. 7.4 Device Functional Modes
      1. 7.4.1 Sleep Mode (nSLEEP = 0)
      2. 7.4.2 Disable Mode (nSLEEP = 1, EN/nFAULT = 0/Hi-Z)
      3. 7.4.3 Operating Mode (nSLEEP = 1, EN/nFAULT = 1)
      4. 7.4.4 Functional Modes Summary
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Stepper Motor Speed
        2. 8.2.2.2 Current Regulation
        3. 8.2.2.3 Decay Modes
        4. 8.2.2.4 Application Curves
      3. 8.2.3 Thermal Application
        1. 8.2.3.1 Power Dissipation
          1. 8.2.3.1.1 Conduction Loss
          2. 8.2.3.1.2 Switching Loss
          3. 8.2.3.1.3 Power Dissipation Due to Quiescent Current
          4. 8.2.3.1.4 Total Power Dissipation
        2. 8.2.3.2 Device Junction Temperature Estimation
  9. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Power supply voltage (VM) –0.3 35 V
nSLEEP pin voltage (nSLEEP) –0.3 VVM V
Internal regulator voltage (DVDD) –0.3 5.75 V
Control pin voltage (STEP, DIR, EN/nFAULT, DECAY/TOFF, M0, M1) –0.3 5.75 V
Open drain output current (EN/nFAULT) 0 10 mA
Reference input pin voltage (VREF) –0.3 5.75 V
Continuous phase node pin voltage (AOUT1, AOUT2, BOUT1, BOUT2) –1 VVM + 1 V
Transient 100 ns phase node pin voltage (AOUT1, AOUT2, BOUT1, BOUT2) –3 VVM + 3 V
Peak drive current (AOUT1, AOUT2, BOUT1, BOUT2) Internally Limited A
Operating ambient temperature, TA –40 125 °C
Operating junction temperature, TJ –40 150 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.