SLVSI23A September   2025  – December 2025 DRV81646

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specification
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7.     13
    8. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Control Interface and Slew Rate (RSLEW/CNTL)
      2. 6.3.2 Current Sensing With FET Source Terminals
      3. 6.3.3 Integrated Clamp Diode, VCLAMP
      4. 6.3.4 Protection Circuits
        1. 6.3.4.1 ILIM Analog Current Limit
          1. 6.3.4.1.1 Effect of Load Resistance on Power Dissipation Before TSD
        2. 6.3.4.2 Cut-Off Delay (COD)
        3. 6.3.4.3 INRUSH Mode
        4. 6.3.4.4 Thermal Shutdown (TSD)
        5. 6.3.4.5 Undervoltage Lockout (UVLO)
      5. 6.3.5 Fault Conditions Summary
    4. 6.4 Device Functional Modes
      1. 6.4.1 Hardware Interface Operation
      2. 6.4.2 Parallel Outputs
      3. 6.4.3 SPI Mode
        1. 6.4.3.1 Parity Bit Calculation
        2. 6.4.3.2 SPI Input Packet
        3. 6.4.3.3 SPI Response Packet
        4. 6.4.3.4 SPI Error Reporting
        5. 6.4.3.5 SPI Daisy Chain
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 External Components
      2. 7.2.2 Continuous Current Capability
      3. 7.2.3 Power Dissipation
      4. 7.2.4 Application Curves
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Bulk Capacitance
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.6 Timing Requirements

MIN NOM MAX UNIT
tSCLK SCLK cycle time 500 ns
tSCLKH SCLK high time 170 ns
tSCLKL SCLK low time 170 ns
tH_SCLK Hold time, nSCS falling to SCLK rising edge 1000 ns
tSU(SDI) Setup time, SDI valid to SCLK falling edge 30 ns
tH(SDI) Hold time, SCLK falling edge to SDI not valid 30 ns
tD(SDO) Delay time, SCLK rising edge to SDO valid (CLOAD < 20pF ) 100 ns
tSU_NSCS Delay between final SCLK falling edge to nSCS rising edge 200 ns
tSDOHIZ Delay between NSCS rising edge and SDO HiZ 100 ns
tNSCS_H Pulse width for nSCS 1000 ns
tD_LATCH nSCS rising edge to input data latched in device 2000 ns