SLOSEG3 October   2025 TRF1305A2

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics - AC Specifications in D2D Configuration
    6. 6.6 Electrical Characteristics - AC Specifications in S2D Configuration
    7. 6.7 Electrical Characteristics - DC and Timing Specifications
    8. 6.8 Typical Characteristics: D2D Configuration
    9. 6.9 Typical Characteristics: S2D Configuration
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Fully Differential RF Amplifier
      2. 7.3.2 Output Common-Mode Control
      3. 7.3.3 Internal Resistor Configuration
    4. 7.4 Device Functional Modes
      1. 7.4.1 MODE Pin
        1. 7.4.1.1 Input Common-Mode Extension
      2. 7.4.2 Power-Down Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input and Output Interface Considerations
        1. 8.1.1.1 Single-Ended Input
        2. 8.1.1.2 Differential Input
        3. 8.1.1.3 DC-Coupling Considerations
      2. 8.1.2 Gain Adjustment With External Resistors in a Differential Input Configuration
    2. 8.2 Typical Application
      1. 8.2.1 TRF1305A2 as ADC Driver in a Zero-IF Receiver
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Supply Voltages
      2. 8.3.2 Single-Supply Operation
      3. 8.3.3 Split-Supply Operation
      4. 8.3.4 Supply Decoupling
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Thermal Considerations
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RYP|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics - AC Specifications in D2D Configuration

at TA = 25℃, VS+ = 5V, VS– = 0V, floating VOCM, PD, and MODE pins, VICM = midsupply, D2D ac-coupled input/output with differential source impedance (ZS) = 100Ω, differential output load (ZL) = 100Ω, external input resistor network (see Figure 8-6), and inputs de-embedded up to RIN_SH and outputs up to the device pins (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
AC PERFORMANCE
SSBW Small-signal bandwidth (3dB) PIN = –20dBm at each input 5.8 GHz
Small-signal bandwidth (1dB) PIN = –20dBm at each input 5.2
LSBW Large-signal bandwidth (3dB) Differential PIN = –8dBm 5.8 GHz
Large-signal bandwidth (1dB) Differential PIN = –8dBm 5.2
Sdd21 Power gain f = 500MHz 14.4 dB
f = 4GHz 15.9
Gain variation over temperature f = 4GHz, TA = –40℃ to +85℃ 1.3 dB
Sdd11 Input return loss f = 10MHz to 5GHz –11 dB
Sdd12 Reverse isolation f < 5GHz (device enabled) –25 dB
Gain mismatch between channels f = 10MHz to 5GHz ±0.1 dB
Phase mismatch between channels f = 10MHz to 5GHz ±0.5 °
Crosstalk between channels f = 1GHz –62 dBc
OP1dB Output 1dB compression point f = 500MHz 15.5 dBm
f = 1GHz 15.4
f = 2GHz 15
f = 3GHz 13.7
f = 4GHz 11.6
f = 5GHz 9.1
HD2 Second-order harmonic distortion VO = 2VPP (PO = 7dBm) f = 500MHz –82 dBc
f = 1GHz –69
f = 2GHz –66
f = 3GHz –60
f = 4GHz –58
HD3 Third-order harmonic distortion VO = 2VPP (PO = 7dBm) f = 500MHz –67 dBc
f = 1GHz –56
f = 2GHz –53
f = 3GHz –62
f = 4GHz –51
OIP2 Output second-order intercept point PO = 1dBm per tone,
2MHz spacing		 f = 500MHz 80 dBm
f = 1GHz 71
f = 2GHz 62
f = 3GHz 57
f = 4GHz 55
f = 5GHz 51
OIP3 Output third-order intercept point PO = 1dBm per tone,
2MHz spacing		 f = 500MHz 45 dBm
f = 1GHz 39.5
f = 2GHz 32.5
f = 3GHz 26
f = 4GHz 21
f = 5GHz 18
NF Noise figure f = 500MHz 7.3 dB
f = 1GHz 7.8
f = 2GHz 9.2
f = 3GHz 10.8
f = 4GHz 11.7
f = 5GHz 12.1
NSD Output noise spectral density f = 500MHz –152 dBm/Hz
f = 1GHz –151.5
f = 2GHz –149.8
f = 3GHz –147.2
f = 4GHz –146.2
f = 5GHz –147.9