SCDS436A September   2023  – December 2024 TMUX9616 , TMUX9616N

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Thermal Information
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Electrical Characteristics: TMUX9616
    6. 5.6 Switching Characteristics: TMUX9616
    7. 5.7 Digital Timings: TMUX9616
    8. 5.8 Timing Diagrams
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Off-Leakage Current
    2. 6.2 Device Turn On/Off Time
    3. 6.3 Off Isolation
    4. 6.4 Inter-Channel Crosstalk
    5. 6.5 Output Voltage Spike
    6. 6.6 Switch DC Offset Voltage
    7. 6.7 Isolation Diode Current
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Wide Input Signal Range (up to ±110 V, 220 VPP)
      2. 7.3.2 Bidirectional Operation
      3. 7.3.3 Device Digital Logic Control
      4. 7.3.4 Latch-Up Immunity by Device Construction
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Mode
      2. 7.4.2 Device Power Up
    5. 7.5 Device Logic Table
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.3 Thermal Information

THERMAL METRIC(1) TMUX9616x UNIT
PT (LQFP)
48 PINS
RθJA Junction-to-ambient thermal resistance 60.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 15.4 °C/W
RθJB Junction-to-board thermal resistance 26.9 °C/W
ΨJT Junction-to-top characterization parameter 0.5 °C/W
ΨJB Junction-to-board characterization parameter 26.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.