SLASFB9B June   2025  – March 2026 MSPM0H3215 , MSPM0H3216

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
      1.      10
    3. 6.3 Signal Descriptions
      1.      12
      2.      13
      3.      14
      4.      15
      5.      16
      6.      17
      7.      18
      8.      19
      9.      20
      10.      21
      11.      22
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3   Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
    6. 7.6  Power Supply Sequencing
      1. 7.6.1 POR and BOR
      2. 7.6.2 Power Supply Ramp
    7. 7.7  Flash Memory Characteristics
    8. 7.8  Timing Characteristics
    9. 7.9  Clock Specifications
      1. 7.9.1 System Oscillator (SYSOSC)
      2. 7.9.2 Low Frequency Oscillator (LFOSC)
      3. 7.9.3 High Frequency Crystal/Clock
      4. 7.9.4 Low Frequency Crystal/Clock
    10. 7.10 Digital IO
      1. 7.10.1  Electrical Characteristics
      2. 7.10.2 Switching Characteristics
    11. 7.11 ADC
      1. 7.11.1 Electrical Characteristics
      2. 7.11.2 Switching Characteristics
      3. 7.11.3 Linearity Parameters
      4. 7.11.4 Typical Connection Diagram
    12. 7.12 Temperature Sensor
    13. 7.13 VREF
      1. 7.13.1 Voltage Characteristics
      2. 7.13.2 Electrical Characteristics
    14. 7.14 I2C
      1. 7.14.1 I2C Characteristics
      2. 7.14.2 I2C Filter
      3. 7.14.3 I2C Timing Diagram
    15. 7.15 SPI
      1. 7.15.1 SPI
      2. 7.15.2 SPI Timing Diagram
    16. 7.16 UART
    17. 7.17 TIMx
    18. 7.18 Emulation and Debug
      1. 7.18.1 SWD Timing
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  CPU
    3. 8.3  Operating Modes
      1. 8.3.1 Functionality by Operating Mode (MSPM0H321x)
    4. 8.4  Power Management Unit (PMU)
    5. 8.5  Clock Module (CKM)
    6. 8.6  DMA_B
    7. 8.7  Events
    8. 8.8  Memory
      1. 8.8.1 Memory Organization
      2. 8.8.2 Peripheral File Map
      3. 8.8.3 Peripheral Interrupt Vector
    9. 8.9  Flash Memory
    10. 8.10 SRAM
    11. 8.11 GPIO
    12. 8.12 IOMUX
    13. 8.13 ADC
    14. 8.14 Temperature Sensor
    15. 8.15 VREF
    16. 8.16 Security
    17. 8.17 CRC
    18. 8.18 UART
    19. 8.19 SPI
    20. 8.20 I2C
    21. 8.21 Low-Frequency Sub System (LFSS)
    22. 8.22 RTC_B
    23. 8.23 IWDT_B
    24. 8.24 WWDT
    25. 8.25 Timers (TIMx)
    26. 8.26 Device Analog Connections
    27. 8.27 Input/Output Diagrams
    28. 8.28 Serial Wire Debug Interface
    29. 8.29 DEBUGSS
    30. 8.30 Device Factory Constants
    31. 8.31 Identification
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

1 Features

  • Core
    • Arm® 32-bit Cortex®-M0+ CPU, frequency up to 32MHz
  • Operating characteristics
    • Extended temperature: –40°C to 125°C
    • Supply voltage range: 4.5V to 5.5V
  • Memories
    • Up to 64KB of flash
    • 8KB of SRAM
  • High-performance analog peripherals
    • One analog-to-digital converter (ADC) with up to 27 total external channels, 1.6-Msps@12-bit
    • 4.05V internal ADC voltage reference (VREF)
    • Integrated temperature sensor
    • Integrated supply monitor
  • Optimized low-power modes
    • RUN: 126µA/MHz (CoreMark)
    • SLEEP: 2516uA at 32MHz
    • STOP: 1442µA at 4MHz and 674uA at 32kHz
    • STANDBY: 3.8µA with SRAM retention
  • Intelligent digital peripherals
    • 3-channel DMA controller

    • Five timers supporting up to 18 PWM channels

      • One 16-bit advanced timers with deadband support up to 8 PWM channels
      • One 16-bit general purpose timer with 4 capture/compares
      • Two 16-bit general purpose timers with 2 capture/compares
      • One 16-bit general purpose timer with 2 capture/compares and QEI
    • Windowed watchdog timer (WWDT)
    • Independent watch dog timer (IWDT)
    • RTC with alarm and calendar mode
    • BEEPER generating 1/2/4/8kHz square wave to drive an external beeper
  • Enhanced communication interfaces
    • Three UART interfaces supporting low-power operation in STANDBY mode
      • One advanced UART instance supporting LIN, IrDA, DALI, Smart Card, & Manchester coding
    • Two I2C interfaces supporting FM+ (1Mbit/s), SMBus/PMBus, and wakeup from STOP mode,
    • One SPI supporting up to 16Mbit/s
  • Clock system
    • Internal 32MHz oscillator with -2.1% to 1.6% accuracy (SYSOSC)
    • Internal 32kHz low-frequency oscillator (LFOSC) with up to ±3% accuracy
    • External 4MHz to 32MHz crystal oscillator (HFXT)
    • External 32kHz crystal oscillator (LFXT)
    • External Low Frequency (LF) and High Frequency (HF) digital clock inputs
  • Data integrity
    • Flexible firewalls for protecting code and data
    • Cyclic redundancy checker (CRC-16)
  • Flexible I/O features
    • Up to 45 GPIOs
    • True 5V IOs
  • Development support
    • 2-pin serial wire debug (SWD)
  • Package options
    • 48-pin LQFP (PT), VQFN (RGZ)
    • 32-pin VQFN (RHB)
    • 28-pin VSSOP (DGS28)
    • 24-pin VQFN (RGE)
    • 20-pin VSSOP (DGS20), WQFN (RUK)
  • Family members (also see Device Comparison)
    • MSPM0H3216: 64KB of flash, 8KB of RAM
    • MSPM0H3215: 32KB of flash, 8KB of RAM
  • Development kits and software (also see Tools and Software)
    • LP-MSPM0H3216 LaunchPad™ development kit
    • MSP Software Development Kit (SDK)