SLLSG01B September   2024  – November 2025 ISO6440 , ISO6441 , ISO6442

PRODMIX  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics—5V Supply
    10. 6.10 Supply Current Characteristics—5V Supply
    11. 6.11 Electrical Characteristics—3.3V Supply
    12. 6.12 Supply Current Characteristics—3.3V Supply
    13. 6.13 Electrical Characteristics—2.5V Supply 
    14. 6.14 Supply Current Characteristics—2.5V Supply
    15. 6.15 Switching Characteristics—5V Supply
    16. 6.16 Switching Characteristics—3.3V Supply
    17. 6.17 Switching Characteristics—2.5V Supply
    18. 6.18 Insulation Characteristics Curves
    19. 6.19 Typical Characteristics
  8.   27
  9. Parameter Measurement Information
  10. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 8.4 Device Functional Modes
    5. 8.5 Device I/O Schematics
    6. 8.6 Overvoltage Tolerant Input
  11. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  12. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Device Nomenclature
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  13. 11Revision History
  14. 12Mechanical, Packaging, and Orderable Information
    1.     58
    2.     59
    3.     60

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBQ|16
  • DW|16
  • DFP|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Electrical Characteristics—2.5V Supply 

VCC1 = VCC2 = 2.5V ±10% (over recommended operating conditions unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOH(OUTx) OUTx (output) high-level output voltage IOH = -1mA; See Section 7  VCCO - 0.1 (1) V
VOL(OUTx) OUTx (output) low-level output voltage IOL = 1mA;  See Section 7  0.1
VIT+(INx) INx (input) switching threshold voltage, rising 0.7 x VCCI(1)
VIT-(INx) INx (input) switching threshold voltage, falling 0.3 x VCCI
VI_HYS(INx) INx (input) switching threshold voltage hysteresis 0.1 x VCCI
II(INx) INx (input) input current (default high device) HIGH Input Current:  VIH = VCCI (1) at INx  (leakage current) 1 µA
LOW Input Current:  VIL = 0V at INx (leakage and current through default high pull-up resistance) -10
INx (input) input current (default low device, with F suffix) HIGH Input Current: VIH = VCCI (1) at INx (leakage and current through default low pull-down resistance) 10
LOW Input Current: VIL = 0V at INx (leakage current) -1
VIH(ENx) ENx (enable) threshold voltage, rising 0.7 x VCCI(1) V
VIL(ENx) ENx (enable) threshold voltage, falling 0.3 x VCCI
VI_HYS(ENx) ENx (enable) threshold voltage hysteresis 0.1 x VCCI
II(ENx) ENx (enable) input current (integrated pull-up) HIGH Input Current:  VIH = VCCI (1) at ENx  (leakage current) 1 µA
LOW Input Current:  VIL = 0V at ENx (leakage and current through default high pull-up resistance) -10
CMTI_R Common mode transient immunity, device rated for reinforced isolation (DW Package, DFP Package V= VCC or 0V, VCM = 1200V, VENx = VCC; See Section 7  200 250 kV/µs
CMTI_B Common mode transient immunity, device rated for basic isolation  (DBQ Package)   V= VCC or 0V, VCM = 500V, VENx = VCC; See Section 7  100 125 kV/µs
Ci Input Capacitance (2) VI = VCC/ 2 + 0.4×sin(2πft), f = 2MHz, VCC = 2.5V 1.5 pF
VCCI = Input-side VCC; VCCO = Output-side VCC
Measured from input pin to same side ground.