SLOSEB6D February   2025  – November 2025 LMH13000

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics for Low-Current Mode, MODE = 0
    6. 5.6 Electrical Characteristics for High-Current Mode, MODE = 1
    7. 5.7 Typical Characteristics
    8. 5.8 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Constant Current (ICC)
      2. 6.3.2 Propagation Delay With Temperature
        1. 6.3.2.1 Calibration of Propagation Delay With Temperature
        2. 6.3.2.2 Start Pulse Directly From IOUT
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Optical Time-of-Flight System
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
      2. 7.2.2 Automatic Power-Control Loop Using the LMH13000
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RQE|13
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.6 Electrical Characteristics for High-Current Mode, MODE = 1

at TA = 25°C, PVDD = AVDD = 5V, RBIAS = AVDD, MODE = 1, PD = 0, and snubber as Figure 5-31 (unless otherwise noted) 
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
IOUT DC PERFORMANCE
IOUT Adjustable current(4) VSET = 0.1V to 2V TA = –40℃ to +125℃ 0.25 5 A
IOUT accuracy IOUT = 0.5A ±10.5 %
IOUT = 2A ±6
IOUT = 5A ±4
IOUT variation IOUT = 0.5A TA = –40℃ to +125℃ ±2.5 %
IOUT = 2A TA = –40℃ to +125℃ ±1.3
IOUT = 5A TA = –40℃ to +125℃ ±0.9
MINVIOUT Minimum VIOUT(1) IOUT = 0.5A  TA = –40℃ to +125℃ 0.7 V
IOUT = 5A  TA = –40℃ to +125℃ 2.2
ILEAK Leakage current at IOUT PD = 1 or LVDS = 0, 0.35 µA
TA = –40℃ to +125℃ 100
MAXVIOUT Maximum VIOUT 18 V
IOUT AC PERFORMANCE (RDAMP = 1Ω,  LLOAD = 1nH), SEE Figure 5-31
CIOUT IOUT impedance Parallel capacitance(2) See Figure 5-12 pF
LIOUT IOUT impedance Series inductance(3) 100 pH
IOUT noise IOUT = 0.5A, 
integration bandwidth = 100MHz		 TA = –40℃ to +125℃ 200 µARMS
tr IOUT rise time  IOUT = 2A, VLD = 6V 0.5 ns
TA = –40℃ to +125℃ 0.6
tf IOUT fall time  IOUT = 2A, VLD = 6V 0.5 ns
TA = –40℃ to +125℃ 0.7
IOUT overshoot IOUT = 2A, VLD = 6V 20 %
IOUT undershoot IOUT = 2A, VLD = 6V 15 %
IOUT settling time IOUT = 2A, 10% settling 4 ns
TA = –40℃ to +125℃ 6
VSET (IOUT CONTROL PIN) 
VSET VSET pin voltage For IOUT = 0.25A to 5A 0.1 2 V
k Scaling factor for VSET to IOUT IOUT = VSET / RSET × k 50000
IOUT / VSET bandwidth  600 kHz
LVDS INPUT
LVDS to IOUT propagation delay IOUT = 2A 9 ns
TA = –40℃ to +125℃ 13
IOUT = 5A 9
TA = –40℃ to +125℃ 10
Frequency (LVDS/TTL/CMOS) 250 MHz
IOUT jitter f < 250MHz, 50% duty cycle 7 ps
POWER SUPPLY
Static quiescent current LVDS = 0, VSET = 0.2V 23.5 mA
TA = –40℃ to +125℃ 24
Dynamic quiescent current ΔLVDS at 10MHz, IOUT = 5A 50 mA
ΔLVDS at 200MHz, IOUT = 5A 360
(1) Maintain MINVIOUT to provide IOUT accuracy. If IOUT accuracy is not critical, lower this specification further to improve thermal performance.
(2) CIOUT is the capacitance from the IOUT pin to PGND pin.
(3) LIOUT is the series inductance from the IOUT pin to the drain of the internal FET.
(4) The LMH13000 continues to operate for VSET greater than mentioned limits; however lifetime reliability is not guaranteed.