SLVSF29C October   2019  – August 2021 TPS8804

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 System Power-up
      2. 7.3.2 LDO Regulators
        1. 7.3.2.1 Power LDO Regulator
        2. 7.3.2.2 Internal LDO Regulator
        3. 7.3.2.3 Microcontroller LDO Regulator
      3. 7.3.3 Photo Chamber AFE
        1. 7.3.3.1 Photo Input Amplifier
        2. 7.3.3.2 Photo Gain Amplifier
      4. 7.3.4 LED Driver
        1. 7.3.4.1 LED Current Sink
        2. 7.3.4.2 LED Voltage Supply
      5. 7.3.5 Carbon Monoxide Sensor AFE
        1. 7.3.5.1 CO Transimpedance Amplifier
        2. 7.3.5.2 CO Connectivity Test
      6. 7.3.6 SLC Interface Transmitter and Receiver
        1. 7.3.6.1 SLC Transmitter
        2. 7.3.6.2 SLC Receiver
      7. 7.3.7 AMUX
      8. 7.3.8 Analog Bias Block and 8 MHz Oscillator
      9. 7.3.9 Interrupt Signal Alerts
    4. 7.4 Device Functional Modes
      1. 7.4.1 Fault States
        1. 7.4.1.1 MCU LDO Fault
        2. 7.4.1.2 Over-Temperature Fault
    5. 7.5 Programming
    6. 7.6 Register Maps
      1. 7.6.1  REVID Register (Offset = 0h) [reset = 0h]
      2. 7.6.2  STATUS1 Register (Offset = 1h) [reset = 0h]
      3. 7.6.3  STATUS2 Register (Offset = 2h) [reset = 0h]
      4. 7.6.4  MASK Register (Offset = 3h) [reset = 0h]
      5. 7.6.5  CONFIG1 Register (Offset = 4h) [reset = 20h]
      6. 7.6.6  CONFIG2 Register (Offset = 5h) [reset = 0h]
      7. 7.6.7  ENABLE1 Register (Offset = 6h) [reset = 0h]
      8. 7.6.8  ENABLE2 Register (Offset = 7h) [reset = 0h]
      9. 7.6.9  CONTROL Register (Offset = 8h) [reset = 0h]
      10. 7.6.10 GPIO_AMUX Register (Offset = Bh) [reset = 0h]
      11. 7.6.11 COSW Register (Offset = Ch) [reset = 0h]
      12. 7.6.12 CO Register (Offset = Dh) [reset = 0h]
      13. 7.6.13 LEDLDO Register (Offset = Fh) [reset = 0h]
      14. 7.6.14 PH_CTRL Register (Offset = 10h) [reset = 0h]
      15. 7.6.15 LED_DAC_A Register (Offset = 11h) [reset = 0h]
      16. 7.6.16 LED_DAC_B Register (Offset = 12h) [reset = 0h]
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Photo Amplifier Component Selection
        2. 8.2.2.2 LED Driver Component Selection
        3. 8.2.2.3 LED Voltage Supply Selection
        4. 8.2.2.4 Regulator Component Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Photo Amplifier Layout
      2. 10.1.2 CO Amplifier Layout
      3. 10.1.3 Ground Plane Layout
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.4.1 LED Current Sink

The two LED drivers are current regulated, temperature compensated, and adjustable with an 8-bit DAC. When the LED driver is enabled, the CSA voltage is regulated, and the current through the CSA resistor also flows through the LED and the DINA pin. A current sense resistor connects to the CSA pin. The LED driver is enabled with the LEDEN pin and LEDPIN_EN bit. Both the pin and bit must be high for the LED driver to operate. The LEDSEL bit switches which driver the LEDEN signal connects to. The GPIO pin can be configured to enable either LED driver.

The LED driver is temperature compensated to account for reduced LED intensity with increasing temperature. Four temperature compensation settings are available to support a variety of IR and blue LEDs. Temperature compensation is implemented by varying the CSA regulated voltage with temperature, thus the temperature compensation also depends on the CSA resistor. Each temperature compensation setting has a different DAC output at room temperature. To achieve a specific temperature compensation and current, the PDAC, TEMPCO, and CSA resistor must all be adjusted according to the Section 8.2.2.2 procedure.

The two LED drivers are interchangeable and support both IR and blue LEDs. The only difference between the two LED drivers is a code CSA_BIN available to improve the LED A driver current accuracy for IR LEDs. CSA_BIN in register 0x00 categorizes CSA voltage for each unit as close to the minimum, below average, above average, or close to the maximum (see Section 7.6). Use CSA_BIN to adjust the DAC and compensate for the variation on the LED A driver's current. After adjusting the DAC, the effective variation is reduced by a factor of 4 for the TEMPCOA = 11, PDAC_A = 00 setting. IR LEDs typically require the TEMPCOA = 11 temperature compensation setting. Therefore, use the LED driver A for powering IR LEDs. If better accuracy is required, calibrate the LED driver current by connecting the CSA or CSB pin to the microcontroller ADC port, measuring the CSA or CSB voltage, and adjusting PDAC_A or PDAC_B until the required current is achieved.

Ensure that the LED current remains below 550 mA, the pulse width remains below 1 ms, and the duty cycle remains below 1%. There is no protection to prevent operation outside these conditions. Ensure the PDAC and TEMPCO registers are programmed before enabling the LED driver.