SLUSF25A September   2025  – November 2025 UCC27834 , UCC27884

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Dynamic Electrical Characteristics
    7. 5.7 Timing Diagrams
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Input Stages and Interlock
      2. 6.3.2 Undervoltage Lockout (UVLO)
      3. 6.3.3 Level Shifter
      4. 6.3.4 Output Stage
      5. 6.3.5 Low Propagation Delays and Tightly Matched Outputs
      6. 6.3.6 HS Node dV/dt
      7. 6.3.7 Operation Under Negative HS Voltage Condition
    4. 6.4 Device Functional Modes
      1. 6.4.1 Input and Output Logic Table
      2. 6.4.2 Operation Under 100% Duty Cycle Condition
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Selecting HI and LI Low Pass Filter Components (RHI, RLI, CHI, CLI)
        2. 7.2.2.2 Selecting Bootstrap Capacitor (CBOOT)
        3. 7.2.2.3 Selecting VDD Bypass Capacitor (CVDD)
        4. 7.2.2.4 Selecting Bootstrap Resistor (RBOOT)
        5. 7.2.2.5 Selecting Gate Resistor RON/ROFF
        6. 7.2.2.6 Selecting Bootstrap Diode
        7. 7.2.2.7 Estimate the UCC278X4 Power Losses
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±500
(1) JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.