SBOSAK2A May   2025  – September 2025 INA187

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Amplifier Input Common-Mode Signal
      2. 6.3.2 Low Input Bias Current
      3. 6.3.3 Low VSENSE Operation
      4. 6.3.4 Wide Fixed Gain Output
      5. 6.3.5 Wide Supply Range
    4. 6.4 Device Functional Modes
      1. 6.4.1 Adjusting the Output With the Reference Pin
      2. 6.4.2 Reference Pin Connections for Unidirectional Current Measurements
        1. 6.4.2.1 Ground Referenced Output
        2. 6.4.2.2 VS Referenced Output
      3. 6.4.3 Reference Pin Connections for Bidirectional Current Measurements
        1. 6.4.3.1 Output Set to External Reference Voltage
        2. 6.4.3.2 Output Set to Mid-Supply Voltage
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 RSENSE and Device Gain Selection
    2. 7.2 Typical Application
      1. 7.2.1 Low-side Current Sensing in Motor Application
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Performance Plots
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Power Supply Decoupling
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Examples
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.