SLLSG01B September   2024  – November 2025 ISO6440 , ISO6441 , ISO6442

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics—5V Supply
    10. 6.10 Supply Current Characteristics—5V Supply
    11. 6.11 Electrical Characteristics—3.3V Supply
    12. 6.12 Supply Current Characteristics—3.3V Supply
    13. 6.13 Electrical Characteristics—2.5V Supply 
    14. 6.14 Supply Current Characteristics—2.5V Supply
    15. 6.15 Switching Characteristics—5V Supply
    16. 6.16 Switching Characteristics—3.3V Supply
    17. 6.17 Switching Characteristics—2.5V Supply
    18. 6.18 Insulation Characteristics Curves
    19. 6.19 Typical Characteristics
  8.   27
  9. 7 Parameter Measurement Information
  10. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 8.4 Device Functional Modes
    5. 8.5 Device I/O Schematics
    6. 8.6 Overvoltage Tolerant Input
  11. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  12. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Device Nomenclature
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  13. 11Revision History
  14. 12Mechanical, Packaging, and Orderable Information
    1.     58
    2.     59
    3.     60

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBQ|16
  • DW|16
  • DFP|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The ISO644x devices are general purpose digital isolators designed for applications requiring up to 5000VRMS isolation rating per UL 1577. The devices are also certified by VDE, TUV, CSA, and CQC.

The ISO644x devices provide high EMC performance while isolating CMOS or LVCMOS digital I/Os. ISO644x uses SiO2 as the isolation barrier. Each isolation channel has a logic input and output buffer separated by the insulation barrier. These devices come with enable pins that can be used to put the respective outputs in high impedance.

The ISO6440 and ISO6440F devices have all channels in the forward direction. TheISO6441and ISO6441F devices have one reverse-direction channel.The ISO6442 and ISO6442F devices have two reverse-direction channels.

In the event of input power or signal loss, the default output is high for devices without the suffix F and low for devices with the suffix F. See the Device Functional Modes section for further details.

Package Information
PART NUMBER(1) PACKAGE PACKAGE SIZE(2)

ISO6440, ISO6440F

ISO6441, ISO6441F

ISO6442, ISO6442F

 Wide-SOIC (DW-16)(3) 10.3mm × 10.3mm
Wide-SSOP (DFP-16)(3) 10.3mm × 4.6mm
SSOP (DBQ-16)(3) 6mm × 4.9mm
(1) For more information, see Section 12.
(2) The package size (length × width) is a nominal value and includes pins, where applicable.
(3) Please refer to Packaging Information table on the Package Option Addendum page in the Mechanical, Packaging, and Orderable Information section for Production or Preproduction status for specific device and package.
ISO6440 ISO6441 ISO6442 Simplified Schematic
VCCI=Input supply, VCCO=Output supply
GNDI=Input ground, GNDO=Output ground
Simplified Schematic