SBOS833R October   2017  – November 2021 TLV9001 , TLV9002 , TLV9004

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information: TLV9001
    5. 7.5  Thermal Information: TLV9001S
    6. 7.6  Thermal Information: TLV9002
    7. 7.7  Thermal Information: TLV9002S
    8. 7.8  Thermal Information: TLV9004
    9. 7.9  Thermal Information: TLV9004S
    10. 7.10 Electrical Characteristics
    11. 7.11 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Operating Voltage
      2. 8.3.2 Rail-to-Rail Input
      3. 8.3.3 Rail-to-Rail Output
      4. 8.3.4 EMI Rejection
    4. 8.4 Overload Recovery
    5. 8.5 Shutdown
    6. 8.6 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 TLV900x Low-Side, Current Sensing Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Single-Supply Photodiode Amplifier
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Input and ESD Protection
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DPW|5
  • DBV|5
  • DBV|6
  • DCK|5
  • DCK|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision Q (June 2021) to Revision R (November 2021)

  • Added SOT-23 (14) package to Device Information tableGo
  • Added SOT-23 DYY package to Device Comparison Table Go
  • Added SOT-23 (14) package to Pin Configuration and Functions section Go
  • Added DYY (SOT-23) package thermal information to the Thermal Information: TLV9004 tableGo

Changes from Revision P (April 2021) to Revision Q (June 2021)

  • Changed supply voltage (V+) – (V–) MAX from 6 V to 7 V in the Absolute Maximum Ratings tableGo

Changes from Revision O (April 2020) to Revision P (April 2021)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added 9-pin DSBGA package to Device Information tableGo
  • Added 9-pin DSBGA package to Device Comparison Table Go
  • Added TLV9002S 9-pin DSBGA package to Pin Configuration and Functions sectionGo
  • Added TLV9002S 9-pin DSBGA package to Thermal Information: TLV9002S Go
  • Deleted the Related Links section from the Device and Documentation Support sectionGo

Changes from Revision N (January 2020) to Revision O (April 2020)

  • Deleted PREVIEW designation on TLV9001S Go
  • Deleted TLV9001SIDCK (6-pin SC70) package preview note Go
  • Added DCK (SC70) data to the Thermal Information: TLV9001S table Go

Changes from Revision M (September 2019) to Revision N (January 2020)

  • Added 6-pin SC70 package to Device Information tableGo
  • Added 6-pin SC70 package to Device Comparison Table Go
  • Added TLV9001SIDCK (6-Pin SC70) package pinoutGo
  • Added TLV9001S 6-pin SC70 package to Pin Configuration and Functions sectionGo
  • Added 6-pin SC70 pinout to Pin Functions: TLV9001S Go
  • Added TLV9001S 6-pin SC70 package to Thermal Information: TLV9001S tableGo

Changes from Revision L (May 2019) to Revision M (September 2019)

  • Deleted preview notations for SOT-23-8 (DDF) packageGo
  • Added link to Shutdown section in all SHDN pin function rowsGo
  • Added EMI Rejection section to the Feature Description sectionGo
  • Changed the Shutdown section to add more clarity regarding internal pull-up resistorGo

Changes from Revision K (March 2019) to Revision L (May 2019)

  • Added SOT-23 (8) information to Device Information tableGo
  • Added SOT-23 DDF package to Device Comparison Table Go
  • Added SOT-23 (DDF) to Pin Configuration and Functions sectionGo
  • Added DDF (SOT-23) Thermal Information: TLV9002 tableGo

Changes from Revision J (January 2019) to Revision K (March 2019)

  • Changed TLV9002S ESD Ratings heading to include all TLV9002S packagesGo
  • Deleted preview notation from TLV9002SIRUG in Thermal Information tableGo

Changes from Revision I (November 2018) to Revision J (January 2019)

  • Deleted preview notation for TLV9002SIRUGRGo
  • Changed TLV9004 WQFN(14) package designator to X2QFN(14) package designatorGo
  • Added RUG package to Device Comparison Table Go
  • Added DGS package to Device Comparison Table Go
  • Added shutdown devices to Device Comparison Table Go
  • Changed TLV9001 DRL package pinout drawingGo
  • Changed TLV9001 DRL package pin functionsGo
  • Deleted package preview note from TLV9002SIRUGR (X2QFN) pinout drawingGo
  • Added TLV9004IRUC Thermal InformationGo
  • Changed legend of Closed-Loop Gain vs Frequency plotGo

Changes from Revision H (October 2018) to Revision I (November 2018)

  • Added TLV9002SIDGS to ESD Ratings tableGo

Changes from Revision G (September 2018) to Revision H (October 2018)

  • Changed From: TLV9001 DCK Package To: TLV9001T DCK PackageGo

Changes from Revision F (August 2018) to Revision G (September 2018)

