SLVAEU0A September   2020  – November 2025 LM117HVQML-SP , LM117QML-SP , LM136A-2.5QML-SP , LM137JAN-SP , LM137QML-SP , LM185-1.2QML-SP , LM185-2.5QML-SP , LM2940QML-SP , LM2941QML-SP , LM4050QML-SP , LM723JAN-SP , LP2953QML-SP , TL1431-SP , TPS50601-SP , TPS50601A-SP , TPS7A4501-SP , TPS7H1101-SP , TPS7H1101A-SP , TPS7H1111-SP , TPS7H1121-SP , TPS7H2201-SP , TPS7H2211-SP , TPS7H3301-SP , TPS7H4001-SP , TPS7H4002-SP , TPS7H4011-SP , TPS7H5001-SP , TPS7H5002-SP , TPS7H5003-SP , TPS7H5004-SP , TPS7H6003-SP , TPS7H6013-SP , TPS7H6023-SP , UC1525B-SP , UC1611-SP , UC1705-SP , UC1707-SP , UC1708-SP , UC1709-SP , UC1710-SP , UC1715-SP , UC1823A-SP , UC1825-SP , UC1825A-SP , UC1825B-SP , UC1832-SP , UC1834-SP , UC1842-SP , UC1842A-SP , UC1843-SP , UC1843A-SP , UC1843B-SP , UC1844-SP , UC1844A-SP , UC1845-SP , UC1845A-SP , UC1846-SP , UC1856-SP , UC1863-SP , UC1875-SP , UC1901-SP , UC19432-SP , UCC1806-SP

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Reflow Profiles
  5. 2Critical Considerations for Gold-Plated Termination-Finishes
  6. 3Considerations for Leadless Ceramic Chip Carrier Packages
  7. 4Lead Forming
  8. 5Ceramic Packaging
  9. 6References
  10. 7Revision History

4 Lead Forming

Hermetic surface mount packages are typically sold non-formed as most customers have a preferred final form factor which can vary from customer to customer. Texas Instruments does provide example PCB footprints for ceramic packages via the device's product folder on TI.com. These PCB footprints have been used on ceramic based EVMs, note these PCB footprints are provided by TI are for reference only. Third party service providers such as Spirit Electronics can provide a lead-forming service. General information can be found at Lead Trim & Form. TI does not endorse or recommend these companies, but only mentions them as example service providers.

For more information, contact TI Support at www.ti.com/support.