SLVSIA7 March   2025 TPSI3050M

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics
    10. 5.10 Switching Characteristics
    11. 5.11 Insulation Characteristic Curves
    12. 5.12 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Transmission of the Enable State
      2. 7.3.2  Power Transmission
      3. 7.3.3  Gate Driver
      4. 7.3.4  Modes Overview
      5. 7.3.5  Three-Wire Mode
      6. 7.3.6  Two-Wire Mode
      7. 7.3.7  VDDP, VDDH, and VDDM Undervoltage Lockout (UVLO)
      8. 7.3.8  Keep-Off Circuitry
      9. 7.3.9  Power Supply and EN Sequencing
      10. 7.3.10 Thermal Shutdown
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Two-Wire or Three-Wire Mode Selection
        2. 8.2.2.2 CDIV1, CDIV2 Capacitance
        3. 8.2.2.3 RPXFR Selection
        4. 8.2.2.4 CVDDP Capacitance
        5. 8.2.2.5 Gate Driver Output Resistor
        6. 8.2.2.6 Start-up Time and Recovery Time
        7. 8.2.2.7 Supplying Auxiliary Current, IAUX From VDDM
        8. 8.2.2.8 VDDM Ripple Voltage
      3. 8.2.3 Application Curves
      4. 8.2.4 Insulation Lifetime
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

8.2.2.8 VDDM Ripple Voltage

Note that when supplying power from VDDM, that is when IAUX > 0mA, additional voltage ripple is present on the VDDM rail. For a given RPXFR setting, this ripple can be reduced by applying additional capacitance from VDDM to VSSS. For this design example, the ripple on VDDM, VDDMripple, computed in the calculator tool is 190mV.

It is possible to reduce the VDDMripple with the addition of capacitance while still maintaining the original VDDHdroop = 0.5V. For example, applying CDIV1 = 330nF and CDIV2 = 680nF in the calculator tool, reduces VDDMripple to 131mV, while still maintaining VDDHdroop < 0.5V. Of course, this additional capacitance leads to increased tSTART times.