SGLS423A February   2025  – December 2025 SN55LVRA4-SEP

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Receiver Output States
      2. 7.3.2 General Purpose Comparator
      3. 7.3.3 Common-Mode Range vs Supply Voltage
    4. 7.4 Equivalent Input and Output Schematic Diagrams
    5. 7.5 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Detailed Design Procedure
      2. 8.2.2 Design Requirements
      3. 8.2.3 Application Performance Plots
      4. 8.2.4 Cold Sparing
    3. 8.3 Active Failsafe Feature
    4. 8.4 ECL/PECL-to-LVTTL Conversion with TI's LVDS Receiver
    5. 8.5 Test Conditions
    6. 8.6 Equipment
  10. Power Supply Recommendations
    1. 9.1 Supply Bypass Capacitance
  11. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Microstrip vs. Stripline Topologies
      2. 10.1.2 Dielectric Type and Board Construction
      3. 10.1.3 Recommended Stack Layout
      4. 10.1.4 Separation Between Traces
      5. 10.1.5 Crosstalk and Ground Bounce Minimization
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Overview

Figure 7-1 shows how LVDS drivers and receivers are intended to be used primarily in a simple point-to-point configuration. This configuration provides a clean signaling environment for the fast edge rates of the drivers. The receiver is connected to the source through a impedance controlled 100Ω differential PCB traces. Use a termination resistor of 100Ω and place it as close to the receiver input pins as possible. The termination resistor converts the driver output (current mode) into a voltage that is detected by the receiver.

SN55LVRA4-SEP Application Diagram Figure 7-1 Application Diagram