SLASFB9B June   2025  – March 2026 MSPM0H3216

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
      1.      10
    3. 6.3 Signal Descriptions
      1.      12
      2.      13
      3.      14
      4.      15
      5.      16
      6.      17
      7.      18
      8.      19
      9.      20
      10.      21
      11.      22
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3   Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
    6. 7.6  Power Supply Sequencing
      1. 7.6.1 POR and BOR
      2. 7.6.2 Power Supply Ramp
    7. 7.7  Flash Memory Characteristics
    8. 7.8  Timing Characteristics
    9. 7.9  Clock Specifications
      1. 7.9.1 System Oscillator (SYSOSC)
      2. 7.9.2 Low Frequency Oscillator (LFOSC)
      3. 7.9.3 High Frequency Crystal/Clock
      4. 7.9.4 Low Frequency Crystal/Clock
    10. 7.10 Digital IO
      1. 7.10.1  Electrical Characteristics
      2. 7.10.2 Switching Characteristics
    11. 7.11 ADC
      1. 7.11.1 Electrical Characteristics
      2. 7.11.2 Switching Characteristics
      3. 7.11.3 Linearity Parameters
      4. 7.11.4 Typical Connection Diagram
    12. 7.12 Temperature Sensor
    13. 7.13 VREF
      1. 7.13.1 Voltage Characteristics
      2. 7.13.2 Electrical Characteristics
    14. 7.14 I2C
      1. 7.14.1 I2C Characteristics
      2. 7.14.2 I2C Filter
      3. 7.14.3 I2C Timing Diagram
    15. 7.15 SPI
      1. 7.15.1 SPI
      2. 7.15.2 SPI Timing Diagram
    16. 7.16 UART
    17. 7.17 TIMx
    18. 7.18 Emulation and Debug
      1. 7.18.1 SWD Timing
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  CPU
    3. 8.3  Operating Modes
      1. 8.3.1 Functionality by Operating Mode (MSPM0H321x)
    4. 8.4  Power Management Unit (PMU)
    5. 8.5  Clock Module (CKM)
    6. 8.6  DMA_B
    7. 8.7  Events
    8. 8.8  Memory
      1. 8.8.1 Memory Organization
      2. 8.8.2 Peripheral File Map
      3. 8.8.3 Peripheral Interrupt Vector
    9. 8.9  Flash Memory
    10. 8.10 SRAM
    11. 8.11 GPIO
    12. 8.12 IOMUX
    13. 8.13 ADC
    14. 8.14 Temperature Sensor
    15. 8.15 VREF
    16. 8.16 Security
    17. 8.17 CRC
    18. 8.18 UART
    19. 8.19 SPI
    20. 8.20 I2C
    21. 8.21 Low-Frequency Sub System (LFSS)
    22. 8.22 RTC_B
    23. 8.23 IWDT_B
    24. 8.24 WWDT
    25. 8.25 Timers (TIMx)
    26. 8.26 Device Analog Connections
    27. 8.27 Input/Output Diagrams
    28. 8.28 Serial Wire Debug Interface
    29. 8.29 DEBUGSS
    30. 8.30 Device Factory Constants
    31. 8.31 Identification
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

5 Device Comparison

Table 5-1 Device Comparison
DEVICE NAME (1)(3) FLASH / SRAM (KB) ADC CHANNELS UART / I2C / SPI TIMG TIMA GPIOs PACKAGE
(PACKAGE SIZE)(2)
MSPM0H3216SPTR 64 / 8 27 3 / 2 / 1 4 1 45 48 LQFP
(9mm × 9mm)
MSPM0H3215SPTR 32 / 8
MSPM0H3216SRGZR 64 / 8 27 3 / 2 / 1 4 1 45 48 VQFN
(7mm × 7mm)
MSPM0H3215SRGZR 32 / 8
MSPM0H3216SRHBR 64 / 8 18 3 / 2 / 1 4 1 29 32 VQFN
(5mm × 5mm)
MSPM0H3215SRHBR 32 / 8
MSPM0H3216SDGS28R 64 / 8 15 3 / 2 / 1 4 1 25 28 VSSOP
(7.1mm × 4.9mm)
MSPM0H3215SDGS28R 32 / 8
MSPM0H3216SRGER 64 / 8 13 3 / 2 / 1 4 1 21 24 VQFN
(4mm × 4mm)
MSPM0H3215SRGER 32 / 8
MSPM0H3216SDGS20R 64 / 8 12 3 / 2 / 1 4 1 17 20 VSSOP
(5.1mm × 4.9mm)
MSPM0H3215SDGS20R 32 / 8
MSPM0H3216SRUKR 64 / 8 12 3 / 2 / 1 4 1 17 20 WQFN
(3mm × 3mm)
MSPM0H3215SRUKR 32 / 8
(1) For the most current part, package, and ordering information for all available devices, see the Package Option Addendum in Section 12, or see the TI web site.
(2) The package size (length × width) is a nominal value and includes pins, where applicable. For package dimensions with tolerances, see the Mechanical Data in Section 12.
(3) For more information about the device name, see Section 10.1.