SPRAC76G November   2022  – February 2024 AM5706 , AM5708 , AM5716 , AM5718 , AM5726 , AM5728 , AM5729 , AM5746 , AM5748 , AM5749 , AM620-Q1 , AM623 , AM625 , AM625-Q1 , AM625SIP , AM6411 , AM6412 , AM6421 , AM6422 , AM6441 , AM6442 , AM6526 , AM6528 , AM6546 , AM6548

 

  1.   1
  2.   Sitara Processor Power Distribution Networks: Implementation and Analysis
  3.   Trademarks
  4. 1Introduction
    1. 1.1 Acronyms Used in This Document
  5. 2Guidelines for PCB Stack-Up
  6. 3Physical Layout Optimization of the PDN
  7. 4Static PDN Analysis (IR Drop Optimization)
  8. 5Dynamic Analysis of PCB PDN
    1. 5.1 Selecting Decoupling Capacitors to Meet ZTARGET
  9. 6Checklist for PDN
  10. 7Implementation Examples and PDN Targets
    1. 7.1 AM570x
    2. 7.2 AM571x
    3. 7.3 AM572x
    4. 7.4 AM574x
    5. 7.5 AM65xx/DRA80xM
    6. 7.6 AM62xx
    7. 7.7 AM64xx
    8. 7.8 AM62Ax
  11.   Revision History

7.5 AM65xx/DRA80xM

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Table 7-5 AM65xx/DRA80xM PDN Targets and Decoupling Example
Supply Name (1) Frequency of Interest (MHz) Number of Decoupling Capacitors Per Supply (2) (3) (4)
0.01 µF 0.1 µF 1 µF 2.2 µF 10 µF
VDD_CORE ≤25 23 12 4
VDD_MPU0
VDD_MPU1		 ≤25 11 4 4
VDD_MCU ≤25 3 1 2
VDD_DLL_MMC0
VDD_DLL_MMC1		 ≤25 2
VDD_WKUP0
VDD_WKUP1		 ≤25 4
CAP_VDDAR_WKUP N/A 1
CAP_VDDAR_MPU1_1 N/A 1
CAP_VDDAR_MPU1_0 N/A 1
CAP_VDDAR_MPU0_1 N/A 1
CAP_VDDAR_MPU0_0 N/A 1
CAP_VDDAR_MCU N/A 1
CAP_VDDAR_CORE4 N/A 1
CAP_VDDAR_CORE3 N/A 1
CAP_VDDAR_CORE2 N/A 1
CAP_VDDAR_CORE1 N/A 1
CAP_VDDAR_CORE0 N/A 1
CAP_VDDSHV_SDIO
CAP_VDDA_1P8_SDIO
CAP_VDDA_1P8_IOLDO1
CAP_VDDA_1P8_IOLDO0		 N/A Use-case dependent.
Refer to the device-specific data sheet.
CAP_VDDA_1P8_IOLDO_WKUP N/A 1
CAP_VDD_WKUP N/A 1
(1) Ganged rails must meet all requirements of each member rail.
(2) The decoupling capacitor counts and values presented here are provided as a baseline recommendation only and are based on a specific PCB design. TI recommends that all PCB designs be simulated prior to fabrication to ensure that all processor PDN requirements are met.
(3) For more information on peak-to-peak noise values, see the Recommended Operating Conditions table in the device-specific data sheet.
(4) ESL must be as low as possible and not exceed 0.5 nH.