SLLSG01B September   2024  – November 2025 ISO6440 , ISO6441 , ISO6442

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics—5V Supply
    10. 6.10 Supply Current Characteristics—5V Supply
    11. 6.11 Electrical Characteristics—3.3V Supply
    12. 6.12 Supply Current Characteristics—3.3V Supply
    13. 6.13 Electrical Characteristics—2.5V Supply 
    14. 6.14 Supply Current Characteristics—2.5V Supply
    15. 6.15 Switching Characteristics—5V Supply
    16. 6.16 Switching Characteristics—3.3V Supply
    17. 6.17 Switching Characteristics—2.5V Supply
    18. 6.18 Insulation Characteristics Curves
    19. 6.19 Typical Characteristics
  8.   27
  9. 7 Parameter Measurement Information
  10. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 8.4 Device Functional Modes
    5. 8.5 Device I/O Schematics
    6. 8.6 Overvoltage Tolerant Input
  11. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  12. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Device Nomenclature
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  13. 11Revision History
  14. 12Mechanical, Packaging, and Orderable Information
    1.     58
    2.     59
    3.     60

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBQ|16
  • DW|16
  • DFP|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Power Ratings

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ISO6440 (default high) and ISO6440F (default low, with F suffix)
PD Maximum power dissipation (both sides) VCC1 = VCC2 = 5.5V, TJ = 150°C, CL = 15pF, Input a 75MHz 50% duty cycle square wave 268.2 mW
PD1 Maximum power dissipation (side-1) 58.1 mW
PD2 Maximum power dissipation (side-2) 210.1 mW
ISO6441 (default high) and ISO6441F (default low, with F suffix)
PD Maximum power dissipation (both sides) VCC1 = VCC2 = 5.5V, TJ = 150°C, CL =15pF, Input a 75MHz 50% duty cycle square wave 262.2 mW
PD1 Maximum power dissipation (side-1) 94.1 mW
PD2 Maximum power dissipation (side-2) 168.1 mW
ISO6442 (default high) and ISO6442F (default low, with F suffix)
PD Maximum power dissipation (both sides) VCC1 = VCC2 = 5.5V, TJ = 150°C, CL = 15pF, Input a 75MHz 50% duty cycle square wave 268 mW
PD1 Maximum power dissipation (side-1) 134 mW
PD2 Maximum power dissipation (side-2) 134 mW