JAJSJG6A december   2021  – june 2023 TDP0604

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
    9. 6.9 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  4-Level Inputs
      2. 8.3.2  I/O Voltage Level Selection
      3. 8.3.3  HPD_OUT
      4. 8.3.4  Lane Control
      5. 8.3.5  Swap
      6. 8.3.6  Linear and Limited Redriver
      7. 8.3.7  Main Link Inputs
      8. 8.3.8  Receiver Equalizer
      9. 8.3.9  CTLE Bypass
      10. 8.3.10 Input Signal Detect
      11. 8.3.11 Main Link Outputs
        1. 8.3.11.1 Transmitter Bias
        2. 8.3.11.2 Transmitter Impedance Control
        3. 8.3.11.3 TX Slew Rate Control
        4. 8.3.11.4 TX Pre-Emphasis and De-Emphasis Control
        5. 8.3.11.5 TX Swing Control
      12. 8.3.12 DDC Buffer
      13. 8.3.13 HDMI DDC Capacitance
      14. 8.3.14 DisplayPort
    4. 8.4 Device Functional Modes
      1. 8.4.1 MODE Control
        1. 8.4.1.1 I2C Mode (MODE = "F")
        2. 8.4.1.2 Pin Strap Modes
          1. 8.4.1.2.1 Pin-Strap: HDMI 1.4 and HDMI 2.0 Functional Description
      2. 8.4.2 DDC Snoop Feature
        1. 8.4.2.1 HDMI Type
      3. 8.4.3 Low Power Modes
    5. 8.5 Programming
      1. 8.5.1 Pseudocode Examples
        1. 8.5.1.1 HDMI 2.0 Source Example with DDC Snoop and DDC Buffer Enabled
      2. 8.5.2 TDP0604 I2C Address Options
      3. 8.5.3 I2C Target Behavior
    6. 8.6 Register Maps
      1. 8.6.1 TDP0604 Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Source-Side Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Pre-Channel (LAB)
        2. 9.2.2.2 Post-Channel (LCD)
        3. 9.2.2.3 Common Mode Choke
        4. 9.2.2.4 ESD Protection
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Supply Decoupling
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 ドキュメントの更新通知を受け取る方法
    3. 10.3 サポート・リソース
    4. 10.4 Trademarks
    5. 10.5 静電気放電に関する注意事項
    6. 10.6 用語集
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

8.3.13 HDMI DDC Capacitance

The HDMI specification limits the DDC bus capacitance to ≤ 50-pF for both an HDMI source and sink. Therefore, care must be taken to make sure the total capacitance of all components (TDP0604, FR4 trace, ESD, source, and sink) is less than 50-pF.

The TDP0604s DDC Buffer offers capacitance isolation between the LV DDC pins and the HV DDC pin. The total capacitance of components, including the FR4 trace, between the TDP0604 HV_DDC_SDA/SCL pins and the HDMI receptacle must be ≤ (50-pF – CIOHV).

If implementing a DDC level shifter using pass gates, then the total capacitance will include all components between source or sink and the HDMI receptacle. These components include and are not limited to Source or Sink, the FR4 trace, ESD components, and TDP0604.

Note: Trace capacitance can be in the range of 2 to 5-pF per inch. A general rule is a 50-Ω FR4 trace will be around 3.3-pF per inch.