SGLS423A February   2025  – December 2025 SN55LVRA4-SEP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Receiver Output States
      2. 7.3.2 General Purpose Comparator
      3. 7.3.3 Common-Mode Range vs Supply Voltage
    4. 7.4 Equivalent Input and Output Schematic Diagrams
    5. 7.5 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Detailed Design Procedure
      2. 8.2.2 Design Requirements
      3. 8.2.3 Application Performance Plots
      4. 8.2.4 Cold Sparing
    3. 8.3 Active Failsafe Feature
    4. 8.4 ECL/PECL-to-LVTTL Conversion with TI's LVDS Receiver
    5. 8.5 Test Conditions
    6. 8.6 Equipment
  10. 9 Power Supply Recommendations
    1. 9.1 Supply Bypass Capacitance
  11. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Microstrip vs. Stripline Topologies
      2. 10.1.2 Dielectric Type and Board Construction
      3. 10.1.3 Recommended Stack Layout
      4. 10.1.4 Separation Between Traces
      5. 10.1.5 Crosstalk and Ground Bounce Minimization
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

8.2.1 Detailed Design Procedure

The physical communication channel between the driver and the receiver can be any balanced paired metal conductors meeting the requirements of the LVDS standard. This media can be a twisted pair, twinax, flat ribbon cable, or PCB traces. The nominal characteristic impedance of the interconnect shall be between typical 100Ω with a variation of no more than 10% (90Ω to 110Ω).