SCAU061 August 2025
3.2 PCB Layouts
Figure 3-3 Top layer
Figure 3-4 2nd Layer - RF GND
Figure 3-5 3rd Layer - Heat Sink 1
Figure 3-6 4th Layer - Heat Sink 2
Figure 3-7 5th Layer - Split Power Supplies
Figure 3-8 Bottom layerTable 3-1 PCB Stack-up
| Layer | Material | Thickness (mil) | εr |
|---|---|---|---|
| Top Layer | Copper | 1.4 | - |
| Dielectric | FR4 | 6 | 4.2 |
| RF Ground | Copper | 1.4 | - |
| Dielectric | FR4 | 8 | 4.2 |
| Heat Sink 1 | Copper | 1.4 | - |
| Dielectric | FR4 | 24.8 | 4.2 |
| Heat Sink 2 | Copper | 1.4 | - |
| Dielectric | FR4 | 8 | 4.2 |
| Split Power Supplies | Copper | 1.4 | - |
| Dielectric | FR4 | 1.4 | 4.2 |
| Bottom Layer | Copper | 1.4 | - |