SLVS568E January   2005  – July 2025 TLV341 , TLV341A , TLV342 , TLV342S

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information: TLV341
    5. 5.5  Thermal Information: TLV342
    6. 5.6  Thermal Information: TLV342S
    7. 5.7  Electrical Characteristics: V+ = 1.8V
    8. 5.8  Electrical Characteristics: V+ = 5V
    9. 5.9  Shutdown Characteristics: V+ = 1.8V
    10. 5.10 Shutdown Characteristics: V+ = 5V
    11. 5.11 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 PMOS Input Stage
      2. 6.3.2 CMOS Output Stage
      3. 6.3.3 Shutdown
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.5 Thermal Information: TLV342

THERMAL METRIC(1) TLV342 UNIT
D
(SOIC)		 DGK
(MSOP)		 RUG
(X2QFN)
8 PINS 8 PINS 10 PINS
RθJA Junction-to-ambient thermal resistance 123.6 192.3 167 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 69.8 78.2 56.5 °C/W
RθJB Junction-to-board thermal resistance 63.9 112.6 94.3 °C/W
ψJT Junction-to-top characterization parameter 24.4 15.2 4.1 °C/W
ψJB Junction-to-board characterization parameter 63.4 111.2 94 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.