SDLS967H may 2016 – july 2023 LSF0108-Q1
PRODMIX
THERMAL METRIC(1) | LSF0108-Q1 | UNIT | ||
---|---|---|---|---|
PW (TSSOP) | WRKS (VQFN) | |||
20 PINS | 20 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 108.8 | 74.3 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 45.7 | 76.6 | °C/W |
RθJB | Junction-to-board thermal resistance | 61.8 | 46.6 | °C/W |
ΨJT | Junction-to-top characterization parameter | 10.4 | 13.9 | °C/W |
ΨJB | Junction-to-board characterization parameter | 61.1 | 46.5 | °C/W |