SLASFB9B June   2025  – March 2026 MSPM0H3215 , MSPM0H3216

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
      1.      10
    3. 6.3 Signal Descriptions
      1.      12
      2.      13
      3.      14
      4.      15
      5.      16
      6.      17
      7.      18
      8.      19
      9.      20
      10.      21
      11.      22
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3   Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
    6. 7.6  Power Supply Sequencing
      1. 7.6.1 POR and BOR
      2. 7.6.2 Power Supply Ramp
    7. 7.7  Flash Memory Characteristics
    8. 7.8  Timing Characteristics
    9. 7.9  Clock Specifications
      1. 7.9.1 System Oscillator (SYSOSC)
      2. 7.9.2 Low Frequency Oscillator (LFOSC)
      3. 7.9.3 High Frequency Crystal/Clock
      4. 7.9.4 Low Frequency Crystal/Clock
    10. 7.10 Digital IO
      1. 7.10.1  Electrical Characteristics
      2. 7.10.2 Switching Characteristics
    11. 7.11 ADC
      1. 7.11.1 Electrical Characteristics
      2. 7.11.2 Switching Characteristics
      3. 7.11.3 Linearity Parameters
      4. 7.11.4 Typical Connection Diagram
    12. 7.12 Temperature Sensor
    13. 7.13 VREF
      1. 7.13.1 Voltage Characteristics
      2. 7.13.2 Electrical Characteristics
    14. 7.14 I2C
      1. 7.14.1 I2C Characteristics
      2. 7.14.2 I2C Filter
      3. 7.14.3 I2C Timing Diagram
    15. 7.15 SPI
      1. 7.15.1 SPI
      2. 7.15.2 SPI Timing Diagram
    16. 7.16 UART
    17. 7.17 TIMx
    18. 7.18 Emulation and Debug
      1. 7.18.1 SWD Timing
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  CPU
    3. 8.3  Operating Modes
      1. 8.3.1 Functionality by Operating Mode (MSPM0H321x)
    4. 8.4  Power Management Unit (PMU)
    5. 8.5  Clock Module (CKM)
    6. 8.6  DMA_B
    7. 8.7  Events
    8. 8.8  Memory
      1. 8.8.1 Memory Organization
      2. 8.8.2 Peripheral File Map
      3. 8.8.3 Peripheral Interrupt Vector
    9. 8.9  Flash Memory
    10. 8.10 SRAM
    11. 8.11 GPIO
    12. 8.12 IOMUX
    13. 8.13 ADC
    14. 8.14 Temperature Sensor
    15. 8.15 VREF
    16. 8.16 Security
    17. 8.17 CRC
    18. 8.18 UART
    19. 8.19 SPI
    20. 8.20 I2C
    21. 8.21 Low-Frequency Sub System (LFSS)
    22. 8.22 RTC_B
    23. 8.23 IWDT_B
    24. 8.24 WWDT
    25. 8.25 Timers (TIMx)
    26. 8.26 Device Analog Connections
    27. 8.27 Input/Output Diagrams
    28. 8.28 Serial Wire Debug Interface
    29. 8.29 DEBUGSS
    30. 8.30 Device Factory Constants
    31. 8.31 Identification
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

3 Description

MSPM0H321x microcontrollers (MCUs) are part of the MSP highly-integrated 5V power supply and 32-bit MCU family based on the enhanced Arm®Cortex®-M0+ core platform operating at up to 32MHz frequency. These cost-optimized MCUs offer high-performance analog peripheral integration, support extended temperature ranges from -40°C to 125°C, and operate with supply voltages from 4.5V.

The MSPM0H321x devices provide up to 64KB embedded flash program memory with 8KB SRAM. These MCUs incorporate a high-speed on-chip oscillator with an accuracy of -2.1% to 1.6%, eliminating the need for an external crystal. Additional features include a 3-channel DMA, CRC-16 accelerator, and a variety of high-performance analog peripherals such as one 12-bit 1.6Msps ADC with VDD as the voltage reference, and an on-chip temperature sensor. These devices offer intelligent digital peripherals such as one 16-bit advanced timer, four 16-bit general purpose timer, one windowed watchdog timer, one independent watchdog timer, and a real-time clock (RTC). These devices also offer a variety of communication peripherals including three UART, one SPI, and two I2C. These communication peripherals offer protocol support for LIN, IrDA, DALI, Manchester, smart card, SMBus, and PMBus.

The TI MSPM0 family of low-power MCUs consists of devices with varying degrees of analog and digital integration enabling customers to find the MCU that meets their project needs. The architecture combined with extensive low-power modes is optimized to achieve extended battery life in portable measurement applications.

MSPM0H321x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get the design started quickly. Development kits include a LaunchPad™ kit available for purchase and design files for a target-socket board. TI also provides a free MSP Software Development Kit (SDK), which is available as a component of Code Composer Studio™ IDE desktop and cloud version within the TI Resource Explorer. MSPM0 MCUs are also supported by extensive online collateral, training with MSP Academy, and online support through the TI E2E™ support forums.

For complete module descriptions, see the MSPM0H-Series 32MHz Microcontrollers Technical Reference Manual.

Table 3-1 Package Information
PART NUMBER (1)(3) PACKAGE PACKAGE SIZE(2)
MSPM0H3216SPTR PT (LQFP, 48) 9mm × 9mm
MSPM0H3215SPTR PT (LQFP, 48) 9mm × 9mm
MSPM0H3216SRGZR RGZ (VQFN, 48) 7mm × 7mm
MSPM0H3215SRGZR RGZ (VQFN, 48) 7mm × 7mm
MSPM0H3216SRHBR RHB (VQFN, 32) 5mm × 5mm
MSPM0H3215SRHBR RHB (VQFN, 32) 5mm x 5mm
MSPM0H3216SDGS28R DGS28 (VSSOP, 28) 7.1mm × 4.9mm
MSPM0H3215SDGS28R DGS28 (VSSOP, 28) 7.1mm × 4.9mm
MSPM0H3216SRGER RGE (VQFN, 24) 4mm x 4mm
MSPM0H3215SRGER RGE (VQFN, 24) 4mm x 4mm
MSPM0H3216SDGS20R DGS20 (VSSOP, 20) 5.1mm × 4.9mm
MSPM0H3215SDGS20R DGS20 (VSSOP, 20) 5.1mm × 4.9mm
MSPM0H3216SRUKR RUK (WQFN, 20) 3mm x 3mm
MSPM0H3215SRUKR RUK (WQFN, 20) 3mm x 3mm

  1. For the most current part, package, and ordering information for all available devices, see the Package Option Addendum in Section 12, or see the TI web site.
  2. The package size (length × width) is a nominal value and includes pins, where applicable. For package dimensions with tolerances, see the Mechanical Data in Section 12.
  3. For more information about the device name, see Section 10.1.