SLOSE79B August   2022  – October 2023 DRV8462

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
      1. 6.5.1 SPI Timing Requirements
      2. 6.5.2 STEP and DIR Timing Requirements
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Interface of Operation
      2. 7.3.2  Stepper Motor Driver Current Ratings
        1. 7.3.2.1 Peak Current Rating
        2. 7.3.2.2 RMS Current Rating
        3. 7.3.2.3 Full-Scale Current Rating
      3. 7.3.3  PWM Motor Drivers
      4. 7.3.4  Microstepping Indexer
      5. 7.3.5  Indexer Output
        1. 7.3.5.1 nHOME Output
      6. 7.3.6  Automatic Microstepping Mode
      7. 7.3.7  Custom Microstepping Table
      8. 7.3.8  Current Regulation
      9. 7.3.9  Internal Reference Voltage
      10. 7.3.10 Standstill Power Saving Mode
      11. 7.3.11 Current Regulation Decay Modes
        1. 7.3.11.1 Slow Decay
        2. 7.3.11.2 Mixed Decay
        3. 7.3.11.3 Smart tune Dynamic Decay
        4. 7.3.11.4 Smart tune Ripple Control
        5. 7.3.11.5 PWM OFF Time
        6. 7.3.11.6 Current Regulation Blanking Time and Deglitch Time
      12. 7.3.12 Current Sensing with External Resistor
      13. 7.3.13 Silent step decay mode
      14. 7.3.14 Auto-torque Dynamic Current Adjustment
        1. 7.3.14.1 Auto-torque Learning Routine
        2. 7.3.14.2 Current Control Loop
        3. 7.3.14.3 PD Control Loop
        4. 7.3.14.4 Efficiency Improvement with Auto-torque
      15. 7.3.15 Charge Pump
      16. 7.3.16 Linear Voltage Regulator
      17. 7.3.17 VCC Voltage Supply
      18. 7.3.18 Logic Level, Tri-Level and Quad-Level Pin Diagrams
      19. 7.3.19 Spread spectrum
      20. 7.3.20 Protection Circuits
        1. 7.3.20.1  VM Undervoltage Lockout
        2. 7.3.20.2  VCP Undervoltage Lockout (CPUV)
        3. 7.3.20.3  Logic Supply Power on Reset (POR)
        4. 7.3.20.4  Overcurrent Protection (OCP)
          1. 7.3.20.4.1 Latched Shutdown
          2. 7.3.20.4.2 Automatic Retry
        5. 7.3.20.5  Stall Detection
        6. 7.3.20.6  Open-Load Detection (OL)
        7. 7.3.20.7  Overtemperature Warning (OTW)
        8. 7.3.20.8  Thermal Shutdown (OTSD)
          1. 7.3.20.8.1 Latched Shutdown
          2. 7.3.20.8.2 Automatic Retry
        9. 7.3.20.9  Supply voltage sensing
        10. 7.3.20.10 nFAULT Output
        11. 7.3.20.11 Fault Condition Summary
      21. 7.3.21 Device Functional Modes
        1. 7.3.21.1 Sleep Mode
        2. 7.3.21.2 Disable Mode
        3. 7.3.21.3 Operating Mode
        4. 7.3.21.4 nSLEEP Reset Pulse
        5. 7.3.21.5 Functional Modes Summary
    4. 7.4 Programming
      1. 7.4.1 Serial Peripheral Interface (SPI) Communication
        1. 7.4.1.1 SPI Format
        2. 7.4.1.2 SPI for Multiple Target Devices in Daisy Chain Configuration
        3. 7.4.1.3 SPI for Multiple Target Devices in Parallel Configuration
    5. 7.5 Register Maps
      1. 7.5.1 Status Registers
        1. 7.5.1.1 FAULT (address = 0x00) [Default = 00h]
        2. 7.5.1.2 DIAG1 (address = 0x01) [Default = 00h]
        3. 7.5.1.3 DIAG2 (address = 0x02) [Default = 00h]
        4. 7.5.1.4 DIAG3 (address = 0x03) [Default = 00h]
      2. 7.5.2 Control Registers
        1. 7.5.2.1  CTRL1 (address = 0x04) [Default = 0Fh]
        2. 7.5.2.2  CTRL2 (address = 0x05) [Default = 06h]
        3. 7.5.2.3  CTRL3 (address = 0x06) [Default = 38h]
        4. 7.5.2.4  CTRL4 (address = 0x07) [Default = 49h]
        5. 7.5.2.5  CTRL5 (address = 0x08) [Default = 03h]
        6. 7.5.2.6  CTRL6 (address = 0x09) [Default = 20h]
        7. 7.5.2.7  CTRL7 (address = 0x0A) [Default = FFh]
        8. 7.5.2.8  CTRL8 (address = 0x0B) [Default = 0Fh]
