SBOSAK2A May   2025  – September 2025 INA187

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Amplifier Input Common-Mode Signal
      2. 6.3.2 Low Input Bias Current
      3. 6.3.3 Low VSENSE Operation
      4. 6.3.4 Wide Fixed Gain Output
      5. 6.3.5 Wide Supply Range
    4. 6.4 Device Functional Modes
      1. 6.4.1 Adjusting the Output With the Reference Pin
      2. 6.4.2 Reference Pin Connections for Unidirectional Current Measurements
        1. 6.4.2.1 Ground Referenced Output
        2. 6.4.2.2 VS Referenced Output
      3. 6.4.3 Reference Pin Connections for Bidirectional Current Measurements
        1. 6.4.3.1 Output Set to External Reference Voltage
        2. 6.4.3.2 Output Set to Mid-Supply Voltage
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 RSENSE and Device Gain Selection
    2. 7.2 Typical Application
      1. 7.2.1 Low-side Current Sensing in Motor Application
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Performance Plots
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Power Supply Decoupling
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Examples
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.1 Power Supply Decoupling

Place the power-supply bypass capacitor as close to the supply and ground pins as possible. TI recommends a bypass capacitor value of 0.1μF. Additional decoupling capacitance can be added to compensate for noisy or high-impedance power supplies.