DLPS249 December   2024 DLP991U

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Storage Conditions
    3. 5.3  ESD Ratings
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Electrical Characteristics
    7. 5.7  Switching Characteristics
    8. 5.8  Timing Requirements
    9. 5.9  System Mounting Interface Loads
    10. 5.10 Micromirror Array Physical Characteristics
    11. 5.11 Micromirror Array Optical Characteristics
    12. 5.12 Window Characteristics
    13. 5.13 Chipset Component Usage Specification
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Power Interface
      2. 6.3.2 Timing
    4. 6.4 Device Functional Modes
    5. 6.5 Optical Interface and System Image Quality Considerations
      1. 6.5.1 Numerical Aperture and Stray Light Control
      2. 6.5.2 Pupil Match
      3. 6.5.3 Illumination Overfill
    6. 6.6 DMD Temperature Calculation
      1. 6.6.1 Off-State Thermal Differential (TDELTA_MIN)
      2. 6.6.2 On-State Thermal Differential (TDELTA_MAX)
    7. 6.7 Micromirror Power Density Calculation
    8. 6.8 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 6.8.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 6.8.2 Landed Duty Cycle and Useful Life of the DMD
      3. 6.8.3 Landed Duty Cycle and Operational DMD Temperature
      4. 6.8.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
    3. 7.3 DMD Die Temperature Sensing
    4. 7.4 Power Supply Recommendations
      1. 7.4.1 DMD Power Supply Power-Up Procedure
      2. 7.4.2 DMD Power Supply Power-Down Procedure
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
        1. 7.5.1.1 PCB Design Standards
        2. 7.5.1.2 General PCB Routing
          1. 7.5.1.2.1 Trace Impedance and Routing Priority
          2. 7.5.1.2.2 Example PCB Layer Stack-Up
          3. 7.5.1.2.3 Trace Width, Spacing
          4. 7.5.1.2.4 Power and Ground Planes
          5. 7.5.1.2.5 Trace Length Matching
            1. 7.5.1.2.5.1 HSSI Input Bus Skew
            2. 7.5.1.2.5.2 Other Timing Critical Signals
  9. Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
      2. 8.1.2 Device Markings
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Package Option Addendum
      1. 10.1.1 Packaging Information

Absolute Maximum Ratings

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
PARAMETERDESCRIPTIONMINMAXUNIT
Supply Voltage
VDDSupply voltage for LVCMOS core logic and LVCMOS low speed interface (LSIF)(1)–0.52.3V
VDDASupply voltage for high speed serial interface (HSSI) receivers(1)–0.32.2V
VOFFSETSupply voltage for HVCMOS and micromirror electrode(1)(2)–0.511V
VBIASSupply voltage for micromirror electrode(1)–0.519V
VRESETSupply voltage for micromirror electrode(1)–150.5V
| VDDA – VDD |Supply voltage delta (absolute value)(3)0.3V
| VBIAS – VOFFSET |Supply voltage delta (absolute value)(4)11V
| VBIAS – VRESET |Supply voltage delta (absolute value)(5)34V
Input Voltage
Input voltage for other inputs – LVDS and LVCMOS(1)–0.52.45V
Input voltage for other inputs – HSSI(1)(6)–0.2VDDAV
Low speed interface (LSIF)
fCLOCKLSIF clock frequency (LS_CLK)130MHz
| VID |LSIF differential input voltage magnitude(6)810mV
IIDLSIF differential input current(7)10mA
High speed serial interface (HSSI)
fCLOCKHSSI clock frequency (DCLK)1.65GHz
| VID |HSSI differential input voltage magnitude Data Lane700mV
| VID |HSSI differential input voltage magnitude Clock Lane700mV
Environmental
TARRAYTemperature, operational(8)090°C
Temperature, non-operational(8)-4090°C
TWINDOWTemperature, operational(8)070°C
Temperature, non-operational (8)–4090°C
TDELTA_MAX[maximum of TP2 or TP3] minus TMIN_ARRAY (9)5°C
TDELTA_MIN[minimum of TP2 or TP3] minus TMAX_ARRAY(9)–30°C
RHRelative humidity, operational and non-operational95%
All voltage values are with respect to the ground terminals (VSS). The following required power supplies must be connected for proper DMD operation: VDD, VDDA, VOFFSET, VBIAS, and VRESET. All VSS connections are also required.
VOFFSET supply transients must fall within specified voltages.
Exceeding the recommended allowable absolute voltage difference between VDDA and VDD may result in excessive current draw.
Exceeding the recommended allowable absolute voltage difference between VBIAS and VOFFSET may result in excessive current draw.
Exceeding the recommended allowable absolute voltage difference between VBIAS and VRESET may result in excessive current draw.
This maximum input voltage rating applies when each input of a differential pair is at the same voltage potential. LVDS differential inputs must not exceed the specified limit or damage may result to the internal termination resistors.
Differential inputs must not exceed the specified limit or damage may result to the internal termination resistors. Specification applies to both the high speed serial interface (HSSI) and the low speed interface (LSI).
The array temperature cannot be measured directly and must be computed analytically from the temperature measured at the test point (TP1) shown in Figure 6-1 and the package thermal resistances using the calculation in Section 6.6.
Refer to Section 6.6 for the calculation.