        9. 7.5.2.9  CTRL9 (address = 0x0C) [Default = 10h]
        10. 7.5.2.10 CTRL10 (address = 0x0D) [Default = 80h]
        11. 7.5.2.11 CTRL11 (address = 0x0E) [Default = FFh]
        12. 7.5.2.12 CTRL12 (address = 0x0F) [Default = 20h]
        13. 7.5.2.13 CTRL13 (address = 0x10) [Default = 10h]
        14. 7.5.2.14 CTRL14 (address = 0x3C) [Default = 58h]
      3. 7.5.3 Indexer Registers
        1. 7.5.3.1 INDEX1 (address = 0x11) [Default = 80h]
        2. 7.5.3.2 INDEX2 (address = 0x12) [Default = 80h]
        3. 7.5.3.3 INDEX3 (address = 0x13) [Default = 80h]
        4. 7.5.3.4 INDEX4 (address = 0x14) [Default = 82h]
        5. 7.5.3.5 INDEX5 (address = 0x15) [Default = B5h]
      4. 7.5.4 Custom Microstepping Registers
        1. 7.5.4.1 CUSTOM_CTRL1 (address = 0x16) [Default = 00h]
        2. 7.5.4.2 CUSTOM_CTRL2 (address = 0x17) [Default = 00h]
        3. 7.5.4.3 CUSTOM_CTRL3 (address = 0x18) [Default = 00h]
        4. 7.5.4.4 CUSTOM_CTRL4 (address = 0x19) [Default = 00h]
        5. 7.5.4.5 CUSTOM_CTRL5 (address = 0x1A) [Default = 00h]
        6. 7.5.4.6 CUSTOM_CTRL6 (address = 0x1B) [Default = 00h]
        7. 7.5.4.7 CUSTOM_CTRL7 (address = 0x1C) [Default = 00h]
        8. 7.5.4.8 CUSTOM_CTRL8 (address = 0x1D) [Default = 00h]
        9. 7.5.4.9 CUSTOM_CTRL9 (address = 0x1E) [Default = 00h]
      5. 7.5.5 Auto torque Registers
        1. 7.5.5.1  ATQ_CTRL1 (address = 0x1F) [Default = 00h]
        2. 7.5.5.2  ATQ_CTRL2 (address = 0x20) [Default = 00h]
        3. 7.5.5.3  ATQ_CTRL3 (address = 0x21) [Default = 00h]
        4. 7.5.5.4  ATQ_CTRL4 (address = 0x22) [Default = 20h]
        5. 7.5.5.5  ATQ_CTRL5 (address = 0x23) [Default = 00h]
        6. 7.5.5.6  ATQ_CTRL6 (address = 0x24) [Default = 00h]
        7. 7.5.5.7  ATQ_CTRL7 (address = 0x25) [Default = 00h]
        8. 7.5.5.8  ATQ_CTRL8 (address = 0x26) [Default = 00h]
        9. 7.5.5.9  ATQ_CTRL9 (address = 0x27) [Default = 00h]
        10. 7.5.5.10 ATQ_CTRL10 (address = 0x28) [Default = 08h]
        11. 7.5.5.11 ATQ_CTRL11 (address = 0x29) [Default = 0Ah]
        12. 7.5.5.12 ATQ_CTRL12 (address = 0x2A) [Default = FFh]
        13. 7.5.5.13 ATQ_CTRL13 (address = 0x2B) [Default = 05h]
        14. 7.5.5.14 ATQ_CTRL14 (address = 0x2C) [Default = 0Fh]
        15. 7.5.5.15 ATQ_CTRL15 (address = 0x2D) [Default = 00h]
        16. 7.5.5.16 ATQ_CTRL16 (address = 0x2E) [Default = FFh]
        17. 7.5.5.17 ATQ_CTRL17 (address = 0x2F) [Default = 00h]
        18. 7.5.5.18 ATQ_CTRL18 (address = 0x30) [Default = 00h]
      6. 7.5.6 Silent Step Registers
        1. 7.5.6.1 SS_CTRL1 (address = 0x31) [Default = 00h]
        2. 7.5.6.2 SS_CTRL2 (address = 0x32) [Default = 00h]
        3. 7.5.6.3 SS_CTRL3 (address = 0x33) [Default = 00h]
        4. 7.5.6.4 SS_CTRL4 (address = 0x34) [Default = 00h]
        5. 7.5.6.5 SS_CTRL5 (address = 0x35) [Default = FFh]
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Stepper Motor Speed
      3. 8.2.3 Application Performance Plots
      4. 8.2.4 Thermal Application
        1. 8.2.4.1 Power Dissipation
        2. 8.2.4.2 Conduction Loss
        3. 8.2.4.3 Switching Loss
        4. 8.2.4.4 Power Dissipation Due to Quiescent Current
        5. 8.2.4.5 Total Power Dissipation
        6. 8.2.4.6 Device Junction Temperature Estimation
        7. 8.2.4.7 Thermal Images
  10. 9 Thermal Considerations
    1. 9.1 DDV Package
    2. 9.2 DDW Package
    3. 9.3 PCB Material Recommendation
  11. 10Power Supply Recommendations
    1. 10.1 Bulk Capacitance
    2. 10.2 Power Supplies
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4.1.2 SPI for Multiple Target Devices in Daisy Chain Configuration

