SLOSEB6D February   2025  – November 2025 LMH13000

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics for Low-Current Mode, MODE = 0
    6. 5.6 Electrical Characteristics for High-Current Mode, MODE = 1
    7. 5.7 Typical Characteristics
    8. 5.8 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Constant Current (ICC)
      2. 6.3.2 Propagation Delay With Temperature
        1. 6.3.2.1 Calibration of Propagation Delay With Temperature
        2. 6.3.2.2 Start Pulse Directly From IOUT
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Optical Time-of-Flight System
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
      2. 7.2.2 Automatic Power-Control Loop Using the LMH13000
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RQE|13
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) LMH13000 UNIT
RQE (VQFN-HR)
13 PINS
RθJA Junction-to-ambient thermal resistance 30 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 28 °C/W
RθJB Junction-to-board thermal resistance 14.5 °C/W
ΨJT Junction-to-top characterization parameter 0.4 °C/W
ΨJB Junction-to-board characterization parameter 14 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 1 °C/W
(1) For information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.