SLAAED1G May   2023  – August 2025 MSPM0C1103 , MSPM0C1103-Q1 , MSPM0C1104 , MSPM0C1104-Q1 , MSPM0C1105 , MSPM0C1106 , MSPM0C1106-Q1 , MSPM0G1105 , MSPM0G1106 , MSPM0G1107 , MSPM0G1505 , MSPM0G1506 , MSPM0G1507 , MSPM0G1518 , MSPM0G1519 , MSPM0G3105 , MSPM0G3105-Q1 , MSPM0G3106 , MSPM0G3106-Q1 , MSPM0G3107 , MSPM0G3107-Q1 , MSPM0G3505 , MSPM0G3505-Q1 , MSPM0G3506 , MSPM0G3506-Q1 , MSPM0G3507 , MSPM0G3507-Q1 , MSPM0G3518 , MSPM0G3518-Q1 , MSPM0G3519 , MSPM0G3519-Q1 , MSPM0H3216 , MSPM0H3216-Q1 , MSPM0L1105 , MSPM0L1106 , MSPM0L1116 , MSPM0L1117 , MSPM0L1227 , MSPM0L1227-Q1 , MSPM0L1228 , MSPM0L1228-Q1 , MSPM0L1303 , MSPM0L1304 , MSPM0L1304-Q1 , MSPM0L1305 , MSPM0L1305-Q1 , MSPM0L1306 , MSPM0L1306-Q1 , MSPM0L1343 , MSPM0L1344 , MSPM0L1345 , MSPM0L1346 , MSPM0L2227 , MSPM0L2227-Q1 , MSPM0L2228 , MSPM0L2228-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1 Overview
  5. 2 MSPM0 Online Selection
  6. 3 Software Development Instructions
    1. 3.1 Key Documentation
    2. 3.2 LaunchPad Setup
      1. 3.2.1 Debugger Selection
      2. 3.2.2 LaunchPad Introduction
    3. 3.3 MSPM0-SDK Setup
      1. 3.3.1 MSPM0-SDK Installation
      2. 3.3.2 MSPM0-SDK Introduction
        1. 3.3.2.1 Examples Folder Introduction
        2. 3.3.2.2 Documents Folder Introduction
    4. 3.4 SysConfig Setup
      1. 3.4.1 SysConfig Installation
      2. 3.4.2 SysConfig Introduction
        1. 3.4.2.1 Basic Concept
        2. 3.4.2.2 Project Configuration View
        3. 3.4.2.3 Board View
        4. 3.4.2.4 NONMAIN View
        5. 3.4.2.5 SYSCTL View
        6. 3.4.2.6 Peripherals Setup
    5. 3.5 IDE Quick Start
      1. 3.5.1 CCS Quick Start
        1. 3.5.1.1 CCS Installation
        2. 3.5.1.2 Import a SDK Example
        3. 3.5.1.3 Example Download and Debug
        4. 3.5.1.4 Migrating Between MSPM0 Derivatives
        5. 3.5.1.5 Generate Hex Files
        6. 3.5.1.6 Program NONMAIN
      2. 3.5.2 IAR Quick Start
        1. 3.5.2.1 Environment Setup
          1. 3.5.2.1.1 SDK Support Setup
          2. 3.5.2.1.2 SysConfig Support Setup
        2. 3.5.2.2 Import a SDK Example
        3. 3.5.2.3 Example Download and Debug
        4. 3.5.2.4 Migrating Between MSPM0 Derivatives
        5. 3.5.2.5 Generate Hex Files
        6. 3.5.2.6 Program NONMAIN
      3. 3.5.3 Keil Quick Start
        1. 3.5.3.1 Environment Setup
          1. 3.5.3.1.1 MSPM0 CMSIS-Pack Setup
          2. 3.5.3.1.2 Sysconfig Support Setup
        2. 3.5.3.2 Import a SDK Example
        3. 3.5.3.3 Example Download and Debug
        4. 3.5.3.4 Migrating Between MSPM0 Derivatives
        5. 3.5.3.5 Generate Hex Files
        6. 3.5.3.6 Program NONMAIN
  7. 4 Hardware Design Instructions
    1. 4.1 Obtaining a MSPM0 Package
    2. 4.2 Fix Pin Functions through Sysconfig
    3. 4.3 Schematic and PCB Attentions
  8. 5 Mass Production Instructions
    1. 5.1 Generate Production Image
    2. 5.2 Program Software Tools Quick Start
      1. 5.2.1 Uniflash Quick Start
        1. 5.2.1.1 Program Through SWD
        2. 5.2.1.2 Program Through Bootloader
        3. 5.2.1.3 Program Through CMD Line Interface
      2. 5.2.2 JFlash Quick Start
      3. 5.2.3 C-GANG Quick Start
    3. 5.3 Program Hardware Quick Start
  9. 6 Quality and Reliability Instructions
    1. 6.1 Quality and Reliability Material Entrance
    2. 6.2 Failure Information Collection and Analysis Guidance
  10. 7 Common Development Questions
    1. 7.1 Unlock MCU
      1. 7.1.1 Unlock Through Bootloader
      2. 7.1.2 Unlock Through Factory Reset GUI Tool
      3. 7.1.3 Unlock Through Uniflash
      4. 7.1.4 Unlock Through CCS
      5. 7.1.5 Unlock With Reset Pin Disabled
    2. 7.2 MSPM0 Program Failure
    3. 7.3 Attentions When Disabling SWD or REST Pin
    4. 7.4 MCU Performs Differently in Debug and Free Run
    5. 7.5 Set SWD Password
    6. 7.6 BSL Related Questions
    7. 7.7 Reach Expected Current in LPM Mode
    8. 7.8 CCS Common Questions
      1. 7.8.1 Change the Optimization Level
    9. 7.9 Keil Common Questions
      1. 7.9.1 Copy Keil Example Out of SDK
  11. 8 Summary
  12. 9 Technical Documentation Resources
    1. 9.1 Technical Reference Manuals
    2. 9.2 Subsystems
    3. 9.3 Reference Designs
    4. 9.4 Hardware EVM User's Guides
    5. 9.5 Application Briefs
    6. 9.6 Application Notes and Others
  13. 10Revision History

