SLVA888C April   2017  – January 2021 TPS65987D , TPS65988

 

  1.   Trademarks
  2. 1Schematic Design Guidelines
    1. 1.1  Power Supply Scheme
      1. 1.1.1 VIN_3V3
      2. 1.1.2 LDO_3V3
      3. 1.1.3 LDO_1V8
    2. 1.2  Boot Configuration
      1. 1.2.1 BUSPOWER (ADCIN1)
      2. 1.2.2 External SPI Flash
    3. 1.3  I2C Interface
      1. 1.3.1 I2C Pin Address Setting (ADCIN2)
    4. 1.4  HRESET
    5. 1.5  Configuration Channel / VCONN Lines
      1. 1.5.1 PP_CABLE
    6. 1.6  Battery Charger Detection and Advertisement (BC1.2)
    7. 1.7  GPIOs
    8. 1.8  Hot Plug Detect or HPD Line
    9. 1.9  PP_EXT Power Path Control
    10. 1.10 Power Path Considerations
  3. 2Layout Guidelines
    1. 2.1 Power Domain
    2. 2.2 Hi Speed Lines
    3. 2.3 Other Considerations
  4. 3Summary
  5. 4References
  6.   A Appendix
    1.     A.1 Dead Battery Considerations
    2.     A.2 TPS65987DDH Schematic Checklist
    3.     A.3 TPS65987DDH System Checklist
  7.   Revision History

1.2.2 External SPI Flash

SPI Flash must be powered from LDO_3V3 when used and must be able to work at 12 MHz or higher. Place a 0.1-µF capacitor close the supply pin of SPI flash to filter out noise. Add pull-ups on the CS, MISO, WP and HOLD lines. TI suggests “W25X05CL” or similar SPI flash for the system.

GUID-D0256C85-EC87-484E-A9DA-C6A353651E7D-low.pngFigure 1-3 Recommended Pull-ups for SPI Flash