SLOSEB6D February   2025  – November 2025 LMH13000

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics for Low-Current Mode, MODE = 0
    6. 5.6 Electrical Characteristics for High-Current Mode, MODE = 1
    7. 5.7 Typical Characteristics
    8. 5.8 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Constant Current (ICC)
      2. 6.3.2 Propagation Delay With Temperature
        1. 6.3.2.1 Calibration of Propagation Delay With Temperature
        2. 6.3.2.2 Start Pulse Directly From IOUT
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Optical Time-of-Flight System
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
      2. 7.2.2 Automatic Power-Control Loop Using the LMH13000
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RQE|13
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.5 Electrical Characteristics for Low-Current Mode, MODE = 0

at TA = 25°C, PVDD = AVDD = 5V, RBIAS = AVDD, MODE = 0, PD = 0, and snubber as Figure 5-31 (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
IOUT DC PERFORMANCE
IOUT Adjustable current(1) VSET = 0.01V to 2V TA = –40℃ to +125℃ 0.005 1 A
IOUT accuracy IOUT = 0.1A ±14.5 %
IOUT = 1A ±5.5
IOUT variation IOUT = 0.1A TA = –40℃ to +125℃ ±3.5 %
IOUT = 1A TA = –40℃ to +125℃ ±1
MINVIOUT Minimum VIOUT(2)  IOUT = 0.1A  TA = –40℃ to +125℃ 0.7 V
IOUT = 1A  TA = –40℃ to +125℃ 2.1
ILEAK Leakage current at IOUT PD = 1 or LVDS = 0   170 nA
TA = –40℃ to +125℃ 48 µA
MAXVIOUT Maximum VIOUT 18 V
IOUT AC PERFORMANCE (RDAMP = 1Ω,  LLOAD = 1nH), SEE Figure 5-31
CIOUT IOUT impedance Parallel capacitance(3) See Figure 5-12 pF
LIOUT IOUT impedance Series inductance(4) 100 pH
IOUT noise IOUT = 100mA,
integration bandwidth = 100MHz		 TA = –40℃ to +125℃ 60 µARMS
tr IOUT rise time  IOUT = 1A, VLD = 4V 0.4 ns
TA = –40℃ to +125℃ 0.5
tf IOUT fall time  IOUT = 1A, VLD = 4V 0.3 ns
TA = –40℃ to +125℃ 0.4
IOUT overshoot IOUT = 1A, VLD = 4V 23 %
IOUT undershoot IOUT = 1A, VLD = 4V 10 %
IOUT settling time IOUT = 1A, 10% settling 3 ns
VSET (IOUT CONTROL PIN) 
VSET input bias current TA = –40℃ to +125℃ 50 nA
VSET input impedance 4 || 8 GΩ || pF
VSET VSET pin voltage For IOUT = 0.005A to 1A 0.01 2 V
k Scaling factor for VSET to IOUT IOUT = VSET / RSET × k 10000
IOUT / VSET bandwidth  800 kHz
RSET Recommended resistor on RSET 20 kΩ
CONSTANT CURRENT (ICC), FOR MODE = 0 AND MODE = 1
ICC Constant current For RBIAS = 25kΩ to 500Ω  4 200 mA
Disable Connect RBIAS AVDD V
Accuracy  ICC = 100mA ±5.5 %
TA = –40℃ to +125℃ ±7.5
LVDS INPUT
LVDS to IOUT propagation delay  IOUT = 1A 10 ns
TA = –40℃ to +125℃ 13
Frequency (LVDS/TTL/CMOS) 250 MHz
EP and EN voltage  VCM ± VDIFF(5) f > 10MHz AGND + 0.5 AVDD – 0.5 V
DC and f < 10MHz AGND AVDD
IOUT jitter f < 250MHz, 50% duty cycle 6 ps
POWER SUPPLY
Static quiescent current LVDS = 0, VSET = 0.2V 7 mA
TA = –40℃ to +125℃ 8
Dynamic quiescent current  ΔLVDS at 10MHz, IOUT = 1A 13 mA
ΔLVDS at 250MHz, IOUT = 1A 80 mA
THERMAL SHUTDOWN, FOR MODE = 0 AND MODE = 1
TSHD Thermal shutdown temperature 160 ℃
Thermal shutdown hysteresis 10 ℃
Die thermal time constant Device mounted on a JEDEC PCB See Figure 5-28
MODE, FOR MODE = 0 AND MODE = 1
Operating mode Low-current mode, MODE = 0 TA = –40℃ to +125℃ AGND + 1.2 V
High-current mode, MODE = 1 TA = –40℃ to +125℃ AVDD – 1.2
POWER DOWN, FOR MODE = 0 AND MODE = 1
IPD Power-down current TA = –40℃ to +125℃ 35 µA
Enable voltage threshold PD = 0 TA = –40℃ to +125℃ AGND + 1.2 V
Disable voltage threshold PD = 1 TA = –40℃ to +125℃ AVDD – 1.2 V
Turn-on time delay PD = 1 → 0 TA = –40℃ to +125℃ 15 µs
Turn-off time delay PD = 0 → 1 TA = –40℃ to +125℃ 1 µs
(1) The LMH13000 continues to operate for VSET greater than the mentioned limits; however, lifetime reliability is not guaranteed.
(2) Maintain MINVIOUT to provide IOUT accuracy. If IOUT accuracy is not critical, lower this specification further to improve thermal performance.
(3) CIOUT is the capacitance from the IOUT pin to PGND pin.
(4) LIOUT is the series inductance from the IOUT pin to the drain of the internal FET.
(5) Voltages applied on EP and EN remain at least 0.5V from either rail only for high-frequency operation. For low-frequency operation, EP and EN can go up to either rail.