6.2 Failure Information Collection and Analysis Guidance

Failure analysis needs to collect as much technical background information as possible to narrow down the scope of analysis and accelerate the analysis speed. If users meet any device failure on MSPM0, then collect the information as below, and connect to TI through the Customer returns page or the Regional CQE and Sales supporting your product or business.

Device name (TI Part Number, including package designator):

  • Example: MSPM0L1306SRGER

Failure rate (purchased vs. customer failed units):

  • Example: Failure rate: 5% (Total tested qty: 2000, Failed qty: 100)

Detection place (field return, production, incoming, and so forth):

  • Example: Board level function test

Schematic of the application:

  • Example: Schematic of the MCU part, with detailed description to every input and output signals

Detailed device level failure description

  • Example: MCU PA1 cannot output high voltage

This is an introduction to the common methods to collected the failure information.

  • Method 1: ABA swap test to judge whether the issue is caused from the device or the relativity between the device with the total system. Here are the steps to do ABA swap test: Remove the suspected component (A) from the original failing board. Replace the suspected component (A) with a known good component (B) and check if the original board now works properly. Mount the suspected component (A) to a known good board and see if the same failure occurs on the good board.
  • Method 2: Compare MCU current consumption with the data sheet under the standby mode. Some device failure is caused from EOS (Electrostatic Overstress), which causes additional leakage current. This can be caught by current consumption test.
  • Method 3: Pin impedance check. Some EOS (Electrostatic Overstress) is purely happened at I/Os, and using pin impedance check can easily catch this failure to give more information to TI. Users can choose to detect the IO resistance with or without powering the device. The resistance of a GPIO in high impedance state needs to be MΩ level.
  • Method 4: Find a smallest system or code example. Some failure happens with the typical application and typical code project. Through comparison method, removing the unrelated hardware setup and software code step-by-step can gradually narrow down the scope of analysis. The best result is that the problem is purely related to the device and a simplest code example. With that, TI can carry the further failure analysis faster.