SLUSG51A October   2025  – August 2026 BQ25692-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Device Power-On-Reset
      2. 6.3.2  Battery Only Power Up State
      3. 6.3.3  Device HIZ State
      4. 6.3.4  Power Up REGN LDO
      5. 6.3.5  Default VINDPM Setting
      6. 6.3.6  Default Charge Profile Setting With CELL, ICHG and VCHG Pins
      7. 6.3.7  Buck-Boost Converter Operation
        1. 6.3.7.1 Pulse Frequency Modulation (PFM)
        2. 6.3.7.2 Switching Frequency and Dithering Feature
      8. 6.3.8  Forward (Sink) Operation
        1. 6.3.8.1 Power Path Management
          1. 6.3.8.1.1 Dynamic Power Management
            1. 6.3.8.1.1.1 ILIM_HIZ Pin
            2. 6.3.8.1.1.2 Input Current Optimizer (ICO)
          2. 6.3.8.1.2 Maximum Power Point Tracking for Small PV Panel
        2. 6.3.8.2 Battery Charging Management
          1. 6.3.8.2.1 Battery Detection
          2. 6.3.8.2.2 Autonomous Charging Cycle
          3. 6.3.8.2.3 Battery Charging Profile
          4. 6.3.8.2.4 Charging Termination
          5. 6.3.8.2.5 Charging Safety Timer
          6. 6.3.8.2.6 CV Timer
          7. 6.3.8.2.7 Thermistor Qualification
            1. 6.3.8.2.7.1 JEITA Guideline Compliance in Charge Mode
            2. 6.3.8.2.7.2 Cold/Hot Temperature Window in Reverse Mode
        3. 6.3.8.3 Bypass Mode
      9. 6.3.9  Reverse (Source) Mode (USB On-The-Go)
        1. 6.3.9.1 Reverse (Source) Mode Operation
        2. 6.3.9.2 Backup Power Supply Mode
        3. 6.3.9.3 Reverse Bypass Mode
      10. 6.3.10 Status Outputs (STAT and INT)
        1. 6.3.10.1 Power Good Indicator (PG_STAT)
        2. 6.3.10.2 Charging Status Indicator (STAT Pin)
        3. 6.3.10.3 Interrupt to Host ( INT)
      11. 6.3.11 Serial Interface
        1. 6.3.11.1 Data Validity
        2. 6.3.11.2 START and STOP Conditions
        3. 6.3.11.3 Byte Format
        4. 6.3.11.4 Acknowledge (ACK) and Not Acknowledge (NACK)
        5. 6.3.11.5 Target Address and Data Direction Bit
        6. 6.3.11.6 Single Write and Read
        7. 6.3.11.7 Multi-Write and Multi-Read
    4. 6.4 Device Functional Modes
      1. 6.4.1 Host Mode and Default Mode
      2. 6.4.2 Register Bit Reset
  8. 7 Register Map
    1. 7.1 BQ25692Q1 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application Design Example
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Inductor Selection
        2. 8.2.2.2 Capacitors
        3. 8.2.2.3 Buck Mode Input (VIN) Capacitor
        4. 8.2.2.4 Boost Mode Output (VOUT) Capacitor
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

8.2.2.2 Capacitors

Low ESR ceramic capacitors such as X7R or X5R are preferred for the decoupling capacitors and must be placed close to the converter VIN, SYS or SRN and GND pins. To account for the derating due to temperature and applied voltage of a ceramic capacitor, the voltage rating of the selected ceramic capacitor must be higher than the normal input voltage level. For example, a capacitor with 35V or higher voltage rating is preferred for up to 24V input voltage. Non-ceramic capacitors can be used if the ESR is less than 50mΩ. CVIN_ACP + CVIN_ACP must be at least 10µF after derating with CVIN_ACN < 4 × CVIN_ACP. For 1S-2S applications, CSYS must be at least 15µF. For 3S-7S applications, CSYS must be at least 8µF after derating. CBAT, the bulk capacitance close to SRN and GND pins in parallel with the battery pack, must be at least 5µF after derating. The following sections explain how to size the derated capacitance value for the desired steady state voltage ripple. Voltage ripple is the highest for the input of a buck converter and the output of a boost converter. At the start and release of a load transient step, additional capacitance can be required to reduce voltage dips and overshoot, respectively, for a buck, boost or buck-boost converter output.