SLLSG01B September   2024  – November 2025 ISO6440 , ISO6441 , ISO6442

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics—5V Supply
    10. 6.10 Supply Current Characteristics—5V Supply
    11. 6.11 Electrical Characteristics—3.3V Supply
    12. 6.12 Supply Current Characteristics—3.3V Supply
    13. 6.13 Electrical Characteristics—2.5V Supply 
    14. 6.14 Supply Current Characteristics—2.5V Supply
    15. 6.15 Switching Characteristics—5V Supply
    16. 6.16 Switching Characteristics—3.3V Supply
    17. 6.17 Switching Characteristics—2.5V Supply
    18. 6.18 Insulation Characteristics Curves
    19. 6.19 Typical Characteristics
  8.   27
  9. 7 Parameter Measurement Information
  10. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 8.4 Device Functional Modes
    5. 8.5 Device I/O Schematics
    6. 8.6 Overvoltage Tolerant Input
  11. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  12. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Device Nomenclature
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  13. 11Revision History
  14. 12Mechanical, Packaging, and Orderable Information
    1.     58
    2.     59
    3.     60

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBQ|16
  • DW|16
  • DFP|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Functional Safety-Capable (Planned)
    • Documentation available to aid IEC 61508 system design
  • Up to 150Mbps data rate
  • Robust SiO2 isolation barrier:
    • High lifetime at up to 1061VRMS and 1500VDC working voltage
    • Up to 5000VRMS isolation rating
    • Up to 10.4kV surge capability
    • Up to ±200kV/μs minimum CMTI
    • Wide temperature range: –40°C to 125°C ambient operating
  • Supply range: 2.25V to 5.5V
  • Overvoltage Tolerant Inputs
  • Default output high (ISO644x) and low (ISO644xF) options
  • Low propagation delay: 10ns maximum at 5V, 12ns maximum at 3.3V
  • Supports SPI up to: 25MHz at 5V, 20.8MHz at 3.3V
  • Low pulse width distortion: 1.8ns maximum at 5V, 2.2ns maximum at 3.3V
  • Robust electromagnetic compatibility (EMC)
    • System-level ESD, EFT, and surge immunity
    • Low emissions
  • Wide-SOIC (DW-16) Package
  • Wide-SSOP (DFP-16) Package
  • SSOP (DBQ-16) Package
  • Safety-Related Certifications (Planned):
    • DIN EN IEC 60747-17 (VDE 0884-17)
    • UL 1577 component recognition program
    • IEC 62368-1, IEC 61010-1, IEC 60601-1 and GB 4943.1 certifications