SLASFB9B June   2025  – March 2026 MSPM0H3215 , MSPM0H3216

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
      1.      10
    3. 6.3 Signal Descriptions
      1.      12
      2.      13
      3.      14
      4.      15
      5.      16
      6.      17
      7.      18
      8.      19
      9.      20
      10.      21
      11.      22
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3   Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
    6. 7.6  Power Supply Sequencing
      1. 7.6.1 POR and BOR
      2. 7.6.2 Power Supply Ramp
    7. 7.7  Flash Memory Characteristics
    8. 7.8  Timing Characteristics
    9. 7.9  Clock Specifications
      1. 7.9.1 System Oscillator (SYSOSC)
      2. 7.9.2 Low Frequency Oscillator (LFOSC)
      3. 7.9.3 High Frequency Crystal/Clock
      4. 7.9.4 Low Frequency Crystal/Clock
    10. 7.10 Digital IO
      1. 7.10.1  Electrical Characteristics
      2. 7.10.2 Switching Characteristics
    11. 7.11 ADC
      1. 7.11.1 Electrical Characteristics
      2. 7.11.2 Switching Characteristics
      3. 7.11.3 Linearity Parameters
      4. 7.11.4 Typical Connection Diagram
    12. 7.12 Temperature Sensor
    13. 7.13 VREF
      1. 7.13.1 Voltage Characteristics
      2. 7.13.2 Electrical Characteristics
    14. 7.14 I2C
      1. 7.14.1 I2C Characteristics
      2. 7.14.2 I2C Filter
      3. 7.14.3 I2C Timing Diagram
    15. 7.15 SPI
      1. 7.15.1 SPI
      2. 7.15.2 SPI Timing Diagram
    16. 7.16 UART
    17. 7.17 TIMx
    18. 7.18 Emulation and Debug
      1. 7.18.1 SWD Timing
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  CPU
    3. 8.3  Operating Modes
      1. 8.3.1 Functionality by Operating Mode (MSPM0H321x)
    4. 8.4  Power Management Unit (PMU)
    5. 8.5  Clock Module (CKM)
    6. 8.6  DMA_B
    7. 8.7  Events
    8. 8.8  Memory
      1. 8.8.1 Memory Organization
      2. 8.8.2 Peripheral File Map
      3. 8.8.3 Peripheral Interrupt Vector
    9. 8.9  Flash Memory
    10. 8.10 SRAM
    11. 8.11 GPIO
    12. 8.12 IOMUX
    13. 8.13 ADC
    14. 8.14 Temperature Sensor
    15. 8.15 VREF
    16. 8.16 Security
    17. 8.17 CRC
    18. 8.18 UART
    19. 8.19 SPI
    20. 8.20 I2C
    21. 8.21 Low-Frequency Sub System (LFSS)
    22. 8.22 RTC_B
    23. 8.23 IWDT_B
    24. 8.24 WWDT
    25. 8.25 Timers (TIMx)
    26. 8.26 Device Analog Connections
    27. 8.27 Input/Output Diagrams
    28. 8.28 Serial Wire Debug Interface
    29. 8.29 DEBUGSS
    30. 8.30 Device Factory Constants
    31. 8.31 Identification
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

7.8 Timing Characteristics

VDD=5V, Ta=25 ℃ (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Wakeup Timing
tWAKE, SLEEP Wakeup time from SLEEP0 to RUN  2 cycles
tWAKE, SLEEP Wakeup time from SLEEP1 to RUN  1.7 us
tWAKE, SLEEP Wakeup time from SLEEP2 to RUN  2.3 us
tWAKE, STOP Wakeup time from STOP0 to RUN (SYSOSC enabled) 8.1 us
Wakeup time from STOP2 to RUN (SYSOSC disabled)  8.8 us
tWAKE, STBY Wakeup time from STANDBY0 to RUN  12.8 us
tWAKE, STBY Wakeup time from STANDBY1 to RUN  12.8 us
Asynchronous Fast Clock Request Timing
tDELAY Delay time from edge of asynchronous request to first 32MHz MCLK edge Mode is SLEEP1 0.3 us
tDELAY Delay time from edge of asynchronous request to first 32MHz MCLK edge Mode is SLEEP2 0.9 us
tDELAY Delay time from edge of asynchronous request to first 32MHz MCLK edge Mode is STOP0 0.9 us
tDELAY Delay time from edge of asynchronous request to first 32MHz MCLK edge Mode is STOP2 0.9 us
tDELAY Delay time from edge of asynchronous request to first 32MHz MCLK edge Mode is STANDBY0 5.0 us
tDELAY Delay time from edge of asynchronous request to first 32MHz MCLK edge Mode is STANDBY1 5.0 us
Startup Timing
tSTART, RESET Device cold start-up time from reset/power-up (1) Fast boot enabled 252 us
tSTART, RESET Device cold start-up time from reset/power-up (1) Fast boot disabled 292 us
NRST Timing
tRST, BOOTRST Pulse length on NRST pin to generate BOOTRST ULPCLK=SYSOSC 2 us
ULPCLK=LFOSC 100 us
tRST, POR Pulse length on NRST pin to generate POR 1 s
(1) The start-up time is measured from the time that VDD crosses VBOR0+ (cold start-up) to the time that the first instruction of the user program is executed.