SWCS095L August   2013  – February 2019 TPS659038-Q1 , TPS659039-Q1


  1. Device Summary
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Simplified Block Diagram
  2. Revision History
  3. Device Comparison
  4. Pin Configuration and Functions
    1. 4.1 Pin Functions
      1.      Pin Functions
    2. 4.2 Device Ball Mapping – 13 × 13 nFBGA, 169 Balls, 0,8-mm Pitch
    3. 4.3 Signal Descriptions
  5. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics: Latch Up Rating
    6. 5.6  Electrical Characteristics: LDO Regulator
    7. 5.7  Electrical Characteristics: Dual-Phase (SMPS12 and SMPS45) and Triple-Phase (SMPS123 and SMPS457) Regulators
    8. 5.8  Electrical Characteristics: Stand-Alone Regulators (SMPS3, SMPS6, SMPS7, SMPS8, and SMPS9)
    9. 5.9  Electrical Characteristics: Reference Generator (Bandgap)
    10. 5.10 Electrical Characteristics: 16-MHz Crystal Oscillator, 32-kHz RC Oscillator, and Output Buffers
    11. 5.11 Electrical Characteristics: DC-DC Clock Sync
    12. 5.12 Electrical Characteristics: 12-Bit Sigma-Delta ADC
    13. 5.13 Electrical Characteristics: Thermal Monitoring and Shutdown
    14. 5.14 Electrical Characteristics: System Control Thresholds
    15. 5.15 Electrical Characteristics: Current Consumption
    16. 5.16 Electrical Characteristics: Digital Input Signal Parameters
    17. 5.17 Electrical Characteristics: Digital Output Signal Parameters
    18. 5.18 Electrical Characteristics: I/O Pullup and Pulldown Resistance
    19. 5.19 I2C Interface Timing Requirements
    20. 5.20 SPI Timing Requirements
    21. 5.21 Typical Characteristics
  6. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
      1. 6.3.1  Power Management
      2. 6.3.2  Power Resources (Step-Down and Step-Up SMPS Regulators, LDOs)
        1. Step-Down Regulators
          1. Sync Clock Functionality
          2. Output Voltage and Mode Selection
          3. Current Monitoring and Short Circuit Detection
          4. POWERGOOD
          5. DVS-Capable Regulators
          6. Non DVS-Capable Regulators
          7. Step-Down Converters SMPS12 and SMPS123
            1.         a. Dual-Phase SMPS and Stand-Alone SMPS
            2.         b. Triple Phase SMPS
          8. Step-Down Converter SMPS45 and SMPS457
          9. Step-Down Converters SMPS3, SMPS6, SMPS7, SMPS8, and SMPS9
        2. LDOs – Low Dropout Regulators
          1. LDOVANA
          2. LDOVRTC
          3. LDO Bypass (LDO9)
          4. LDOUSB
          5. Other LDOs
      3. 6.3.3  Long-Press Key Detection
      4. 6.3.4  RTC
        1. General Description
        2. Time Calendar Registers
          1. TC Registers Read Access
          2. TC Registers Write Access
        3. RTC Alarm
        4. RTC Interrupts
        5. RTC 32-kHz Oscillator Drift Compensation
      5. 6.3.5  GPADC – 12-Bit Sigma-Delta ADC
        1. Asynchronous Conversion Request (SW)
        2. Periodic Conversion Request (AUTO)
        3. Calibration
      6. 6.3.6  General-Purpose I/Os (GPIO Terminals)
        1. REGEN Output
      7. 6.3.7  Thermal Monitoring
        1. Hot-Die Function (HD)
        2. Thermal Shutdown (TS)
        3. Temperature Monitoring With External NTC Resistor or Diode
      8. 6.3.8  Interrupts
      9. 6.3.9  Control Interfaces
        1. I2C Interfaces
          1. I2C Implementation
          2. F/S Mode Protocol
          3. HS Mode Protocol
        2. SPI Interface
          1. SPI Modes
          2. SPI Protocol
      10. 6.3.10 Device Identification
    4. 6.4 Device Functional Modes
      1. 6.4.1  Embedded Power Controller
      2. 6.4.2  State Transition Requests
        1. ON Requests
        2. OFF Requests
        3. SLEEP and WAKE Requests
      3. 6.4.3  Power Sequences
      4. 6.4.4  Start Up Timing and RESET_OUT Generation
      5. 6.4.5  Power On Acknowledge
        1. POWERHOLD Mode
        2. AUTODEVON Mode
      6. 6.4.6  BOOT Configuration
        1. Boot Terminal Selection
      7. 6.4.7  Reset Levels
      8. 6.4.8  Warm Reset
      9. 6.4.9  RESET_IN
      10. 6.4.10 Watchdog Timer (WDT)
      11. 6.4.11 System Voltage Monitoring
        1. Generating a POR
  7. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1.  Recommended External Components
        2.  SMPS Input Capacitors
        3.  SMPS Output Capacitors
        4.  SMPS Inductors
        5.  LDO Input Capacitors
        6.  LDO Output Capacitors
        7.  VCC1
          1. Meeting the Power Down Sequence
          2. Maintaining Sufficient Input Voltage
        8.  VIO_IN
        9.  16-MHz Crystal
        10. GPADC
      3. 7.2.3 Application Curves
  8. Power Supply Recommendations
  9. Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Device Nomenclature
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Related Links
    4. 10.4 Receiving Notification of Documentation Updates
    5. 10.5 Community Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  11. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Package Materials Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ZWS|169
Thermal pad, mechanical data (Package|Pins)
Orderable Information

