SGLS423A February   2025  – December 2025 SN55LVRA4-SEP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Receiver Output States
      2. 7.3.2 General Purpose Comparator
      3. 7.3.3 Common-Mode Range vs Supply Voltage
    4. 7.4 Equivalent Input and Output Schematic Diagrams
    5. 7.5 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Detailed Design Procedure
      2. 8.2.2 Design Requirements
      3. 8.2.3 Application Performance Plots
      4. 8.2.4 Cold Sparing
    3. 8.3 Active Failsafe Feature
    4. 8.4 ECL/PECL-to-LVTTL Conversion with TI's LVDS Receiver
    5. 8.5 Test Conditions
    6. 8.6 Equipment
  10. 9 Power Supply Recommendations
    1. 9.1 Supply Bypass Capacitance
  11. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Microstrip vs. Stripline Topologies
      2. 10.1.2 Dielectric Type and Board Construction
      3. 10.1.3 Recommended Stack Layout
      4. 10.1.4 Separation Between Traces
      5. 10.1.5 Crosstalk and Ground Bounce Minimization
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

5.6 Switching Characteristics

Over Supply Voltage and Operating Temperature ranges, unless otherwise specified.(1)(2)(3)
Symbol Parameter Conditions MIN TYP MAX UNIT
tPHL Differential Propagation Delay High to Low -55℃ ≤ TA ≤ 125℃, VID = 400mV, CL = 10pF, trf≤1ns, VCC=3.3V +/-10%. See Figure 6-3 1.8 3.6 8.5 ns
tPLH Differential Propagation Delay Low to High -55℃ ≤ TA ≤ 125℃, VID = 400mV, CL = 10pF, trf≤1ns, VCC=3.3V +/-10%. See Figure 6-3 1.3 3 7.5 ns
td1 Delay time, failsafe deactivate time VID = 400mV, CL = 10pF, trf≤1ns, VCC=3.3V +/-10%. See Figure 6-3 and  Figure 6-6     16 ns
td2 Delay time, failsafe activate time  2.5 µs
tSK(p) Differential Pulse Skew (tPHLD – tPLHD) (4) VID = 400mV, CL = 10pF, trf≤1ns, VCC=3.3V +/-10%. See Figure 6-3 500 ps
tSK(o) Differential Channel-to-Channel Skew-same device (5) 130 ps
tSK(pp) Differential Part to Part Skew (6) 1.2 ns
tTPHZ Propagation delay time, high level-to-high impedance output  VID = 400mV, CL = 10pF, trf≤1ns, VCC=3.3V +/-10% Figure 6-4 6.5 15 ns
tTPLZ Propagation delay time, low level-to-high impedance output 4.4 12 ns
tTPZH Propagation delay time, high impedance to high level output 3.8 12 ns
tTPZL Propagation delay time, high impedance to low level output 7 12 ns
tTLH Output Rise Time VID = 400mV, CL = 10pF, trf≤1ns, VCC=3.3V +/-10%. See Figure 6-3 800 ps
tTHL Output Fall Time 800 ps
(1) All typicals are given for: VCC = 3.3V and TA = +25°C.
(2) CL includes probe and jig capacitance.
(3) Generator waveform for all tests unless otherwise specified: f = 1MHz, ZO = 50Ω, tr and tf (0% to 100%) ≤ 3ns for RIN.
(4) tSK(p) is the magnitude difference in differential propagation delay time between the positive-going-edge and the negative-going-edge of the same channel.
(5) tSK(o) is the differential channel-to-channel skew of any event on the same device. This specification applies to devices having multiple receivers within the integrated circuit.
(6) tSK(pp), part to part skew, is the differential channel-to-channel skew of any event between devices. This specification applies to devices at the same VCC and within 5°C of each other within the operating temperature range.