Multiple devices can be connected to the controller with and without the daisy chain. For connecting 'n' number of devices to a controller without using a daisy chain, 'n' number of GPIO resources from controller have to be utilized for nSCS pins. Whereas, if the daisy chain configuration is used, a single nSCS line can be used for connecting multiple devices.

Figure 7-50 shows the topology when three devices are connected in daisy chain. This configuration saves GPIO ports when multiple devices are communicating to the same controller.

GUID-20220521-SS0I-K62D-V9GH-DHLJP8FKQ0KC-low.svgFigure 7-50 Three Devices Connected in Daisy Chain

The first device in the chain receives data from the MCU as shown in Figure 7-51 for 3-device configuration: 2 bytes of header (HDRx) followed by 3 bytes of address (Ax) followed by 3 bytes of data (Dx).

GUID-697F6117-8BA9-431E-8DFB-A55A4B8386FA-low.gifFigure 7-51 SPI Frame With Three Devices

After the data has been transmitted through the chain, the MCU receives the data string in the format shown in Figure 7-52 for 3-device configuration: 3 bytes of status (Sx) followed by 2 bytes of header followed by 3 bytes of report (Rx).

GUID-6CAADF60-FA2B-47AA-953B-7C4E7DECE8B9-low.gifFigure 7-52 SPI Data Sequence for Three Devices

The header bytes contain information of the number of devices connected in the chain, and a global clear fault command that will clear the fault registers of all the devices on the rising edge of the chip select (nSCS) signal. Header values N5 through N0 are 6 bits dedicated to show the number of devices in the chain. Up to 63 devices can be connected in series for each daisy chain connection.

The 5 LSBs of the HDR2 register are don’t care bits that can be used by the MCU to determine integrity of the daisy chain connection. Header bytes must start with 1 and 0 for the two MSBs.

GUID-AA9A72DC-4BA4-45EC-9140-807585EF4109-low.gifFigure 7-53 Header Bytes

The status byte provides information about the fault status register for each device in the daisy chain so that the MCU does not have to initiate a read command to read the fault status from any particular device. This keeps additional read commands for the MCU and makes the system more efficient to determine fault conditions flagged in a device. Status bytes must start with 1 and 1 for the two MSBs.

GUID-20220521-SS0I-RWC3-X1F5-ZG2H8W9WGB0V-low.svgFigure 7-54 Contents of Header, Status, Address, and Data Bytes

When data passes through a device, it determines the position of itself in the chain by counting the number of status bytes it receives followed by the first header byte. For example, in this 3-device configuration, device 2 in the chain receives two status bytes before receiving the HDR1 byte which is then followed by the HDR2 byte.

From the two status bytes, the data can determine that its position is second in the chain. From the HDR2 byte, the data can determine how many devices are connected in the chain. In this way, the data only loads the relevant address and data byte in its buffer and bypasses the other bits. This protocol allows for faster communication without adding latency to the system for up to 63 devices in the chain.

The address and data bytes remain the same with respect to a 1-device connection. The report bytes (R1 through R3), as shown in Figure 7-52, are the content of the register being accessed.

GUID-D1DF84BA-6F5A-43B9-9408-C62E38083964-low.gifFigure 7-55 SPI Transaction