System Voltage Monitoring

The power state-machine of the devices are controlled by comparators monitoring the voltage on the VCC_SENSE and VCC1 terminals. For electrical parameters see Section 5.14.

    POR: When the supply at the VCC1 terminal is below the POR threshold, the devices are in the NO SUPPLY state. All functionality, including RTC, is off. When the voltage in VCC1 rises above the POR threshold, the device enters from the NO SUPPLY to the BACKUP state.
    VSYS_LO: When the voltage on VCC1 terminal rises above VSYS_LO, the device enters from the BACKUP state to the OFF state. When the device is in the ACTIVE, SLEEP, or OFF state and the voltage on VCC1 decreases below VSYS_LO, the device enters BACKUP state. When the device transitions from the ACTIVE state to the BACKUP state, all active SMPS and LDO regulators, except LDOVRTC, are disabled simultaneously. When operating with a 16.384-MHz crystal, the regulators are immediately disabled after VCC1 becomes less than VSYS_LO. When operating without a crystal, a 180-µs deglitch time occurs after VCC1 becomes less than VSYS_LO and before the regulators are disabled. The VSYS_LO level is OTP programmable.


    For silicon revision 1.3 or earlier, when operating without a crystal, transitioning from the ACTIVE state to the BACKUP state using VSYS_LO while the outputs are active must always be followed by a POR event to make sure the device is reset properly. See Section 6.3.10 to identify the silicon version in the device.

    VSYS_MON: During power up, the VSYS_HI OTP value is used as a threshold for the VSYS_MON comparator which is gating the PMIC start-up (as a threshold for transition from OFF to ACTIVE state). The VSYS_MON comparator monitors the VCC_SENSE terminal. After power up, software can configure the comparator threshold in the VSYS_MON register.

Figure 6-27 shows a block diagram of the system comparators.

TPS659038-Q1 TPS659039-Q1 System_Comparators_SWCS095.gifFigure 6-27 System Comparators

To use comparators in the system:

  • The VSYS_LO and VSYS_HI thresholds are defined in the OTP. Software cannot change these levels.
  • After start-up, the VSYS_MON comparator is automatically disabled. Software can select a new threshold level using the VSYS_MON register and enable the comparator.
  • In order for the same coding on the rising and falling edge, the VSYS_MON comparator does not include hysteresis and therefore can generate multiple interrupts when the voltage level is at the threshold level. New interrupt generation has a 125-μs debounce time which allows the software to mask the interrupt and update the threshold level or disable the comparator before receiving a new interrupt.

Figure 6-28 shows additional details on the VSYS_MON comparator. When the VSYS_MON comparator is enabled, and the internal buffer is bypassed, input impedance at the VCC_SENSE terminal is 500 kΩ (typical). When the comparators are disabled, the VCC_SENSE terminal is at high impedance mode. If GPADC is enabled to measure channel 6 or channel 7, 40 kΩ is added in parallel to the corresponding comparator. See Table 6-3 for the GPADC input range.

To enable system voltage sensing above 5.25 V, an external resistive divider can be used. Internal buffers are enabled by setting OTP bit HIGH_VCC_SENSE = 1 to provide high impedance for the external resistive dividers. The maximum input level for the internal buffer is VCC1 – 1 V.

TPS659038-Q1 TPS659039-Q1 HIGH_VCC_SENSE.gifFigure 6-28 VSYS_MON Comparator Details