SPRAC76G November   2022  – February 2024 AM5706 , AM5708 , AM5716 , AM5718 , AM5726 , AM5728 , AM5729 , AM5746 , AM5748 , AM5749 , AM620-Q1 , AM623 , AM625 , AM625-Q1 , AM625SIP , AM6411 , AM6412 , AM6421 , AM6422 , AM6441 , AM6442 , AM6526 , AM6528 , AM6546 , AM6548

 

  1.   1
  2.   Sitara Processor Power Distribution Networks: Implementation and Analysis
  3.   Trademarks
  4. 1Introduction
    1. 1.1 Acronyms Used in This Document
  5. 2Guidelines for PCB Stack-Up
  6. 3Physical Layout Optimization of the PDN
  7. 4Static PDN Analysis (IR Drop Optimization)
  8. 5Dynamic Analysis of PCB PDN
    1. 5.1 Selecting Decoupling Capacitors to Meet ZTARGET
  9. 6Checklist for PDN
  10. 7Implementation Examples and PDN Targets
    1. 7.1 AM570x
    2. 7.2 AM571x
    3. 7.3 AM572x
    4. 7.4 AM574x
    5. 7.5 AM65xx/DRA80xM
    6. 7.6 AM62xx
    7. 7.7 AM64xx
    8. 7.8 AM62Ax
  11.   Revision History

Abstract

The purpose of a power distribution network (PDN) is primarily to provide clean and reliable power to the active devices on the system. The printed circuit board (PCB) is a critical component of the system-level PDN delivery network. As such, optimal design of the PCB power distribution network is of utmost importance for high performance microprocessors. This application report provides implementation guidelines and recommendations for designing printed circuit board (PCB) power delivery networks (PDN) for the Texas Instruments Sitara™ family of microprocessors.