SLOSEG3 October   2025 TRF1305A2

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics - AC Specifications in D2D Configuration
    6. 6.6 Electrical Characteristics - AC Specifications in S2D Configuration
    7. 6.7 Electrical Characteristics - DC and Timing Specifications
    8. 6.8 Typical Characteristics: D2D Configuration
    9. 6.9 Typical Characteristics: S2D Configuration
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Fully Differential RF Amplifier
      2. 7.3.2 Output Common-Mode Control
      3. 7.3.3 Internal Resistor Configuration
    4. 7.4 Device Functional Modes
      1. 7.4.1 MODE Pin
        1. 7.4.1.1 Input Common-Mode Extension
      2. 7.4.2 Power-Down Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input and Output Interface Considerations
        1. 8.1.1.1 Single-Ended Input
        2. 8.1.1.2 Differential Input
        3. 8.1.1.3 DC-Coupling Considerations
      2. 8.1.2 Gain Adjustment With External Resistors in a Differential Input Configuration
    2. 8.2 Typical Application
      1. 8.2.1 TRF1305A2 as ADC Driver in a Zero-IF Receiver
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Supply Voltages
      2. 8.3.2 Single-Supply Operation
      3. 8.3.3 Split-Supply Operation
      4. 8.3.4 Supply Decoupling
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Thermal Considerations
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RYP|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4.1 MODE Pin

The TRF1305x2 have additional useful features that are configurable using the MODE pin. To select the device mode, either connect a ±2% maximum tolerance pullup resistor between the MODE pin and VS2+, or force a voltage on the MODE pin. Internally, the MODE pin is referenced to VS– through a 3kΩ resistor (see Section 7.2). The selected mode applies to both channels.

Table 7-2 provides the value of the pullup resistor for each mode, the expected voltage (VMODE) at the MODE pin when the pullup resistor is used, or the necessary VMODE voltage to set the device mode and the mode configurations. The VMODE voltage thresholds are approximately midway between the typical VMODE voltage of the adjacent mode. If mode functionality is used, use a decoupling capacitor on the MODE pin.

Table 7-2 MODE Pin Configuration
MODE NUMBER PULLUP RESISTOR TO VS2+
(±2% MAXIMUM TOLERANCE)		 MODE PIN VOLTAGE, VMODE (V) VICM RANGE EXTENSION(1)
0 OPEN VS– Default VICM range
1 25.6kΩ VS– + 0.52V Low side, extends VICM range closer to VS–
2 12.8kΩ VS– + 0.94V High side, extends VICM range closer to VS+
N/A Do not use pullup resistor < 10kΩ, do not set VMODE > VS– + 1.15V
(1) Only available in D2D configuration.

To switch the mode without turning the supplies off, use a switch or MUX connected between the pullup resistor options and VS2+, or force a mode-appropriate VMODE voltage. However, best practice is to power down the device using the power-down feature between mode changes; see also Section 7.4.2. The low-side VICM range extension mode sources current, and the high-side sinks current; see also the following section, Input Common-Mode Extension. Maintain that the external circuitry is ready to sink or source these currents before the device is put in the active mode from the powered-down state.