  • Added Device Comparison Table Go
  • Changed pin names for all devices and all packagesGo
  • Changed pin names and I/O designation on some TLV9001 pins Go
  • Changed the pin number for V+ in the SOIC, TSSOP column of the Pin Functions: TLV9004 tableGo

Changes from Revision E (July 2018) to Revision F (August 2018)

  • Added Scalabe CMOS Amplifier for Low-Cost Applications featureGo
  • Deleted PREVIEW designation on TLV9002 and TLV9004 devices with the TSSOP package. Go
  • Added TLV9001U DBV (SOT-23) pinout drawing to Pin Configuration and Functions section Go
  • Added SOT-23 U Pinout to Pin Functions section Go

Changes from Revision D (June 2018) to Revision E (July 2018)

  • Corrected typo in Description section Go
  • Added TLV9001 5-pin X2SON package to Device Information table Go
  • Added TLV9001S 6-pin SOT-23 package to Device Information tableGo
  • Added TLV9004 14-pin and 16-pin WQFN packages to Device Information table Go
  • Added TLV9001 DPW (X2SON) pinout drawing to Pin Configuration and Functions sectionGo
  • Added TLV9001S 6-pin SOT-23 package to Pin Configuration and Functions sectionGo
  • Added TLV9004 RTE pinout information to Pin Configuration and Functions section Go
  • Added DPW (X2SON) and DRL (SOT-553) packages to Thermal Information: TLV9001 tableGo
  • Added Thermal Information: TLV9001S table to Specifications sectionGo
  • Added RUG (X2QFN) package to Thermal Information: TLV9002 tableGo
  • Added RTE (WQFN) and RUC (WQFN) packages to Thermal Information: TLV9004 tableGo

Changes from Revision C (May 2018) to Revision D (June 2018)

  • Added shutdown text to Description sectionGo
  • Added TLV9002S and TLV9004S devices to Device Information tableGo
  • Added TLV9002S 10-pin X2QFN package to Device Information tableGo
  • Added TLV9002S DGS package pinout information to Pin Configurations and Functions sectionGo
  • Added Thermal Information: TLV9001 table to Specifications sectionGo
  • Added Thermal Information: TLV9004 table to Specifications sectionGo
  • Added shutdown section to Electrical Characteristics: VS (Total Supply Voltage) = (V+) – (V–) = 1.8 V to 5.5 V tableGo
  • Added Shutdown sectionGo

Changes from Revision B (March 2018) to Revision C (May 2018)

  • Added TLV9002 16-pin TSSOP package to Device Information tableGo
  • Added TLV9002 10-pin X2QFN package to Device Information tableGo
  • Added TLV9002S DGS package pinout drawing in Pin Configurations and Functions sectionGo
  • Added TLV9004 pinout diagram and pin configuration table to Pin Configuration and Functions section Go
  • Added TLV9004S pinout diagram and pin configuration table to Pin Configuration and Functions section Go
  • Changed TLV9002 D (SOIC) junction-to-ambient thermal resistance value from 147.4°C/W to 207.9°C/WGo
  • Changed TLV9002 D (SOIC) junction-to-case (top) thermal resistance from 94.3°C/W to 92.8°C/WGo
  • Changed TLV9002 D (SOIC) junction-to-board thermal resistance from 89.5°C/W to 129.7°C/WGo
  • Changed TLV9002 D (SOIC) junction-to-top characterization parameter from 47.3°C/W to 26°C/WGo
  • Changed TLV9002 D (SOIC) junction-to-board characterization parameter from 89°C/W to 127.9°C/WGo
  • Added DGK (VSSOP) thermal information to Thermal Information: TLV9002 table Go
  • Added TLV9002 PW (TSSOP) thermal information to Thermal Information: TLV9002 tableGo
  • Added PW (TSSOP) thermal information to Thermal Information: TLV9002 table Go

Changes from Revision A (December 2017) to Revision B (March 2018)

  • Added package preview notes to TLV9001 packages, TLV9004 packages, and TLV9002 8-pin VSSOP package in Device Information table Go
  • Added package preview notes to TLV9001, TLV9004 and TLV9002 VSSOP package pinout drawings in Pin Configuration and Functions section Go
  • Deleted package preview note from TLV9002 DSG (WSON) pinout drawing in Pin Configurations and Functions sectionGo
  • Deleted package preview note from TLV9002 RUG (X2QFN) pinout drawing in Pin Configurations and Functions sectionGo
  • Added DSG (WSON) package thermal information to the Thermal Information: TLV9002 tableGo
  • Deleted package preview note from DSG (WSON) package in Thermal Information: TLV9002 tableGo
  • Added D (SOIC) package thermal information to the Thermal Information: TLV9004 tableGo

Changes from Revision * (October 2017) to Revision A (December 2017)

  • Changed device status from Advance Information to Production Data/Mixed StatusGo